UPG2163T5N

GaAs INTEGRATED CIRCUIT µPG2163T5N SPDT SWITCH FOR 2.4 GHz AND 6 GHz DUAL-BAND WIRELESS LAN DESCRIPTION The µPG2163T5N is GaAs MMIC SPDT (Single Pole Double Throw) switch which was developed for 2.4 GHz and 6 GHz dual-band wireless LAN. This device can operate frequency from 2.4 GHz band and 6 GHz band, having the low insertion loss and high isolation. This device is housed in a 6-pin plastic TSON (Thin Small Out-line Non-leaded) package. And this package is able to high-density surface mounting. FEATURES • Operating frequency • Switch control voltage • Low insertion loss • High isolation • Handling power : f = 2.4 to 2.5 GHz and 4.9 to 6.0 GHz : Vcont (H) = 2.8 to 5.0 V (3.0 V TYP.) : Vcont (L) = −0.3 to 0.3 V (0 V TYP.) : Lins1 = 0.40 dB TYP. @ f = 2.4 to 2.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : Lins2 = 0.50 dB TYP. @ f = 4.9 to 6.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : ISL1 = 38 dB TYP. @ f = 2.4 to 2.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : ISL2 = 30 dB TYP. @ f = 4.9 to 6.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : Pin (1 dB) = +31.0 dBm TYP. @ f = 2.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V : Pin (1 dB) = +29.0 dBm TYP. @ f = 6.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V • High-density surface mounting : 6-pin plastic TSON package (1.5 × 1.5 × 0.37 mm) APPLICATIONS • Dual-band wireless LAN (IEEE802.11a + b/g) ORDERING INFORMATION Part Number Order Number Package 6-pin plastic TSON (Pb-Free) Marking G4X Supplying Form • Embossed tape 8 mm wide • Pin 1, 6 face the perforation side of the tape • Qty 3 kpcs/reel µPG2163T5N-E2 µPG2163T5N-E2-A Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: µPG2163T5N Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. Document No. PG10626EJ01V0DS (1st edition) Date Published July 2006 NS CP(K) µPG2163T5N PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) (Top View) (Bottom View) Pin No. 1 Pin Name GND Vcont2 OUT2 (RX) OUT1 (TX) Vcont1 IN (ANT) 1 6 1 6 6 1 2 3 G4X Vcont1 High Low Parameter Parameter 2 5 2 5 5 2 4 5 6 3 4 3 4 4 3 Remark Exposed pad : GND TRUTH TABLE Vcont2 Low High IN (ANT)−OUT1 (TX) OFF ON IN (ANT)−OUT2 (RX) ON OFF ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherw ise specified) Symbol Vcont Pin TA Tstg Ratings −6.0 to +6.0 +32 −45 to +85 −55 to +135 Unit V dBm °C °C Switch Control Voltage Input Power Operating Ambient Temperature Storage Temperature RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherw ise specified) Symbol Vcont (H) Vcont (L) f1 f2 MIN. 2.8 − 0.3 2.4 4.9 TYP. 3.0 0 − − MAX. 5.0 0.3 2.5 6.0 Unit V V GHz GHz Switch Control Voltage (H) Switch Control Voltage (L) Operating Frequency 1 Operating Frequency 2 2 Data Sheet PG10626EJ01V0DS µPG2163T5N ELECTRICAL CHARACTERISTICS (TA = +25°C, Vcont (H) = 3.0 V, Vcont otherwise specified) Parameter Insertion Loss 1 Insertion Loss 2 Isolation 1 Isolation 2 Input Return Loss 1 Input Return Loss 2 Output Return Loss 1 Output Return Loss 2 1 dB Loss Compression Note Input Power 1 1 dB Loss Compression Note Input Power 2 Input 3rd Order Distortion Intercept Point Switch Control Current Switch Control Speed Icont tSW 50% CTL to 90/10% − − 0.1 50 1.0 − Symbol Lins1 Lins2 ISL1 ISL2 RLin1 RLin2 RLout1 RLout2 (L) = 0 V, Z0 = 50 Ω, DC blocking capacitors = 4 pF, unless Test Conditions f = 2.4 to 2.5 GHz f = 4.9 to 6.0 GHz f = 2.4 to 2.5 GHz f = 4.9 to 6.0 GHz f = 2.4 to 2.5 GHz f = 4.9 to 6.0 GHz f = 2.4 to 2.5 GHz f = 4.9 to 6.0 GHz MIN. − − 35 27 − − − − − − − TYP. 0.40 0.50 38 30 15 15 15 15 +31.0 MAX. 0.60 0.80 − − − − − − − − − Unit dB dB dB dB dB dB dB dB dBm Pin (1 dB) 1 f = 2.4 to 2.5 GHz Pin (1 dB) 2 f = 4.9 to 6.0 GHz +29.0 dBm IIP3 +55 dBm µA ns Note Pin (1 dB) is measured the input power level when the insertion loss increases more 1 dB than that of linear range. Caution This device is used it is necessary to use DC blocking capacitors. Data Sheet PG10626EJ01V0DS 3 µPG2163T5N EVALUATION CIRCUIT 4 pF 1 6 IN (ANT) Vcont2 1 000 pF 2 5 1 000 pF Vcont1 OUT2 (RX) 4 pF 3 4 4 pF OUT1 (TX) The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. 4 Data Sheet PG10626EJ01V0DS µPG2163T5N MOUNTING PAD DIMENSIONS 6-PIN PLASTIC TSON (UNIT: mm) MOUNTING PAD 0.3 0.5 0.3 1.0 0.3 0.2 0.3 SOLDER PAD 0.475 0.25 0.475 0.35 0.55 0.15 0.25 Solder thickness : 0.08 mm Remark The mounting pad layouts in this document are for reference only. 0.5 0.5 0.5 0.5 Data Sheet PG10626EJ01V0DS 5 µPG2163T5N PACKAGE DIMENSIONS 6-PIN PLASTIC TSON (UNIT: mm) (Top View) 1.5±0.1 (Side View) (Bottom View) 0.3±0.07 0.5±0.06 1.5±0.1 0.37+0.03 –0.05 0.2±0.1 0.2+0.07 –0.05 0.7±0.1 6 Data Sheet PG10626EJ01V0DS 1.2±0.1 µPG2163T5N RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Soldering Conditions Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220°C or higher Preheating time at 120 to 180°C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Wave Soldering Peak temperature (molten solder temperature) Time at peak temperature Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) Partial Heating Peak temperature (terminal temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 260°C or below : 10 seconds or less : 60 seconds or less : 120±30 seconds : 3 times : 0.2%(Wt.) or below : 260°C or below : 10 seconds or less : 1 time : 0.2%(Wt.) or below : 350°C or below : 3 seconds or less : 0.2%(Wt.) or below HS350 WS260 Condition Symbol IR260 For soldering Preheating temperature (package surface temperature) : 120°C or below Caution Do not use different soldering methods together (except for partial heating). Data Sheet PG10626EJ01V0DS 7 4590 Patrick Henry Drive Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279 Subject: Compliance with EU Directives CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. 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