UPG2030TK-E2-A

DATA SHEET NEC's 1 W UPG2030TK ULTRA SMALL SPDT SWITCH FEATURES • SWITCH CONTROL VOLTAGE: Vcont (H) = 2.7 to 3.0 V (2.8 V TYP.) Vcont (L) = −0.2 to +0.2 V (0 V TYP.) • LOW INSERTION LOSS: 0.25 dB TYP. @ 0.5 to 1.0 GHz 0.30 dB TYP. @ 1.0 to 2.0 GHz 0.35 dB TYP. @ 2.0 to 2.5 GHz • HIGH ISOLATION: 27 dB TYP. @ 0.5 to 2.0 GHz 24 dB TYP. @ 2.0 to 2.5 GHz • POWER HANDLING: Pin (0.1 dB) = +27.0 dBm TYP. @ 2.0 GHz, Vcont = 2.8 V/0 V Pin (1 dB) = +30.0 dBm TYP. @ 2.0 GHz, Vcont = 2.8 V/0 V (Reference value) • HIGH-DENSITY SURFACE MOUNTING: 6-pin minimold package (1.5 × 1.1 × 0.55 mm) • PB-FREE DESCRIPTION NEC's UPG2030TK is a GaAs MMIC L, S-band SPDT (Single Pole Double Throw) switch for mobile phone and L, S-band applications. This device has low insertion loss and high isolation, and can operate from 0.5 to 3 GHz at 2.7 to 3.0 V. This device is housed in a 6-pin low profile, Pb-Free minimold package and this package is also suitable for high-density surface mounting. APPLICATIONS • CELLULAR AND CORDLESS HANDSETS • PCS, BLUETOOTH™, WLAN, AND WLL • SHORT RANGE WIRELESS ORDERING INFORMATION PART NUMBER UPG2030TK-E2-A PACKAGE 6-pin lead-less minimold (1511) MARKING G3R SUPPLYING FORM • Embossed tape 8 mm wide • Pin 1, 6 face the perforation side of the tape • Qty 5 kpcs/reel Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: UPG2030TK-A California Eastern Laboratories UPG2030TK PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) 1 2 3 6 5 4 1 2 3 (Top View) 6 5 4 6 5 4 (Bottom View) 1 2 3 PIN NO. 1 2 3 4 5 6 PIN NAME OUTPUT1 GND OUTPUT2 Vcont2 INPUT Vcont1 TRUTH TABLE VCONT1 Low High VCONT2 High Low INPUT−OUTPUT1 ON OFF INPUT−OUTPUT2 OFF ON ABSOLUTE MAXIMUM RATINGS (TA =+25ºC, unless otherwise specified) PARAMETER Switch Control Voltage Input Power Operating Ambient Temperature Storage Temperature SYMBOL Vcont Pin TA Tstg RATINGS 6.0 +33 −45 to +85 −55 to +150 UNIT V dBm °C °C RECOMMENDED OPERATING RANGE (TA =+25ºC, unless otherwise specified) PARAMETER Switch Control Voltage (H) Switch Control Voltage (L) SYMBOL Vcont (H) Vcont (L) MIN. 2.7 −0.2 TYP. 2.8 0 MAX. 3.0 0.2 UNIT V V G3R UPG2030TK ELECTRICAL CHARACTERISTICS (TA = +25°C, Vcont = 2.8V/0 V , DC blocking capacotors = 56 pF, unless otherwise specified) PARAMETER Insertion Loss 1 Insertion Loss 2 Insertion Loss 3 Isolation 1 Isolation 2 Input Return Loss Output Return Loss 0.1 dB Gain Compression Input Power Note Switch Control Current Switch Control Speed SYMBOL LINS1 LINS2 LINS3 ISL1 ISL2 RLin RLout Pin (0.1 dB) Icont tSW TEST CONDITIONS f = 0.5 to 1.0 GHz f = 1.0 to 2.0 GHz f = 2.0 to 2.5 GHz f = 0.5 to 2.0 GHz f = 2.0 to 2.5 GHz f = 0.5 to 2.5 GHz f = 0.5 to 2.5 GHz f = 2.0 GHz f = 2.5 GHz No signal MIN. − − − 23 20 15 15 +25.5 +25.5 − − TYP. 0.25 0.30 0.35 27 24 20 20 +27.0 +27.0 4 50 MAX. 0.45 0.50 0.55 − − − − − − 20 500 UNIT dB dB dB dB dB dB dB dBm dBm μA ns Notes Pin (0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of linear range. STANDARD CHARACTERISTICS FOR REFERENCE (TA = +25°C, Vcont = 2.8 V/0 V, DC blocking capacitors = 56 pF, unless otherwise specified) PARAMETER 1 dB Gain Compression Input Power Note SYMBOL Pin (1 dB) TEST CONDITIONS f = 2.0 GHz MIN. − TYP. +30.0 MAX. − UNIT dBm Notes Pin (1 dB) is the measured input power level when the insertion loss increases 1 dB more than that of linear range. Caution It is necessary to use DC blocking capacitors with this device. The value of DC blocking capacitors should be chosen to accommodate the frequency of operation, bandwidth, switching speed and the condition with the actual board of your system. The range of recommended DC blocking capacitor value is less than 100 pF for frequencies above 0.5 GHz, and 1,000 pF for frequencies below 0.5 GHz. UPG2030TK EVALUATION CIRCUIT (Vcont = 2.8 V/0 V, DC blocking capacitors = 56 pF) Vcont1 INPUT Vcont2 56 pF 1000 pF 6 5 4 1000 pF 1 56 pF 2 3 56 pF OUTPUT1 OUTPUT2 The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. UPG2030TK ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD Vcont2 6pin L2MM SPDT SW Vc1 OUTPUT2 OUT 1 C 2 C2 C 4 C1 INPUT IN C3 C1 C 5 G3R C C1 1 C2 OUT 2 OUTPUT1 Vc2 Vcont1 USING THE NEC EVALUATION BOARD SYMBOL C1, C2, C3 C4, C5 VALUES 56 pF 1000 pF UPG2030TK TYPICAL CHARACTERISTICS (TA = +25°C, Vcont = 2.8 V/0 V, DC blocking capacitors = 56 pF, unless otherwise specified) INPUT-OUTPUT1 INSERSION LOSS vs. FREQUENCY 0.5 0.4 Insersion Loss LINS (dB) 0.2 0.1 0 -0.1 -0.2 -0.3 -0.4 -0.5 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) Insersion Loss LINS (dB) 0.3 0.5 0.4 0.3 0.2 0.1 0 -0.1 -0.2 -0.3 -0.4 -0.5 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) INPUT-OUTPUT2 INSERSION LOSS vs. FREQUENCY INPUT-OUTPUT1 ISOLATION vs. FREQUENCY 50 40 30 Isolation ISL (dB) 10 0 -10 -20 -30 -40 -50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) Isolation ISL (dB) 20 50 40 30 20 10 0 -10 -20 -30 -40 INPUT-OUTPUT2 ISOLATION vs. FREQUENCY -50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) INPUT-OUTPUT1 INPUT RETURN LOSS vs. FREQUENCY 50 40 Input Return Loss RLin (dB) 30 20 10 0 -10 -20 -30 -40 -50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) Input Return Loss RLin (dB) 50 40 30 20 10 0 -10 -20 -30 -40 INPUT-OUTPUT2 INPUT RETURN LOSS vs. FREQUENCY -50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) Remark The graphs indicate nominal characteristics. UPG2030TK TYPICAL CHARACTERISTICS (TA = +25°C, Vcont = 2.8 V/0 V, DC blocking capacitors = 56 pF, unless otherwise specified) INPUT-OUTPUT1 OUTPUT RETURN LOSS vs. FREQUENCY 50 Output Return Loss RLout (dB) 30 20 10 0 -10 -20 -30 -40 -50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) Output Return Loss RLout (dB) 40 INPUT-OUTPUT2 OUTPUT RETURN LOSS vs. FREQUENCY 50 40 30 20 10 0 -10 -20 -30 -40 -50 0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5 Frequency f (GHz) OUTPUT POWER vs. INPUT POWER 40 35 Output Power Pout (dBm) 30 25 20 15 10 5 0 10 15 20 25 30 35 40 f = 1.0 GHz Output Power Pout (dBm) 40 35 30 25 20 15 10 5 0 10 OUTPUT POWER vs. INPUT POWER f = 2.5 GHz 15 20 25 30 35 40 Input Power Pin (dBm) Input Power Pin (dBm) Remark The graphs indicate nominal characteristics. UPG2030TK PACKAGE DIMENSIONS 6-PIN LEAD-LESS MINIMOLD (1511) (UNIT:mm) Remark ( ) : Reference value 0.48±0.05 0.48±0.05 UPG2030TK RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Soldering Conditions Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220°C or higher Preheating time at 120 to 180°C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Peak temperature (package surface temperature) Time at temperature of 200°C or higher Preheating time at 120 to 150°C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Peak temperature (molten solder temperature) Time at peak temperature Preheating temperature (package surface temperature) Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) Peak temperature (pin temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 260°C or below : 10 seconds or less : 60 seconds or less : 120±30 seconds : 3 times : 0.2%(Wt.) or below : 215°C or below : 25 to 40 seconds : 30 to 60 seconds : 3 times : 0.2%(Wt.) or below : 260°C or below : 10 seconds or less : 120°C or below : 1 time : 0.2%(Wt.) or below : 350°C or below : 3 seconds or less : 0.2%(Wt.) or below Condition Symbol IR260 VPS VP215 Wave Soldering WS260 Partial Heating HS350 Caution Do not use different soldering methods together (except for partial heating). Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale. 08/30/2004 A Business Partner of NEC Compound Semiconductor Devices, Ltd. 4590 Patrick Henry Drive Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279 Subject: Compliance with EU Directives CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. 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Restricted Substance per RoHS Lead (Pb) Mercury Cadmium Hexavalent Chromium PBB PBDE Concentration Limit per RoHS (values are not yet fixed) < 1000 PPM < 1000 PPM < 100 PPM < 1000 PPM < 1000 PPM < 1000 PPM Concentration contained in CEL devices -A Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected -AZ (*) If you should have any additional questions regarding our devices and compliance to environmental standards, please do not hesitate to contact your local representative. Important Information and Disclaimer: Information provided by CEL on its website or in other communications concerting the substance content of its products represents knowledge and belief as of the date that it is provided. CEL bases its knowledge and belief on information provided by third parties and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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