UPG2009TB

neC's L, s-BanD HigH power upg2009tB spDt switCH Features • • • • Low insertion Loss: 0.25 dB TYP. @ Vcont1/2 = 2.8 V/0 V, f = 1.0 GHz 0.30 dB TYP. @ Vcont1/2 = 2.8 V/0 V, f = 2.0 GHz HigH isoLation: 28 dB TYP. @ Vcont1/2 = 2.8 V/0 V, f = 2.0 GHz power HanDLing: Pin (0.1dB) = 34 dBm TYP. @ Vcont1/2 = 2.8 V/0 V, f = 1.0 GHz BiDireCtionaL, sYMMetriCaL DesCription NEC's UPG2009TB is a L, S-band SPDT (Single Pole Double Throw) GaAs FET switch for digital cellular or cordless telephone application. The device can operate from 500 MHz to 2.5 GHz, with low insertion loss and high isolation. • 6-pin super MiniMoLD paCkage (2.0 × 1.25 × 0.9 mm) appLiCations • L-band digital cellular or cordless telephone • BluetoothtM , w-Lan and wLL • short range wireless orDering inForMation part number UPG2009TB-E3-A package 6-pin super minimold Marking G2U supplying Form • Embossed tape 8 mm wide • Pin 1, 2, 3 face the perforation side of the tape • Qty 3 kpcs/reel remark To order evaluation samples, contact your nearby sales office. Part number for sample order: UPG2009TB-A Caution observe precautions when handling because these devices are sensitive to electrostatic discharge. California Eastern Laboratories upg2009tB pin ConneCtions (Top View) (Bottom View) 4 5 6 4 5 6 3 2 1 pin no. 1 2 3 4 5 6 pin name OUT1 GND OUT2 VCont2 IN VCont1 2 1 aBsoLute MaXiMuM ratings (TA = 25°C, unless otherwise specified) parameter Control Voltage 1, 2 Input Power Total Power Dissipation Operating Ambient Temperature Storage Temperature symbol Vcont1, 2 Pin Ptot TA Tstg ratings −6.0 to +6.0 note1 +36 0.15 −45 to +85 −55 to +150 unit V dBm W °C °C note | Vcont1 - Vcont2 | ≤ 6.0 V reCoMMenDeD operating range (TA = 25°C) parameter Control Voltage (High) Control Voltage (Low) symbol Vcont (H) Vcont (L) Min. +2.7 −0.2 tYp. +2.8 0 MaX. +3.0 +0.2 unit V V G2U 3 upg2009tB eLeCtriCaL CHaraCteristiCs parameter Insertion Loss symbol LINS (TA = +25°C, Vcont1 = 2.8 V, Vcont2 = 0 V or Vcont1 = 0 V, Vcont2 = 2.8, Zo = 50 Ω, off chip DC blocking capacitors value; 56 pF, unless otherwise specified) test Conditions f = 0.5 to 1.0 GHz f = 2.0 GHz f = 2.5 GHz Isolation Input Return Loss Output Return Loss Input Power at 0.1 dB Compression Point note 2nd Harmonics 3rd Harmonics Switching Speed Control Current 2f0 3f0 tSW Icont Vcont = 2.8 V/0 V, RF Non ISL RLin RLout Pin(0.1 dB) f = 0.5 to 2.0 GHz f = 2.5 GHz f = 0.5 to 2.5 GHz f = 0.5 to 2.5 GHz f = 1.0 GHz, Vcont = 2.8 V/0 V f = 1.0 GHz, Vcont = 2.8 V/0 V, Pin = 30.5 dBm f = 1.0 GHz, Vcont = 2.8 V/0 V, Pin = 30.5 dBm − − 150 1 − 50 ns μA 65 75 − dBc 65 75 − dBc Min. − − − 24 − 15 15 32.5 tYp. 0.25 0.30 0.40 28 25 20 20 34 MaX. 0.45 0.50 − − − − − − unit dB dB dB dB dB dB dB dBm note Pin (0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of linear range. All other characteristics are measured in linear range. Caution it is necessary to use DC blocking capacitors with the device. the value of DC blocking capacitors should be chosen to accommodate the frequency of operation, bandwidth, switching speed and the condition with actual board of your system. the range of recommended DC blocking capacitor value is less than 100 pF. eVaLuation CirCuit (Vcont1 = 2.8 V, Vcont2 = 0 V or Vcont2 = 0 V, Vcont1 = 2.8 V, off chip DC blocking capacitors value C1 = 56 pF, C2 = 1 000 pF (Bypass), using NEC standard evaluation board) C2 Vcont1 6 1 C1 OUT1 G2U IN C1 Vcont2 C2 5 2 4 3 C1 OUT2 eVaLuation BoarD Vcont1 6pin SMM SPDT SW OUT1 C2 C1 G2U IN C1 C1 C2 OUT2 NEC Vcont2 trutH taBLe Vcont1 Low High Vcont2 High Low IN−OUT1 OFF ON IN−OUT2 ON OFF tYpiCaL CHaraCteristiCs (TA = +25°C Vcont1/2 = 2.8 V/0 V, Pin = 0 dBm, OUT2 side is 50 Ω termination) INPUT RETURN LOSS vs. FREQUENCY CH1 S11 log MAG 10 dB/ REF 0 dB 1: -25.43 dB 1.0 GHz 2: -30.339 dB 1.5 GHz 3: -30.025 dB 2.0 GHz 4: -23.812 dB 2.5 GHz 5: -17.85 dB 3.0 GHz CH1 S21 ISOLATION vs. FEQUENCY log MAG 10 dB/ REF 0 dB 1: -28.787 dB 1.0 GHz 2: -28.871 dB 1.5 GHz 3: -27.75 dB 2.0 GHz 4: -24.902 dB 2.5 GHz 5: -21.582 dB 3.0 GHz Input Return Loss RLin (dB) Isolation ISL (dB) 0 -20 -40 1 2 START 0.500 000 000 GHz 0 -20 -40 1 2 START 0.500 000 000 GHz 3 4 5 3 4 5 STOP 3.000 000 000 GHz STOP 3.000 000 000 GHz Frequency f (GHz) Frequency f (GHz) INSERTION LOSS vs. FREQUENCY CH1 S21 log MAG 1 dB/ REF 0 dB 1: -0.620 dB 1.0 GHz 2: -0.744 dB 1.5 GHz 3: -0.881 dB 2.0 GHz 4: -1.057 dB 2.5 GHz 5: -1.302 dB 3.0 GHz OUTPUT RETERN LOSS vs. FREQUENCY CH1 S22 log MAG 10 dB/ REF 0 dB 1: -25.992 dB 1.0 GHz 2: -31.882 dB 1.5 GHz 3: -32.46 dB 2.0 GHz 4: -25.087 dB 2.5 GHz 5: -18.145 dB 3.0 GHz 0 1 2 3 Output Return Loss RLout (dB) Insertion Loss LINS (dB) 0 -20 -40 1 2 START 0.500 000 000 GHz -2.0 -4.0 4 5 3 4 5 START 0.500 000 000 GHz STOP 3.000 000 000 GHz STOP 3.000 000 000 GHz Frequency f (GHz) Caution these characteristics values include the losses of the neC evaluation board. Frequency f (GHz) remark The graphs indicate nominal characteristics. upg2009tB tYpiCaL CHaraCteristiCs (f = 2 GHz, OUT2 side is 50 Ω termination) RELATION BETWEEN CONTROL VOLTAGE OF INSERSION LOSS 0 0.1 Insersion Loss LINS (dB) 0.2 0.3 0.4 0.5 0.6 Vcont = 2.4 V Vcont = 2.8 V Vcont = 3.2 V 0.9 25 26 27 28 29 30 31 32 33 34 35 36 37 0.8 Input Power Pin (dBm) 0.7 RELATION BETWEEN CONTROL VOLTAGE OF 2nd HARMONICS 0 10 2nd Harmonics 2f0 (dBc) 20 30 40 50 60 70 80 90 25 26 27 28 29 30 31 32 33 34 35 36 37 Input Power Pin (dBm) Vcont = 2.4 V Vcont = 2.8 V Vcont = 3.2 V 0 10 3rd Harmonics 3f0 (dBc) 20 30 40 50 60 70 80 RELATION BETWEEN CONTROL VOLTAGE OF 3rd HARMONICS Vcont = 2.4 V Vcont = 2.8 V Vcont = 3.2 V 90 25 26 27 28 29 30 31 32 33 34 35 36 37 Input Power Pin (dBm) remark The graphs indicate nominal characteristics. upg2009tB paCkage DiMensions 6-PIN SUPER MINIMOLD (UNIT: mm) 2.1±0.1 1.25±0.1 2.0±0.2 1.3 0.65 0.65 0.1 MIN. 0.9±0.1 0.7 0 to 0.1 0.15+0.15 -0.0 0.2+0.15 -0.0 upg2009tB reCoMMenDeD soLDering ConDitions This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. soldering Method Infrared Reflow soldering Conditions Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220°C or higher Preheating time at 120 to 180°C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Peak temperature (package surface temperature) Time at temperature of 200°C or higher Preheating time at 120 to 150°C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) : 260°C or below : 10 seconds or less : 60 seconds or less : 120±30 seconds : 3 times : 0.2%(Wt.) or below : 215°C or below : 25 to 40 seconds : 30 to 60 seconds : 3 times : 0.2%(Wt.) or below Condition symbol IR260 VPS VP215 Wave Soldering Peak temperature (molten solder temperature) : 260°C or below Time at peak temperature : 10 seconds or less Preheating temperature (package surface temperature) : 120°C or below Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (pin temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 350°C or below : 3 seconds or less : 0.2%(Wt.) or below WS260 Partial Heating HS350 Caution Do not use different soldering methods together (except for partial heating). 02/14/2007 4590 Patrick Henry Drive Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279 Subject: Compliance with EU Directives CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. 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