UPG2015TB-E3-A

NEC's 1W SINGLE CONTROL UPG2015TB L, S-BAND SPDT SWITCH FEATURES • SUPPLY VOLTAGE: VDD = 2.7 to 3.0 V (2.8 V TYP.) • SINGLE SWITCH CONTROL VOLTAGE: Vcont (H) = 2.7 to 3.0 V (2.8 V TYP.) Vcont (L) = −0.2 to +0.2 V (0 V TYP.) • LOW INSERTION LOSS: LINS1 = 0.25 dB TYP. @ f = 0.5 to 1.0 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V LINS2 = 0.30 dB TYP. @ f = 1.0 to 2.0 GHz,VDD = 2.8 V, Vcont = 2.8 V/0 V LINS3 = 0.35 dB TYP. @ f = 2.5 GHz,VDD = 2.8 V, Vcont = 2.8 V/0 V • HIGH ISOLATION: ISL1 = 27 dB TYP. @ f = 0.5 to 2.0 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V ISL2 = 24 dB TYP. @ f =2.5 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V • POWER HANDLING: Pin (0.1 dB) = +27.0 dBm TYP. @ f = 2.5 GHz, VDD = 2.8 V, Vcont = 2.8 V/0 V • HIGH-DENSITY SURFACE MOUNTING: 6-pin super minimold package (2.0 × 1.25 × 0.9 mm) DESCRIPTION NEC's UPG2015TB is a single control single control GaAs MMIC L, S-band SPDT (Single Pole Double Throw) switch for mobile phone and L, S-band applications. This device can operate frequency from 0.5 to 2.5 GHz, with low insertion loss and high isolation. This device is housed in a 6-pin super minimold package, suitable for high-density surface mounting. APPLICATIONS • L, S-band digital cellular or cordless handsets • PCS, W-LAN, WLL and BluetoothTM • Short Range Wireless ORDERING INFORMATION Part Number UPG2015TB-E3-A Package 6-pin super minimold Marking G3J Supplying Form • Embossed tape 8 mm wide • Pin 1, 2, 3 face the perforation side of the tape • Qty 3 kpcs/reel Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: UPG2015TB Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. California Eastern Laboratories UPG2015TB PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) 3 2 1 43 52 61 (Top View) 44 55 66 (Bottom View) 3 2 1 Pin No. 1 2 3 4 5 6 Pin Name OUTPUT1 GND OUTPUT2 VCont INPUT VDD TRUTH TABLE Vcont Low High INPUT−OUTPUT1 OFF ON INPUT−OUTPUT2 ON OFF ABSOLUTE MAXIMUM RATINGS (TA = 25°C, unless otherwise specified) Parameter Supply Voltage Switch Control Voltage Input Power Operating Ambient Temperature Storage Temperature Symbol VDD Vcont Pin TA Tstg Ratings +6.0 +6.0 +33 −45 to +85 −55 to +150 Unit V V dBm °C °C RECOMMENDED OPERATING RANGE (TA = 25°C, unless otherwise specified) Parameter Supply Voltage Switch Control Voltage (H) Switch Control Voltage (L) Symbol VDD Vcont (H) Vcont (L) MIN. 2.7 2.7 −0.2 TYP. 2.8 2.8 0 MAX. 3.0 3.0 0.2 Unit V V V G3J UPG2015TB ELECTRICAL CHARACTERISTICS Parameter Insertion Loss 1 Insertion Loss 2 Insertion Loss 3 Isolation 1 Isolation 2 Input Return Loss Output Return Loss 0.1 dB Gain Compression Input Power Note Supply Current Switch Control Current Switch Control Speed IDD Icont tSW Symbol LINS1 LINS2 LINS3 ISL1 ISL2 RLin RLout (TA = +25°C, VDD = 2.8 V, Vcont = 2.8 V/0 V, DC blocking capacitors = 56 pF, unless otherwise specified) Test Conditions f = 0.5 to 1.0 GHz f = 1.0 to 2.0 GHz f = 2.5 GHz f = 0.5 to 2.0 GHz f = 2.5 GHz f = 0.5 to 2.5 GHz f = 0.5 to 2.5 GHz f = 2.5 GHz MIN. − − − 23 20 15 15 +25.5 +25.5 − − − TYP. 0.25 0.30 0.35 27 24 20 20 +27.0 +27.0 50 4 0.3 MAX. 0.45 0.50 0.55 − − − − − − 100 20 2.0 Unit dB dB dB dB dB dB dB dBm dBm μA μA μs Pin (0.1 dB) f = 2.0 GHz Note Pin (0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of linear range. STANDARD CHARACTERISTICS FOR REFERENCE Parameter 1 dB Gain Compression Input Power Note Symbol Pin (1 dB) Test Conditions f = 2.0 GHz (TA = +25°C, VDD = 2.8 V, Vcont = 2.8 V/0 V, DC blocking capacitors = 56 pF, unless otherwise specified) MIN. − TYP. +30.0 MAX. − Unit dBm Note Pin (1 dB) is the measured input power level when the insertion loss increases 1 dB more than that of linear range. Caution It is necessary to use DC blocking capacitors with the device. The value of DC blocking capacitors should be chosen to accommodate the frequency of operation, bandwidth, switching speed and the condition with actual board of your system. The range of recommended DC blocking capacitor value is less than 100 pF. UPG2015TB EVALUATION CIRCUIT (VDD = 2.8 V, Vcont = 2.8 V/0 V, DC blocking capacitors = 56 pF) OUTPUT1 OUTPUT2 56 pF 56 pF 1 2 3 6 5 4 1 000 pF 56 pF 1 000 pF VDD INPUT Vcont The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. 4-277 UPG2015TB ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD VDD 6pin SMM SPDT SW Vc1 OUTPUT1 OUT 1 C 2 C2 C 4 C1 G3J INPUT IN C3 C1 C 5 C C1 1 C2 OUT 2 OUTPUT2 Vc2 Vcont USING THE NEC EVALUATION BOARD Symbol C1, C2, C3 C4, C5 Values 56 pF 1 000 pF UPG2015TB TYPICAL CHARACTERISTICS (TA = 25ºC, VDD = 2.8 V, Vcont = 2.8 V/0 V, DC blocking capacitors = 56 pF, unless otherwise specified) INPUT–OUTPUT1 INSERSION LOSS vs. FREQUENCY 0.5 0 Insersion Loss LINS (dB) –0.5 –1.0 –1.5 –2.0 –2.5 –3.0 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) Insersion Loss LINS (dB) 0.5 0 –0.5 –1.0 –1.5 –2.0 –2.5 INPUT–OUTPUT2 INSERSION LOSS vs. FREQUENCY –3.0 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) INPUT–OUTPUT1 ISOLATION vs. FREQUENCY 20 10 Isolation ISL (dB) Isolation ISL (dB) 0 –10 –20 –30 –40 –50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) 20 10 0 –10 –20 –30 –40 INPUT–OUTPUT2 ISOLATION vs. FREQUENCY –50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) INPUT–OUTPUT1 INPUT RETURN LOSS vs. FREQUENCY 20 Input Return Loss RLin (dB) Input Return Loss RLin (dB) Frequency f (GHz) 10 0 –10 –20 –30 –40 –50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 INPUT–OUTPUT2 INPUT RETURN LOSS vs. FREQUENCY 20 10 0 –10 –20 –30 –40 –50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) Remark The graphs indicate nominal characteristics. UPG2015TB INPUT–OUTPUT1 OUTPUT RETURN LOSS vs. FREQUENCY 20 Output Return Loss RLout (dB) Frequency f (GHz) Output Return Loss RLout (dB) 10 0 –10 –20 –30 –40 –50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 INPUT–OUTPUT2 OUTPUT RETURN LOSS vs. FREQUENCY 20 10 0 –10 –20 –30 –40 –50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) OUTPUT POWER vs. INPUT POWER 32 f = 1.0 GHz 30 28 26 24 22 20 18 16 14 12 10 8 10 12 14 16 18 20 22 24 26 28 30 32 34 Input Power Pin (dBm) 30 28 Output Power Pout (dBm) 26 24 22 20 18 16 14 12 OUTPUT POWER vs. INPUT POWER f = 2.5 GHz Output Power Pout (dBm) 10 8 10 12 14 16 18 20 22 24 26 28 30 32 Input Power Pin (dBm) Remark The graphs indicate nominal characteristics. UPG2015TB PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm) 2.1±0.1 1.25±0.1 2.0±0.2 1.3 0.65 0.65 0.1 MIN. 0.9±0.1 0.7 0 to 0.1 0.15+0.15 -0.0 0.2+0.15 -0.0 UPG2015TB RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Soldering Conditions Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220°C or higher Preheating time at 120 to 180°C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Peak temperature (package surface temperature) Time at temperature of 200°C or higher Preheating time at 120 to 150°C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Peak temperature (molten solder temperature) Time at peak temperature Preheating temperature (package surface temperature) Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) Partial Heating Peak temperature (pin temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 260°C or below : 10 seconds or less : 60 seconds or less : 120±30 seconds : 3 times : 0.2%(Wt.) or below : 215°C or below : 25 to 40 seconds : 30 to 60 seconds : 3 times : 0.2%(Wt.) or below : 260°C or below : 10 seconds or less : 120°C or below : 1 time : 0.2%(Wt.) or below : 350°C or below : 3 seconds or less : 0.2%(Wt.) or below HS350 Condition Symbol IR260 VPS VP215 Wave Soldering WS260 Caution Do not use different soldering methods together (except for partial heating). 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