UPG2310TK

GaAs INTEGRATED CIRCUIT µPG2310TK GaAs MMIC LOW NOISE AMPLIFIER FOR SATELLITE RADIO DESCRIPTION The µPG2310TK is a GaAs MMIC LNA for SDARS (Satellite Digital Audio Radio Services). High Gain and Low Distortion suit to driver stage amplifier for Satellite Radio Antenna. FEATURES • High gain • Low distortion : GP = 27.0 dB TYP. : OIP3 = +28.5 dBm TYP. • 6-pin lead-less minimold package (1.5 × 1.1 × 0.55 mm) APPLICATION • Satellite Radio Antenna etc. ORDERING INFORMATION Part Number Order Number Package 6-pin lead-less minimold (1511 PKG) (Pb-Free) Note Marking G4W Supplying Form • Embossed tape 8 mm wide • Pin 1, 6 face the perforation side of the tape • Qty 5 kpcs/reel µPG2310TK-E2 µPG2310TK-E2-A Note With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact your nearby sales office. Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: µPG2310TK-A Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. Document No. PG10576EJ01V0DS (1st edition) Date Published August 2005 CP(K) µPG2310TK PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM Pin No. Pin Name VCC2/OUT GND VCC1 IN GND GND (Top View) (Top View) (Bottom View) 1 G4W Parameter Parameter 1 2 3 6 5 4 1 2 3 6 5 4 6 5 4 1 2 3 2 3 4 5 6 ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherw ise specified) Symbol VCC1, VCC2 Pin Ptot TA Tstg Ratings + 5. 0 −10 300 Note Unit V dBm mW °C °C Supply Voltage Input Power Total Power Dissipation Operating Ambient Temperature Storage Temperature −45 to +85 −55 to +150 Note Mounted on double-sided copper-clad 50 × 50 × 1.6 mm epoxy glass PWB, TA = +85°C RECOMMENDED OPERATING RANGE Symbol fopt VCC1, VCC2 TA MIN. 2 320 +2.7 − 45 TYP. 2 340 +3.0 +25 MAX. 2 360 +3.3 +85 Unit MHz V °C Operating Frequency Supply Voltage Operating Ambient Temperature 2 Data Sheet PG10576EJ01V0DS µPG2310TK ELECTRICAL CHARACTERISTICS (TA = +25°C, VCC1 = VCC2 = +3.0 V, ZO = 50 Ω, unless otherw ise specified) Parameter Power Gain Noise Figure Input Return Loss Output Return Loss Output 3rd Order Distortion Intercept Point Circuit Current Note Symbol GP NF RLin RLout OIP3 Test Conditions f = 2 340 MHz, Pin = −30 dBm f = 2 340 MHz f = 2 340 MHz, Pin = −30 dBm f = 2 340 MHz, Pin = −30 dBm f1 = 2 340 MHz, f2 = 2 340.1 MHz f = 2 340 MHz, Pin = −30 dBm MIN. 25.0 − − − +26.5 − TYP. 27.0 1.8 13 15 +28.5 MAX. − 2.0 − − − Unit dB dB dB dB dBm ICC 30 35 mA Note Please refer to following chart. CIRCUIT CURRENT vs. SUPPLY VOLTAGE 40 Circuit Current ICC (mA) 35 30 25 20 15 2.5 2.6 2.7 2.8 2.9 3 3.1 3.2 3.3 3.4 3.5 Supply Voltage VCC (V) Remark The graph indicates nominal characteristics. Data Sheet PG10576EJ01V0DS 3 µPG2310TK TEST CIRCUIT 4 IN L1 2.2 nH 3 C2 0.1 µ F VCC1 5 2 L3 68 nH C3 0.1 µ F VCC2 GND 6 1 GND OUT C1 5.0 pF L2 3.3 nH GND The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. 4 Data Sheet PG10576EJ01V0DS µPG2310TK TYPICAL CHARACTERISTICS (TA = +25°C, unless otherw ise specified) Output Power (2 tones) Pout (dBm) 3rd Order Intermodulation Distortion (2 tones) IM3 (dBm) OUTPUT POWER (2 tones), IM3 (2 tones), ICC vs. INPUT POWER (2 tones) 40 30 20 10 0 –10 –20 –30 –40 –50 –60 –70 –30 –20 ICC IM3 Pout 39 38 36 35 34 33 32 31 30 VCC1 = VCC2 = +3.0 V 29 f1 = 2 340 MHz f2 = 2 340.1 MHz 28 –10 0 10 Circuit Current ICC (mA) 37 Input Power (2 tones) Pin (dBm) Remark The graph indicates nominal characteristics. Data Sheet PG10576EJ01V0DS 5 µPG2310TK PACKAGE DIMENSIONS 6-PIN LEAD-LESS MINIMOLD (1511 PKG) (UNIT: mm) (Top View) (Bottom View) 0.48±0.05 0.48±0.05 1.5±0.1 1.1±0.1 0.2±0.1 0.16±0.05 0.9±0.1 1.3±0.05 6 0.55±0.03 Data Sheet PG10576EJ01V0DS 0.11+0.1 –0.05 µPG2310TK RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Soldering Conditions Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220°C or higher Preheating time at 120 to 180°C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Wave Soldering Peak temperature (molten solder temperature) Time at peak temperature Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) Partial Heating Peak temperature (terminal temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 260°C or below : 10 seconds or less : 60 seconds or less : 120±30 seconds : 3 times : 0.2%(Wt.) or below : 260°C or below : 10 seconds or less : 1 time : 0.2%(Wt.) or below : 350°C or below : 3 seconds or less : 0.2%(Wt.) or below HS350 WS260 Condition Symbol IR260 For soldering Preheating temperature (package surface temperature) : 120°C or below Caution Do not use different soldering methods together (except for partial heating). Data Sheet PG10576EJ01V0DS 7 4590 Patrick Henry Drive Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279 Subject: Compliance with EU Directives CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. This status is based on CEL’s understanding of the EU Directives and knowledge of the materials that go into its products as of the date of disclosure of this information. Restricted Substance per RoHS Lead (Pb) Mercury Cadmium Hexavalent Chromium PBB PBDE Concentration Limit per RoHS (values are not yet fixed) < 1000 PPM < 1000 PPM < 100 PPM < 1000 PPM < 1000 PPM < 1000 PPM Concentration contained in CEL devices -A Not Detected Not Detected Not Detected Not Detected Not Detected Not Detected -AZ (*) If you should have any additional questions regarding our devices and compliance to environmental standards, please do not hesitate to contact your local representative. Important Information and Disclaimer: Information provided by CEL on its website or in other communications concerting the substance content of its products represents knowledge and belief as of the date that it is provided. CEL bases its knowledge and belief on information provided by third parties and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. CEL has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. CEL and CEL suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall CEL’s liability arising out of such information exceed the total purchase price of the CEL part(s) at issue sold by CEL to customer on an annual basis. See CEL Terms and Conditions for additional clarification of warranties and liability.