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UPG2010TB

UPG2010TB

  • 厂商:

    CEL

  • 封装:

  • 描述:

    UPG2010TB - HIGH POWER SINGLE CONTROL L-BAND SPDT SWITCH - California Eastern Labs

  • 数据手册
  • 价格&库存
UPG2010TB 数据手册
NEC's HIGH POWER SINGLE CONTROL UPG2010TB L-BAND SPDT SWITCH FEATURES • SUPPLY VOLTAGE: VDD = 2.7 to 3.0 V (2.8 V TYP.) • SWITCH CONTROL VOLTAGE: Vcont (H) = 2.7 to 3.0 V (2.8 V TYP.) Vcont (L) = −0.2 to +0.2 V (0 V TYP.) • LOW INSERTION LOSS: LINS1 = 0.25 dB TYP. @ f = 0.5 to 1.0 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V LINS2 = 0.30 dB TYP. @ f = 2.0 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V LINS3 = 0.35 dB TYP. @ f = 2.5 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V (Reference value) • HIGH ISOLATION: ISL1 = = 28 dB TYP. @ f = 0.5 to 2.0 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V ISL2 = 25 dB TYP. @ f = 2.5 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V (Reference value) • POWER HANDLING: Pin (0.1 dB) = +33.0 dBm TYP. @ f = 1.0 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V • HIGH-DENSITY SURFACE MOUNTING: 6-pin super minimold package (2.0 × 1.25 × 0.9 mm) DESCRIPTION NEC's UPG2010TB is a single control GaAs MMIC L-band SPDT (Single Pole Double Throw) switch for mobile phone and L-band applications. This device can operate from 0.5 to 2.5 GHz, with low insertion loss and high isolation. This device is housed in a 6-pin super minimold package, suitable for high-density surface mounting. APPLICATIONS • L-band digital cellular or cordless handsets • PCS, W-LAN, WLL and BluetoothTM • Short Range Wireless ORDERING INFORMATION Part Number μPG2010TB-E3-A Package 6-pin super minimold Marking G2Y Supplying Form • Embossed tape 8 mm wide • Pin 1, 2, 3 face the perforation side of the tape • Qty 3 kpcs/reel Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: UPG2010TB Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. California Eastern Laboratories UPG2010TB PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) 3 2 1 43 52 61 (Top View) 44 55 66 (Bottom View) 3 2 1 Pin No. 1 2 3 4 5 6 Pin Name OUTPUT1 GND OUTPUT2 VCont INPUT VDD TRUTH TABLE Vcont1 Low High INPUT−OUTPUT1 ON OFF INPUT−OUTPUT2 OFF ON ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified) Parameter Supply Voltage Switch Control Voltage Input Power Power Dissipation Operating Ambient Temperature Storage Temperature Symbol VDD Vcont Pin PD TA Tstg Ratings 6.0 6.0 +36 150 Note −45 to +85 −55 to +150 Unit V V dBm mW °C °C Note Mounted on double-sided copper-clad 50 × 50 × 1.6 mm epoxy glass PWB, TA = +85°C RECOMMENDED OPERATING RANGE (TA = 25°C, unless otherwise specified) Parameter Switch Voltage Switch Control Voltage (H) Switch Control Voltage (L) Symbol VDD Vcont (H) Vcont (L) MIN. 2.7 2.7 −0.2 TYP. 2.8 2.8 0 MAX. 3.0 3.0 0.2 Unit V V V G2Y UPG2010TB ELECTRICAL CHARACTERISTICS Parameter Insertion Loss 1 Insertion Loss 2 Isolation 1 Input Return Loss Output Return Loss 0.1 dB Gain Compression Input Power Note 2nd Harmonics 3rd Harmonics Supply Current Switch Control Current Symbol LINS1 LINS2 ISL1 RLin RLout Pin (0.1 dB) 2f0 3f0 IDD Icont (TA = +25°C, VDD = 2.8 V, Vcont = 2.8 V/0 V, DC blocking capacitors = 56 pF, unless otherwise specified) Test Conditions f = 0.5 to 1.0 GHz f = 2.0 GHz f = 0.5 to 2.0 GHz f = 0.5 to 2.5 GHz f = 0.5 to 2.5 GHz f = 1.0 GHz f = 1.0 GHz, Pin = +30.5 dBm f = 1.0 GHz, Pin = +30.5 dBm MIN. − − 24 15 15 +31.5 65 65 − − TYP. 0.25 0.30 28 20 20 +33.0 75 75 50 4 MAX. 0.45 0.50 − − − − − − 100 20 Unit dB dB dB dB dB dBm dBc dBc μA μA Note Pin (0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of linear range. STANDARD CHARACTERISTICS FOR REFERENCE Parameter Insertion Loss 3 Isolation 2 Switch Control Speed Symbol LINS3 ISL2 tSW Test Conditions f = 2.5 GHz f = 2.5 GHz (TA = +25°C, VDD = 2.8 V, Vcont = 2.8 V/0 V, DC blocking capacitors = 51 pF, unless otherwise specified) MIN. − − − TYP. 0.35 25 1 MAX. − − − Unit dB dB μs Caution It is necessary to use DC blocking capacitors with the device. The value of DC blocking capacitors should be chosen to accommodate the frequency of operation, bandwidth, switching speed and the condition with actual board of your system. The range of recommended DC blocking capacitor value is less than 100 pF. UPG2010TB EVALUATION CIRCUIT (VDD = 2.8 V, Vcont = 2.8 V/0 V, DC blocking capacitors = 56 pF) OUTPUT1 OUTPUT2 56 pF 56 pF 1 2 3 6 5 4 1 000 pF 56 pF 1 000 pF VDD INPUT Vcont The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. 4-277 UPG2010TB ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD VDD 6Pin SMM SPDT SW VC 1 OUTPUT1 OUT 1 C2 C 5 C 1 C1 G2Y INPUT C1 IN C3 C1 C C 4 2 C2 OUT 2 OUTPUT2 VC 2 Vcont USING THE NEC EVALUATION BOARD Symbol C1, C2, C3 C4, C5 Values 56 pF 1 000 pF UPG2010TB TYPICAL CHARACTERISTICS (TA = 25ºC, VDD = 2.8 V, Vcont = 2.8 V/0 V, DC blocking capacitors = 56 pF, unless otherwise specified) INPUT–OUTPUT1 INSERTION LOSS vs. FREQUENCY 0.4 0.3 Insertion Loss LINS (dB) 0.1 0 –0.1 –0.2 –0.3 –0.4 –0.5 –0.6 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) Insertion Loss LINS (dB) 0.2 0.4 0.3 0.2 0.1 0 –0.1 –0.2 –0.3 –0.4 –0.5 INPUT–OUTPUT2 INSERTION LOSS vs. FREQUENCY –0.6 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) INPUT–OUTPUT1 ISOLATION vs. FREQUENCY 50 40 30 10 0 –10 –20 –30 –40 –50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) Isolation ISL (dB) Isolation ISL (dB) 20 50 40 30 20 10 0 –10 –20 –30 –40 INPUT–OUTPUT2 ISOLATION vs. FREQUENCY –50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) INPUT–OUTPUT1 INPUT RETURN LOSS vs. FREQUENCY 50 40 30 20 10 0 –10 –20 –30 –40 –50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) Input Return Loss RLin (dB) Input Return Loss RLin (dB) INPUT–OUTPUT2 INPUT RETURN LOSS vs. FREQUENCY 50 40 30 20 10 0 –10 –20 –30 –40 –50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) Remark The graphs indicate nominal characteristics. UPG2010TB INPUT–OUTPUT1 OUTPUT RETURN LOSS vs. FREQUENCY 50 Output Return Loss RLout (dB) 30 20 10 0 –10 –20 –30 –40 –50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) Output Return Loss RLout (dB) 40 INPUT–OUTPUT2 OUTPUT RETURN LOSS vs. FREQUENCY 50 40 30 20 10 0 –10 –20 –30 –40 –50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) +45 +40 Output Power Pout (dBm) +35 +30 +25 +20 +15 +10 +5 +10 2nd Harmonics 2f0, 3rd Harmonics 3f0 (dBc) OUTPUT POWER vs. INPUT POWER f = 1.0 GHz 2ND HARMONICS, 3RD HARMONICS vs. INPUT POWER –50 –55 –60 –65 –70 –75 –80 –85 –90 +10 +15 +20 +25 2f0 3f0 +30 +35 +40 f = 1.0 GHz +15 +20 +25 +30 +35 +40 Input Power Pin (dBm) Input Power Pin (dBm) Remark The graphs indicate nominal characteristics. UPG2010TB PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm) 2.1±0.1 1.25±0.1 2.0±0.2 1.3 0.65 0.65 0.1 MIN. 0.9±0.1 0.7 0 to 0.1 0.15+0.1 –0.05 0.2+0.1 –0.05 UPG2010TB RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Soldering Conditions Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220°C or higher Preheating time at 120 to 180°C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Peak temperature (package surface temperature) Time at temperature of 200°C or higher Preheating time at 120 to 150°C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Peak temperature (molten solder temperature) Time at peak temperature Preheating temperature (package surface temperature) Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) Partial Heating Peak temperature (pin temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 260°C or below : 10 seconds or less : 60 seconds or less : 120±30 seconds : 3 times : 0.2%(Wt.) or below : 215°C or below : 25 to 40 seconds : 30 to 60 seconds : 3 times : 0.2%(Wt.) or below : 260°C or below : 10 seconds or less : 120°C or below : 1 time : 0.2%(Wt.) or below : 350°C or below : 3 seconds or less : 0.2%(Wt.) or below HS350 Condition Symbol IR260 VPS VP215 Wave Soldering WS260 Caution Do not use different soldering methods together (except for partial heating). Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale. 02/19/2004 A Business Partner of NEC Compound Semiconductor Devices, Ltd. 4590 Patrick Henry Drive Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279 Subject: Compliance with EU Directives CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. This status is based on CEL’s understanding of the EU Directives and knowledge of the materials that go into its products as of the date of disclosure of this information. Restricted Substance per RoHS Lead (Pb) Mercury Cadmium Hexavalent Chromium PBB PBDE Concentration Limit per RoHS (values are not yet fixed) < 1000 PPM < 1000 PPM < 100 PPM < 1000 PPM < 1000 PPM < 1000 PPM Concentration contained in CEL devices -A Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected -AZ (*) If you should have any additional questions regarding our devices and compliance to environmental standards, please do not hesitate to contact your local representative. Important Information and Disclaimer: Information provided by CEL on its website or in other communications concerting the substance content of its products represents knowledge and belief as of the date that it is provided. CEL bases its knowledge and belief on information provided by third parties and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. CEL has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. CEL and CEL suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall CEL’s liability arising out of such information exceed the total purchase price of the CEL part(s) at issue sold by CEL to customer on an annual basis. See CEL Terms and Conditions for additional clarification of warranties and liability.
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