UPG2314T5N-E2

GaAs HBT INTEGRATED CIRCUIT µPG2314T5N POWER AMPLIFIER FOR BluetoothTM Class 1 DESCRIPTION The µPG2314T5N is GaAs HBT MMIC for power amplifier which was developed for Bluetooth Class 1. This device realizes high efficiency, high gain and high output power by using InGaP HBT. This device is housed in a 6-pin plastic TSON (Thin Small Out-line Non-leaded) package. And this package is able to high-density surface mounting. FEATURES • Operation frequency • Supply voltage • Control voltage • Circuit current • Output power • Gain control range • High efficiency : fopt = 2 400 to 2 500 MHz (2 450 MHz TYP.) : VCC1, 2 = 2.7 to 3.6 V (3.0 V TYP.) : Vcont = 0 to 3.6 V (3.0 V TYP.) : Vbias + Venable = 0 to 3.1 V (3.0 V TYP.) : ICC = 65 mA TYP. @ VCC1, 2 = 3.0 V, Vbias + Venable = 3.0 V, Vcont = 3.0 V, Pin = 0 dBm : Pout = +20 dBm TYP. @ VCC1, 2 = 3.0 V, Vbias + Venable = 3.0 V, Vcont = 3.0 V, Pin = 0 dBm : GCR = 23 dB TYP. @ VCC1, 2 = 3.0 V, Vbias + Venable = 3.0 V, Vcont = 0 to 3.0 V, Pin = 0 dBm : PAE = 50% TYP. • High-density surface mounting : 6-pin plastic TSON package (1.5 × 1.5 × 0.37 mm) APPLICATIONS • Power Amplifier for Bluetooth Class 1 ORDERING INFORMATION Part Number Order Number Package 6-pin plastic TSON (Pb-Free) Marking G5D Supplying Form • Embossed tape 8 mm wide • Pin 1, 6 face the perforation side of the tape • Qty 3 kpcs/reel µPG2314T5N-E2 µPG2314T5N-E2-A Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: µPG2314T5N Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. Document No. PG10624EJ01V0DS (1st edition) Date Published July 2006 NS CP(K) µPG2314T5N PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM (Top View) (Top View) (Bottom View) Pin No. 1 Pin Name OUTPUT/VCC2 Vbias + Venable Vcont INPUT VCC1 GND 1 6 1 Bias Circuit 6 6 1 2 3 G5D Parameter Parameter 2 5 2 Bias Circuit 5 5 2 4 5 6 3 4 3 4 4 3 ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherw ise specified) Symbol VCC1, 2 Vbias + Venable Control Voltage Circuit Current Control Current Input Power Power Dissipation Operating Ambient Temperature Storage Temperature Vcont ICC Icont Pin PD TA Tstg 3.6 400 0.5 +10 700 Note Ratings 5.5 3.6 Unit V V Supply Voltage V mA mA dBm mW °C °C −40 to +85 −55 to +150 Note Mounted on double-sided copper-clad 50 × 50 × 1.6 mm epoxy glass PWB, TA = +85°C RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherw ise specified) Symbol fopt VCC1, 2 Vbias + Venable Control Voltage Vcont 0 3.0 3.6 V MIN. 2 400 2.7 0 TYP. 2 450 3.0 3.0 MAX. 2 500 3.6 3.1 Unit MHz V V Operating Frequency Supply Voltage 2 Data Sheet PG10624EJ01V0DS µPG2314T5N ELECTRICAL CHARACTERISTICS (TA = +25°C, VCC1, 2 = Vbias + Venable = 3.0 V, f = 2 450 MHz, Pout = +20 dBm, External input and output matching, unless otherwise specified) Parameter Circuit Current Shut Down Current Symbol ICC Ishut down Test Conditions Vcont = 3.0 V, Pin = 0 dBm Vcont = 3.0 V, Pin = 0 dBm , Vbias + Venable = 0 V Output Power 1 Output Power 2 Gain Control Range Efficiency Pout1 Pout2 GCR PAE Vcont = 3.0 V, Pin = 0 dBm Vcont = 0 V, Pin = 0 dBm Vcont = 0 to 3.0 V, Pin = 0 dBm Vcont = 3.0 V, Pin = 0 dBm +18.0 − 17 − +20.0 −3.0 23 50 − +1.0 − − dBm dBm dB % MIN. − − TYP. 65 0 MAX. 70 1 Unit mA µA Data Sheet PG10624EJ01V0DS 3 µPG2314T5N EVALUATION CIRCUIT VCC2 1 nF 22 nH OUTPUT 10 pF 1 6 Bias Circuit Vbias + Venable 2 5 2.7 nH 1 nF VCC1 Bias Circuit Vcont 3 4 INPUT 4.7 nH The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. 4 Data Sheet PG10624EJ01V0DS µPG2314T5N TYPICAL CHARACTERISTICS (TA = +25°C, unless otherw ise specified) Condition : f = 2 450 MHz, VCC1 = VCC2 = Vbias + Venable = Vcont = 3.0 V, with external input and output matching circuit CIRCUIT CURRENT, EFFICIENCY, OUTPUT POWER vs. INPUT POWER Circuit Current ICC (mA), Efficiency PAE (%) 80 70 60 50 40 PAE ICC 40 35 30 25 20 Pout 30 20 10 0 –25 –20 –15 15 10 5 –10 –5 0 5 0 10 Input Power Pin (dBm) Condition : f = 2 450 MHz, VCC1 = VCC2 = Vbias + Venable = 3.0 V, Pin = 0 dBm, with external input and output matching circuit Output Power Pout (dBm), Efficiency PAE (%) OUTPUT POWER, EFFICIENCY, CIRCUIT CURRENT vs. CONTROL VOLTAGE 60 50 40 30 20 10 0 –10 –20 –30 0 0.5 1 1.5 2 2.5 3 Pout PAE ICC 90 80 70 60 50 40 30 20 10 0 3.5 Control Voltage Vcont (V) Remark The graphs indicate nominal characteristics. Circuit Current ICC (mA) Output Power Pout (dBm) Data Sheet PG10624EJ01V0DS 5 µPG2314T5N Condition : f = 2 450 MHz, VCC1 = VCC2 = Vcont = 3.0 V, Pin = 0 dBm, with external input and output matching circuit OUTPUT POWER, 2f0, CIRCUIT CURRENT, EFFICIENCY vs. SUPPLY VOLTAGE 30 20 Output Power Pout (dBm) 2nd Harmonics 2f0 (dBc) ICC Pout 70 60 50 PAE 10 0 –10 –20 2f0 40 30 20 10 2 2.5 3 0 3.5 –30 –40 1.5 Supply Voltage Vbias + Venable (V) Condition : VCC1 = VCC2 = Vbias + Venable = Vcont = 3.0 V, Pin = −20 dBm, with external input and output matching circuit S11-FREQUENCY 0 S11, S22-FREQUENCY –10 m2 m3 m1 –20 –30 START 50.000 000 MHz m1: f = 2.450 GHz S (1,1) = 0.245/–17.795 impedance = Z0 * (1.584 – j0.252) STOP 6 050.000 000 MHz –40 0 m2: f = 2.450 GHz dB (S (1,1)) = –12.214 m3: f = 2.450 GHz dB (S (2,2)) = –15.929 1 2 3 4 5 6 7 Frequency f (GHz) S21-FREQUENCY 25 S22-FREQUENCY m4 20 15 m5 10 5 m4: f = 2.450 GHz dB (S (2,1)) = 24.321 0 0 1 2 3 4 5 6 7 START 50.000 000 MHz Frequency f (GHz) Remark The graphs indicate nominal characteristics. 6 Data Sheet PG10624EJ01V0DS Circuit Current ICC (mA), Efficiency PAE (%) m5: f = 2.450 GHz S (2,2) = 0.160/–152.056 impedance = Z0 * (0.745 – j0.115) STOP 6 050.000 000 MHz µPG2314T5N MOUNTING PAD AND SOLDER MASK LAYOUT DIMENSIONS 6-PIN PLASTIC TSON (UNIT: mm) MOUNTING PAD 0.3 0.5 0.3 1.0 0.3 0.2 0.3 SOLDER PAD 0.475 0.25 0.475 0.35 0.55 0.15 0.25 Solder thickness : 0.08 mm Remark The mounting pad layouts in this document are for reference only. 0.5 0.5 0.5 0.5 Data Sheet PG10624EJ01V0DS 7 µPG2314T5N PACKAGE DIMENSIONS 6-PIN PLASTIC TSON (UNIT: mm) (Top View) 1.5±0.1 (Side View) (Bottom View) 0.3±0.07 0.5±0.06 1.5±0.1 0.37+0.03 –0.05 0.2±0.1 0.2+0.07 –0.05 0.7±0.1 8 Data Sheet PG10624EJ01V0DS 1.2±0.1 µPG2314T5N RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Soldering Conditions Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220°C or higher Preheating time at 120 to 180°C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Wave Soldering Peak temperature (molten solder temperature) Time at peak temperature Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) Partial Heating Peak temperature (terminal temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 260°C or below : 10 seconds or less : 60 seconds or less : 120±30 seconds : 3 times : 0.2%(Wt.) or below : 260°C or below : 10 seconds or less : 1 time : 0.2%(Wt.) or below : 350°C or below : 3 seconds or less : 0.2%(Wt.) or below HS350 WS260 Condition Symbol IR260 For soldering Preheating temperature (package surface temperature) : 120°C or below Caution Do not use different soldering methods together (except for partial heating). Data Sheet PG10624EJ01V0DS 9 4590 Patrick Henry Drive Santa Clara, CA 95054-1817 Telephone: (408) 919-2500 Facsimile: (408) 988-0279 Subject: Compliance with EU Directives CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive 2003/11/EC Restriction on Penta and Octa BDE. CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals. All devices with these suffixes meet the requirements of the RoHS directive. 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