MeshConnect ™ EM35x Mini Modules
ZICM35xSP0 and ZICM35xSP2
Ember EM35x Transceiver-Based Modules
TM
Integrated Transceiver Modules for ZigBee ® / Thread / IEEE 802.15.4
Development Kit Available: ZICM-EM35X-DEV-KIT-3
DESCRIPTION
EM35x Mini Modules
The MeshConnect ™ EM35x Mini Modules from
California Eastern Laboratories (CEL) combine high
performance RF solutions with the market's premier
ZigBee ® and Thread stacks. Available in low and
high output power options (+8 dBm and +20 dBm),
these modules can accommodate variable range
and performance requirements. The tiny module
footprint makes them suitable for a wide range of
ZigBee and Thread applications. The MeshConnect
EM35x Mini Modules are certified and qualified,
enabling customers to accelerate time to market by
greatly reducing the design and certification phases
of development.
Powered by
EM357
KEY FEATURES:
• 32-bit
ARM ®
• 12 kB SRAM
• 192 kB Flash
Cortex ™-M3
• Up to 23 GPIO Pins
or
• SPI (Master /Slave),
EM358x
TWI and UART
• Up to 64kB SRAM
• Up to 512kB Flash
(Supports OTA)
• Optional USB
Controller
• Timers and Serial
Wire /JTAG Interface
• 5-Channel 14-bit ADC
ZICM35xSP0 ZICM35xSP2
Tx: +8 dBm +20 dBm
Rx: -100 dBm
-103 dBm
Link Budget: +108 dB
+123 dB
CEL’s
MeshConnect
EM35x
Mini
Modules
(ZICM35xSP0 and ZICM35xSP2) are based on the
Ember EM35x (EM357 and EM358x) System on Chip
(SoC) radio ICs. Each IC is a complete single-chip
solution, compliant with ZigBee, Thread, and IEEE
802.15.4. specifications.
ADDITIONAL FEATURES
•• Data Rate: 250kbps
•• Advanced Power Management
•• 16 RF Channels
•• Industry's Premier Wireless
Networking Stacks: EmbeZNet
PRO ™ (ZigBee) and Silicon
Labs Thread
•• Mini Footprint:
- 0.940" x 0.655"
(23.9 mm x 16.6mm)
CEL’s EM358x-based Mini Modules (ZICM358xSP0
and ZICM358xSP2) are ideal for customers requiring
Over-the-Air (OTA) programming without an external
Flash memory (such as Smart Energy or Home
Automation), a larger memory footprint for complex
application control, or the additional resources to run
an IPv6-based networking stack like Thread. They
also feature an optional on-board Universal Serial
Bus (USB) 2.0 full-speed peripheral.
This document is subject to change without notice
Document No: 0011-00-07-01-000 (Issue H)
Date Published: October 11, 2016
Ember ® ZigBee ® & Thread Solutions
APPLICATIONS
•• Smart Energy /Grid Markets
- Thermostats
- In-Home Displays
- Smart Plugs
•• Home Automation and Control
- Energy Management
- Security Devices
- HVAC Control
•• Building Automation and Control
Page 1
•• Antenna Options:
1) Integrated PCB Trace Antenna
2) RF Port for External Antenna
•• Supports Mesh Networks
•• AES Encryption
•• FCC, CE and IC Certifications
•• RoHS Compliant
•• Commercial and Residential
Lighting
- Fixtures and Control
•• Solar Inverters and Control
•• General ZigBee and Thread
Wireless Sensor Networking
Contributor Member
EM35x Mini Modules
TABLE OF CONTENTS
Introduction and Overview
Description..............................................................................................................................................................................................
1
Features...................................................................................................................................................................................................
1
Applications............................................................................................................................................................................................
1
Ordering Information..............................................................................................................................................................................
3
ZICM35xSPx Product Comparison Table..............................................................................................................................................
4
Module Block Diagram...........................................................................................................................................................................
4
Development Tools..................................................................................................................................................................................
5
System Level Function
Transceiver IC..........................................................................................................................................................................................
6
Antenna....................................................................................................................................................................................................
6
Power Amplifier.......................................................................................................................................................................................
6
USB...........................................................................................................................................................................................................
7
Software /Firmware.................................................................................................................................................................................
7
Electrical Specification
Absolute Maximum Ratings...................................................................................................................................................................
8
Recommended Operating Condition.....................................................................................................................................................
8
DC Characteristics..................................................................................................................................................................................
8
RF Characteristics..................................................................................................................................................................................
9
Pin Signal and Interfaces
Pin Signals I/O Configuration...............................................................................................................................................................
10
I/O Pin Assignment................................................................................................................................................................................
10
Module Dimensions................................................................................................................................................................................
11
Module Land Footprint...........................................................................................................................................................................
12
Processing..........................................................................................................................................................................................
13
Agency Certifications....................................................................................................................................................................
15
Software Compliance....................................................................................................................................................................
16
Shipment, Storage and Handling.............................................................................................................................................
18
Quality...................................................................................................................................................................................................
18
References..........................................................................................................................................................................................
19
Revision History...............................................................................................................................................................................
19
This document is subject to change without notice
Document No: 0011-00-07-01-000 (Issue H)
Page 2
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EM35x Mini Modules
ORDERING INFORMATION
Part Number
MeshConnect
EM35x Mini Modules
Description
Min/
Multiple
ZICM357SP0-1-R
EM357 IC, +8 dBm output power, PCB trace antenna; Tape and Reel Package
600 /600
ZICM357SP0-1C-R
EM357 IC, +8dBm output power with castellation pin for external antenna; Tape and Reel Package
600 /600
ZICM357SP2-1-R *
EM357 IC, +20 dBm output power, PCB trace antenna; Tape and Reel Package
600 /600
ZICM357SP2-1C-R *
EM357 IC, +20dBm output power with castellation pin for external antenna; Tape and Reel Package
600 /600
ZICM357SP2-2-R
EM357 IC, +20 dBm output power, PCB trace antenna; Tape and Reel Package
600 /600
ZICM357SP2-2C-R
EM357 IC, +20dBm output power with castellation pin for external antenna; Tape and Reel Package
600 /600
ZICM3588SP0-1-R
EM3588 IC, +8 dBm output power, PCB trace antenna; Tape and Reel Package
600 /600
ZICM3588SP0-1C-R
EM3588 IC, +8dBm output power with castellation pin for external antenna; Tape and Reel Package
600 /600
ZICM3588SP2-1-R *
EM3588 IC, +20 dBm output power, PCB trace antenna; Tape and Reel Package
600 /600
ZICM3588SP2-1C-R *
EM3588 IC, +20dBm output power with castellation pin for external antenna; Tape and Reel Package
600 /600
ZICM3588SP2-2-R *
EM3588 IC, +20 dBm output power, PCB trace antenna; Tape and Reel Package
600 /600
ZICM3588SP2-2C-R *
EM3588 IC, +20dBm output power with castellation pin for external antenna; Tape and Reel Package
600 /600
Order Number
MeshConnect EM35x ZICM-EM35X-DEV-KIT-3 MeshConnect EM35x Ember Companion Kit for Ember EM35x Development Kit
Development Kit
1/1
*Note: ZICM35xSP2-1(C) modules are not recommended for new designs, although there are no plans to stop production. Use ZICM35xSP2-2(C)
instead. The -2 part numbers allow for faster 'time to sleep' state at the expense of one less GPIO (PC6).
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Document No: 0011-00-07-01-000 (Issue H)
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EM35x Mini Modules
ZICM35xSPx PRODUCT COMPARISON TABLE
MCU
Order Number
Flash
Memory
SRAM
Memory
Performance
USB
ZICM357SP0-1
ZICM357SP0-1C
ZICM357SP2-1
ZICM357SP2-1C
I/O
23
192 kB
12 kB
–
22
ZICM357SP2-2
ZICM357SP2-2C
21
ZICM3588SP0-1
ZICM3588SP0-1C
23
ZICM3588SP2-1
ZICM3588SP2-1C
22
512 kB
64 kB
ü
ZICM3588SP2-2
ZICM3588SP2-2C
Tx
Power
Output
Rx
Sensitivity
Rx
Current
Tx
Current
Sleep /
Suspend
Current
dBm
dBm
mA
mA
µA
+8
-100
30
44
+20
-103
34
150
+8
-100
30
44
+20
-103
34
150
Comments
1
Reduced GPIO allows for
faster 'time to sleep' state
2.4 µA with entire RAM
retained. Lower sleep
current can be achieved
by retaining less RAM
2.4
21
1) 2.4 µA with entire RAM
retained. Lower sleep
current can be achieved
by retaining less RAM
2) Reduced GPIO allows
for faster 'time to sleep'
state
MODULE BLOCK DIAGRAMS
Castellation
Edge Connector
EM35x Mini Module (ZICM35xSP0)
24 MHz
XTAL
Ember EM35x
Micro
Castellation
Edge Connector
EM35x Mini Module (ZICM35xSP2)
This document is subject to change without notice
Document No: 0011-00-07-01-000 (Issue H)
Balun
Radio
LPF
24 MHz
XTAL
Ember EM35x
PA
Micro
Radio
Page 4
LNA
TX/RX
Switch
LPF
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EM35x Mini Modules
DEVELOPMENT TOOLS
Ember Companion Kit
CEL’s MeshConnect EM35x Ember Companion Kit is
designed to work with the Silicon Laboratories / Ember
Development Kits (EM35X-DEV and EM35X-DEV-IAR).
Each module in the CEL Development Kit is soldered on
a carrier board making it pin-for-pin compatible with the
Ember Development Board.
Mini Modules Programming Fixture
CEL's MeshConnect EM35x Mini Modules Programming
Fixture is a programming assembly designed to be used
with the CEL ZICM35xSPx MeshConnect Mini Modules. It
is useful for production programming or during application
development when multiple firmware images are required
to be loaded into a CEL Mini Module for testing and
debugging. The programming assembly must be used in
conjunction with an Ember Debug/InSight Adapter (ISA3)
from Silicon Labs.
EM35x Ember Companion Kit
Kit Contents:
• ZICM357SP0-1C-SL
• ZICM357SP2-1-SL
• ZICM357SP2-1C-SL
• ZICM3588SP0-1C-SL
• ZICM3588SP2-1-SL
• ZICM3588SP2-1C-SL
EM35x Programming Fixture
For more information regarding the MeshConnect
Development Tools, refer to the respective documents, or
visit www.cel.com/MeshConnect.
DEVELOPMENT TOOLS ORDERING INFORMATION
Part Number
Order Number
Description
MeshConnect
EM35x Ember Companion Kit
ZICM-EM35X-DEV-KIT-3
MeshConnect EM35x Ember Companion Kit for Silicon Laboratories/
Ember EM35x Development Kit
MeshConnect
EM35x Programming Fixture
ZICM35xSPx-PF-1
MeshConnect EM35x Mini Modules (ZICM35xSPx) Programming Fixture
This document is subject to change without notice
Document No: 0011-00-07-01-000 (Issue H)
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Contributor Member
EM35x Mini Modules
TRANSCEIVER IC
CEL’s MeshConnect EM35x Mini Modules use the Ember EM35x transceiver (EM357 or EM358x) IC. The IC
incorporates a RF transceiver with baseband modem, a hardwired MAC and an embedded ARM ® Cortex ™-M3
microcontroller, offering an excellent low cost, high performance solution for all IEEE 802.15.4 /ZigBee /Thread
applications. For more information about the EM35x IC, visit www.silabs.com.
ANTENNA
CEL’s MeshConnect EM35x Mini Modules include an integrated Printed Circuit Board (PCB) trace antenna.
An optional configuration which uses a castellation pin on the module allows the user to connect an external
antenna. The ZICM35xSP0 has been certified with the PCB trace antenna and two external antennas (E-2820CA, LSR 001-0100). The ZICM35xSP2 has been certified with the PCB trace antenna and a Nearson half-wave
dipole antenna (part number: S181AH-2450S) on a 4 inch cable using the castellation pin of the module. Please
refer to the document Mini Module External Antenna Implementation for details describing the requirements that
must be followed to take advantage of the CEL certification. See Ordering Information on Page 3.
The PCB antenna employs a topology that is compact and highly efficient. To maximize range, an adequate ground
plane must be provided on the host PCB. Correctly positioned, the ground plane on the host PCB will contribute
significantly to the antenna performance (it should not be directly under the module PCB Antenna). The position of
the module on the host board and overall design of the product enclosure contribute to antenna performance. Poor
design affects radiation patterns and can result in reflection, diffraction and/or scattering of the transmitted signal.
For optimum antenna performance, the MeshConnect Modules should be mounted with the PCB trace antenna
overhanging the edge of the host board. To further improve performance, a ground plane may be placed on the
host board under the module, up to the antenna (a minimum of 1.5" x 1.5" is recommended). The installation of
an uninterrupted ground plane on a layer directly beneath the module will also allow you to run traces under this
layer. CEL can provide assistance with your PCB layout.
The following are some design guidelines to help ensure antenna performance:
• Never place the ground plane or route copper traces directly underneath the antenna portion of the module
• Never place the antenna close to metallic objects
• In the overall design, ensure that wiring and other components are not placed near the antenna
• Do not place the antenna in a metallic or metalized plastic enclosure
• Keep plastic enclosures 1cm or more away from the antenna in any direction
This radio transmitter IC: 8254A-ZICM357SP0 & IC: 8254A-ZICM357SP2 has been approved by IC Canada
to operate with the antenna types listed above with the maximum permissible gain of 2dBi. Antenna types not
included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Cet émetteur radio IC: 8254A-ZICM357SP0 & IC: 8254A-ZICM357SP2 a été approuvé par IC Canada pour
fonctionner avec les types d'antenne énumérés ci-dessus avec le gain maximal admissible de 2dBi. Types
d'antennes non inclus dans cette liste, ayant un gain supérieur au gain maximum indiqué pour ce type, sont
strictement interdits pour une utilisation avec cet appareil.
POWER AMPLIFIER
CEL’s MeshConnect EM35x High Power Mini Module (ZICM35xSP2) includes a Power Amplifier (PA). This PA
delivers high efficiency, high gain and high output power (Pout = +20.0 dBm typical) to provide an extended range
and reliable transmission for fewer nodes in a network. For the ZICM35xSP2, Power Mode 2 with Power Setting
-2 is the maximum setting allowed for FCC Compliance. Operating in Power Mode 3 at higher power settings
may damage the PA.
This document is subject to change without notice
Document No: 0011-00-07-01-000 (Issue H)
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EM35x Mini Modules
USB
The ZICM3588SPx-x Modules have an integrated USB 2.0-compliant, full-speed (12 Mbps) device peripheral. For
more information, refer to the EM35x SoC Datasheet link provided in the References Section of this document.
SOFTWARE /FIRMWARE
CEL’s MeshConnect EM35x Mini Modules are ideal platforms for EmberZNet PRO, the industry’s most deployed
and field proven ZigBee compliant stack supporting the ZigBee PRO feature set. EmberZNet PRO is a complete
ZigBee protocol software package containing all the elements required for mesh networking applications. The
ZICM3588SPx variants are also ideal platforms for Thread, an IP-based mesh networking stack that allows direct
IPv6 connectivity to all devices within the network. For more information regarding the software development for
the EM35x IC family, visit www.silabs.com.
CEL provides reference software that runs multiple functions and executes various commands. For example,
users can set up a simple ZigBee network to perform Range and Packet Error Rate (PER) tests between two
devices. This allows the user to evaluate the module's RF performance in their own environment. The software
can also place the module in various operating modes which allows for testing of low-level RF performance,
GPIO functionality, etc.
The ZICM35xSP0 Module uses the transceiver's primary RF ports for transmitting and should use Power Mode 1
(EMBER_TX_POWER_MODE_BOOST in the EmberZNet API).
The ZICM35xSP2 Module uses the transceiver's alternate RF ports for transmitting and should use Power Mode 2
(EMBER_TX_POWER_MODE_ALTERNATE in the EmberZNet API). GPIO PC5 must also be configured as
ALT_OUT (push /pull).
This document is subject to change without notice
Document No: 0011-00-07-01-000 (Issue H)
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EM35x Mini Modules
ABSOLUTE MAXIMUM RATINGS
MeshConnect ZICM35xSPx Module
Description
Unit
Min
Max
Power Supply Voltage (VDD)
-0.3
3.6
VDC
Voltage on any I/O Line
-0.3
VDD + 0.3
VDC
–
–
+15
+5
dBm
Storage Temperature Range
-40
125
°C
Reflow Soldering Temperature
–
260
°C
RF Input Power
ZICM35xSP0
ZICM35xSP2
Note: Exceeding the maximum ratings may cause permanent damage to the module or devices.
RECOMMENDED OPERATING CONDITIONS
MeshConnect ZICM35xSPx Module
Description
Power Supply Voltage (VDD)
Input Frequency
Ambient Temperature Range
Unit
Min
Typ
Max
2.1
3.3
3.6
VDC
2405
–
2480
MHz
-40
25
85
°C
DC CHARACTERISTICS (@ 25°C, VDD = 3.3V, ZICM35xSP0 TX Power Mode 1, ZICM35xSP2 TX Power Mode 2)
MeshConnect ZICM35xSPx Module
Description
Transmit Mode Current @ +8 dBm
Transmit Mode Current @ 0 dBm
ZICM35xSP0
Unit
Min
Typ
Max
–
44
–
mA
–
31
–
mA
Receive Mode Current
–
30
–
mA
Transmit Mode Current @ +20 dBm
–
150
–
mA
–
58
–
mA
Transmit Mode Current @ 0 dBm
ZICM35xSP2
Receive Mode Current
–
34
–
mA
Sleep Mode Current
ZICM357SPx
–
1
–
µA
Sleep Mode Current
ZICM358xSPx
–
2.4*
–
µA
*Note: The increased sleep current on the ZICM358xSPx is at 3.6VDC with all the RAM retained. Lower sleep currents
can be achieved if less RAM is retained during sleep.
This document is subject to change without notice
Document No: 0011-00-07-01-000 (Issue H)
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Contributor Member
EM35x Mini Modules
RF CHARACTERISTICS (@ 25°C, VDD = 3.3V, ZICM35xSP0 TX Power Mode 1, ZICM35xSP2 TX Power Mode 2)
MeshConnect ZICM35xSPx Module
Description
Unit
Min
Typ
Max
2405
–
2480
11
–
26
–
-96.2
–
96.2
kHz
–
+8
–
dBm
–
-40
–
dBm
Offset Error Vector Magnitude
–
5
35
%
Maximum Output Power
(using Power Mode 2, Power Setting -2)
–
+20
21
dBm
–
-40
–
dBm
–
5
35
%
–
-100
-94
dBm
0
–
–
dBm
–
-103
-97
dBm
-10
–
–
dBm
General Characteristics
RF Frequency Range
RF Channels
Frequency Error Tolerance
MHz
Transmitter
Maximum Output Power
Minimum Output Power
Minimum Output Power
ZICM35xSP0
ZICM35xSP2
Offset Error Vector Magnitude
Receiver
Sensitivity (1% PER, Boost Mode)
Saturation (Maximum Input Level)
Sensitivity (1% PER, Normal Mode)
Saturation (Maximum Input Level)
ZICM35xSP0
ZICM35xSP2
Note: The ZICM35xSP2, Power Mode 2 with Power Setting -2 is the maximum setting allowed for FCC
Compliance. Operating in Power Mode 3 at higher power settings may damage the PA.
This document is subject to change without notice
Document No: 0011-00-07-01-000 (Issue H)
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Contributor Member
EM35x Mini Modules
PIN SIGNALS I/O PORT CONFIGURATION
CEL’s MeshConnect Module has 33 edge I/O interfaces for connection to the user’s host board. See the
MeshConnect Module Dimensions Section which details the layout of the 33 edge castellations.
I/O PIN ASSIGNMENTS
CEL MeshConnect
ZICM35xSPx Module
Pin Number
EM35x IC
Pin Number
Name
1, 2, 12, 31, 33
49
GROUND
3
11
PC5
4
12
RESET
5
13
PC6
6
7
8
9
10
11
13
14
18
19
20
21
22
16, 23, 28, 37
PC7
PA7
PB3
PB4
PA0
PA1
VDD
15
16
17
18
19
20
21
25
26
27
29
30
31
32
PA2
PA3
PA4
PA5
PA6
PB1
PB2
JTCK
Digital I /O
22
33
PC2
Digital I /O
23
24
25
26
27
34
35
36
38
40
PC3
PC4
PB0
PC1
PC0
Digital I / O
Digital I / O
Digital I / O
Digital I / O
Digital I / O
32
NC
RF Out
14
28
29
30
24
41
42
43
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Document No: 0011-00-07-01-000 (Issue H)
PB7
PB6
PB5
Notes
ZICM35xSP0: Digital I/O
ZICM35xSP2: Dedicated as TX_ACTIVE. The EM35x baseband
controls TX_ACTIVE and drives it high when in TX mode; since it is
used internally in the module, PC5 is not connected to module I/O pin 3
Active Low chip reset (Input)
ZICM35xSP0: Digital I/O
ZICM35xSP2-1: Digital I/O
ZICM35xSP2-2: Used internally in the module; PC6 is not connected to
module I/O pin 5
Digital I /O
Digital I /O
Digital I /O
Digital I /O
Digital I /O
Digital I /O
Digital I /O
Digital I /O
Digital I /O
Digital I /O
Digital I /O
Digital I /O
JTAG clock input from debugger
Digital I /O
Digital I / O
Digital I / O
Castellation Pin for external Antenna
Page 10
Contributor Member
EM35x Mini Modules
MODULE DIMENSIONS
MeshConnect EM35x Mini Modules
EM300 Series Module
Pin 1
R1
C14
L2
R7
U1
C9
C6
C6A C1
L6
C6B
EM357
Series
ARM
R6
R9
C4A
C17
Pin 33
C22
R8
C5B
R2
C10
Pin 11
C24
R11 C23
L5
C11
L3
C13
L4
R10
0.940” (23.87 mm)
C21
C7
C7B
C20
C20
ZICM35xSPx 0000-00-00-00-000
R5
C2
R4
C16
XTAL1
C15
Pin 22
0.062” (1.57 mm)
0.152” (3.86 mm) MAX
0.655” (16.63 mm)
Note: All dimensions are +/- 0.005" (0.12 mm) unless otherwise specified.
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Document No: 0011-00-07-01-000 (Issue H)
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Contributor Member
EM35x Mini Modules
MODULE LAND FOOTPRINT
Dimensions are shown in inches, with millimeter conversions in brackets.
0.655” [16.64]
0.465” [11.80]
0.221” [5.61]
0.236” [5.98]
Ø0.140” [Ø3.56]
0.940” [23.88]
0.590” [14.98]
0.985” [25.02]
0.540” [13.73]
PITCH 0.050” [1.27]
33X 0.090” [2.29] X 0.040” [1.02]
0.084” [2.13]
0.084” [2.13]
0.082” [2.09]
0.490” [12.45]
0.746” [18.95]
Note: Refer to the Antenna Section in this document for layout recommendations which will yield optimal antenna performance.
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Document No: 0011-00-07-01-000 (Issue H)
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EM35x Mini Modules
PROCESSING
Recommended Reflow Profile
Parameter Values
Ramp Up Rate (from Tsoakmax to Tpeak)
3º /sec max
Tsoakmin
150º C
Tsoakmax
200º C
Soak Time
60-120 sec
TLiquidus
217º C
Time above TLiquidus
60-150 sec
Tpeak
250º C
Time within 5º of Tpeak
20-30 sec
Time from 25º to Tpeak
8 min max
Ramp Down Rate
6º C /sec max
Pb-Free Solder Paste
Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the soldering process.
Note: The quality of solder joints on the castellations ("half vias") where they contact the host board should meet the appropriate IPC
Specification. See the Castellated Terminations Section in the latest IPC-A-610 Acceptability of Electronic Assemblies document.
Cleaning
In general, cleaning the populated module is strongly discouraged. Residuals under the module cannot be easily
removed with any cleaning process.
•
•
•
Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host
board and the module. The combination of soldering flux residuals and encapsulated water could lead to
short circuits between neighboring pads. Water could also damage any stickers or labels.
Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the two
housings, which is not accessible for post-washing inspection. The solvent could also damage any
stickers or labels.
Ultrasonic cleaning could damage the module permanently.
The best approach is to consider using a “No Clean” solder paste and eliminate the post-soldering cleaning step.
Optical Inspection
After soldering the module to the host board, consider optical inspection to check the following:
• Proper alignment and centering of the module over the pads
• Proper solder joints on all pads
• Excessive solder or contacts to neighboring pads or vias
Repeating Reflow Soldering
Only a single reflow soldering process is encouraged for host boards.
Wave Soldering
If a wave soldering process is required on the host boards due to the presence of leaded components, only a
single wave soldering process is encouraged.
Hand Soldering
Hand soldering is possible. When using a soldering iron, follow IPC recommendations (reference document IPC-7711).
This document is subject to change without notice
Document No: 0011-00-07-01-000 (Issue H)
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EM35x Mini Modules
Rework
The MeshConnect Module can be unsoldered from the host board. Use of a hot air rework tool should be
programmable and the solder joint and module should not exceed the maximum peak reflow temperature
of 250º C.
Caution
If temperature ramps exceed the reflow temperature profile, module and component damage may occur due to
thermal shock. Avoid overheating.
Warning
Never attempt a rework on the module itself (i.e., replacing individual components); such actions will terminate
warranty coverage.
Additional Grounding
Attempts to improve the module or the system grounding by soldering braids, wires or cables onto the module
RF shield cover is done at the customer's own risk. The ground pins at the module perimeter should be sufficient
for optimum immunity to external RF interference.
This document is subject to change without notice
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AGENCY CERTIFICATIONS
The following Part Numbers are Certified as shown below:
Part Number
Certifications
Antenna
ZICM35xSP0-1
FCC, IC, CE
PCB
ZICM35xSP0-1C
FCC, IC, CE
E-2820-CA, LSR 001-0100
ZICM35xSP2-x
FCC, IC
PCB
ZICM35xSP2-xC
FCC, IC
Nearson S181AH-2450S
FCC and Canada Compliance Statement
This device complies with Part 15 of the FCC Rules and with IC Canada licence-exempt RSS Standards.
Operation is subject to the following two conditions:
1. This device may not cause harmful interference, and
2. This device must accept any interference received, including interference that may cause undesired operation.
Déclaration De Conformité FCC Et Au Canada
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.
L'exploitation est autorisée aux deux conditions suivantes:
1. l'appareil ne doit pas produire de brouillage, et
2. l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est
susceptible d'en compromettre le fonctionnement.
Warning (Part 15.21)
Changes or modifications not expressly approved by CEL could void the user's authority to operate the equipment.
20 cm Separation Distance
To comply with FCC /IC Canada RF exposure limits for general population /uncontrolled exposure, the antenna(s)
used for this transmitter must be installed to provide a separation distance of at least 20cm from all persons and
must not be co-located or operated in conjunction with any other antenna or transmitter except in accordance
with FCC muti-transmitter product procedures.
20cm Distance De Séparation
Pour se conformer aux limites d'exposition FCC / IC Canada RF pour la population générale / exposition non
contrôlée, l'antenne(s) utilisée pour ce transmetteur doit être installé pour fournir une distance de séparation d'au
moins 20cm de toutes les personnes et ne doit pas être co-implantés ou exploités en conjonction avec une autre
antenne ou émetteur, sauf en conformité avec les procédures de produits muti-émetteur FCC.
OEM Responsibility to the FCC and IC Rules and Regulations
The MeshConnect Mini Module has been certified per FCC Part 15 Rules and to IC Canada license-exempt
RSS Standards for integration into products without further testing or certification. To fulfill the FCC and IC
Certification requirements, the OEM of the MeshConnect Module must ensure that the information provided on
the MeshConnect label is placed on the outside of the final product. The MeshConnect Mini Module is labeled
with its own FCC ID Number and IC ID Number. If the FCC ID and the IC ID are not visible when the module is
installed inside another device, then the outside of the device into which the module is installed must also display
a label referring to the enclosed module. The exterior label can use wording such as the following:
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EM35x Mini Modules
or
“Contains Transmitter Module FCC ID: W7Z-ZICM357SP0” or “Contains FCC ID: W7Z-ZICM357SP0”
“Contains Transmitter Module IC: 8254A-ZICM357SP0" or "Contains IC: 8254A-ZICM357SP0”
“Contains Transmitter Module FCC ID: W7Z-ZICM357SP2” or “Contains FCC ID: W7Z-ZICM357SP2”
“Contains Transmitter Module IC: 8254A-ZICM357SP2" or "Contains IC: 8254A-ZICM357SP2”
The OEM of the MeshConnect Mini Module may only use the approved antennas (PCB Trace Antenna and external
antenna) that have been certified with this module. The OEM of the MeshConnect Mini Module must test their final
product configuration to comply with Unintentional Radiator Limits before declaring FCC Compliance per Part 15 of
the FCC Rules. The OEM must also include in their manual the following statement:
FCC and Canada Compliance Statement
This device complies with Part 15 of the FCC Rules and with IC Canada licence-exempt RSS Standards.
Operation is subject to the following two conditions:
1. This device may not cause harmful interference, and
2. This device must accept any interference received, including interference that may cause undesired operation.
Déclaration De Conformité FCC Et Au Canada
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence.
L'exploitation est autorisée aux deux conditions suivantes:
1. l'appareil ne doit pas produire de brouillage, et
2. l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est
susceptible d'en compromettre le fonctionnement.
In addition to using only the approved external antennas, the OEM must follow the layout described in the "Mini
Module External Antenna Implementation Guide" to be covered by the current approval.
CE Certification — Europe
The MeshConnect ZICM35xSP0 Module has been tested and certified for use in the European Union.
OEM Responsibility to the European Union Compliance Rules
If the MeshConnect Module is to be incorporated into a product, the OEM must verify compliance of the final
product to the European Harmonized EMC and Low-Voltage/Safety Standards. A Declaration of Conformity must
be issued for each of these standards and kept on file as described in Annex II of the R&TTE Directive.
The manufacturer must maintain the user guide and adhere to the settings described in the manual for maintaining
European Union Compliance. If any of the specifications are exceeded in the final product, the OEM is required to
make a submission to the notified body for compliance testing.
This document is subject to change without notice
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EM35x Mini Modules
OEM Labeling Requirements
The CE mark must be placed on the OEM product in a visible location. The CE mark shall consist of the initials
CE with the following form:
·
·
·
If the CE marking is reduced or enlarged, the proportions given in the CE
graduated drawing (to the right) must be adhered to
The CE mark must be a minimum of 5 mm in height
If the use of the module is subject to restrictions in the end application, the CE
marking on the OEM product should also include the alert sign as shown in the
image to the right
Software Compliance
The MeshConnect Mini Modules require software restrictions to meet agency certification requirements.
These restrictions have been implemented in the sample application included with the Software Development Kit.
If a customer is not starting with the CEL Software Development Kit, they must implement the following output
power restrictions to use the FCC, IC or CE Certifications:
Part Number
ZICM35xSP0-1
Certification
FCC /IC
ETSI
ZICM35xSP0-1C
FCC /IC
ETSI
ZICM35xSP2-x
ZICM35xSP2-xC
FCC /IC
FCC /IC
RF Channel
Valid TX
Power Steps
Typical Max
Output Power
11 - 25
-43 to 8
8 dBm
26
-43 to 0
1 dBm
11 - 26
-43 to 8
8 dBm
11 - 25
-43 to 8
8 dBm
26
-43 to -7
-7 dBm
11 - 26
-43 to 8
8 dBm
11 - 24
-43 to -2
20 dBm
25
-43 to -6
17 dBm
26
-43 to -21
-5 dBm
11 - 24
-43 to -2
20 dBm
25
-43 to -12
9 dBm
26
-43 to -21
-5 dBm
Note: The ZICM35xSP2, Power Mode 2 with Power Setting -2 is the maximum setting allowed for FCC Compliance.
Operating in Power Mode 3 at higher power settings may damage the PA.
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EM35x Mini Modules
SHIPMENT, HANDLING AND STORAGE
Shipment
The MeshConnect Modules are delivered in Tape and Reel for easy assembly in a manufacturing environment.
The reel diameter is 12.992 inches (330 mm) and contains 600 modules
Tape and Reel Dimensions
Measurements are in inches [mm]
Handling
The MeshConnect Modules are designed and packaged to be processed in an automated assembly line.
0.079±0.004 [2.00±0.10]
0.157 [4.00] PITCH
0.957±0.004 [24.30±0.10]
0.071±0.004 [1.75±0.10]
A
B
B
0.795±0.006 [20.20±0.15]
1.732±0.011 [44.00±0.30]
0.014±0.002 [0.35±0.05]
0.169±0.004 [4.30±0.10]
A
0.945±0.004 [24.00±0.10]
0.669±0.004 [17.00±0.10]
SECTION A-A
SECTION B-B
Warning
The MeshConnect Modules contain highly sensitive electronic circuitry. Handling without proper ESD protection
may destroy or damage the module permanently.
Warning
The MeshConnect Modules are moisture-sensitive devices. Appropriate handling instructions and precautions
are summarized in J-STD-033. Read carefully to prevent permanent damage due to moisture intake.
Moisture Sensitivity Level (MSL)
MSL 3, per J-STD-033
Storage
Storage /shelf life in sealed bags is 12 months at < 40°C and < 90% relative humidity.
QUALITY
CEL Modules offer the highest quality at competitive prices. Our modules are manufactured in compliance with
the IPC-A-610 specification, Class II. Our modules go through JESD22 qualification processes which include
high temperature operating life tests, mechanical shock, temperature cycling, humidity and reflow testing. CEL
conducts RF and DC factory testing on 100% of all production parts.
CEL builds the quality into our products, giving our customers confidence when integrating our products into
their systems.
This document is subject to change without notice
Document No: 0011-00-07-01-000 (Issue H)
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EM35x Mini Modules
REFERENCES
Download
Reference Documents
120-035X-000 - Silicon Labs /Ember EM35x SoC Datasheet
Link
0011-02-17-00-000 - CEL EM35x Ember Mini Module Companion Kit Technical User Guide
Link
0011-01-16-05-000 - Using the ZICM35xSPx Mini Module Programming Fixture
Link
0011-00-16-11-000 - CEL ZICM35xSP2-1C External Antenna Implementation
Link
REVISION HISTORY
Previous Versions
Changes to Current Version
Page(s)
0011-00-07-01-000
(Issue A) July 22, 2013
Initial Preliminary Datasheet
0011-00-07-01-000
(Issue B) August 1, 2013
Updated Development Tools Section, Antenna Section, Agency Certifications,
Software Compliance Section
0011-00-07-01-000
(Issue C) February 10, 2014
Updated Tape and Reel Packaging
0011-00-07-01-000
(Issue D) March 17, 2014
Updated ZICM358xSPx Sleep Mode Current. Removed "Preliminary" status for this
datasheet. Updated Software Compliance "Valid" TX Power Steps" table values
0011-00-07-01-000
(Issue E) March 18, 2014
This datasheet is now a "Preliminary Datasheet" due to the addition of new part numbers
(ZICM357SP2-2, ZICM357SP2-2-R, ZICM357SP2-2C and ZICM357SP2-2C-R) to the
"Ordering Information". Added new "ZICM35xSPx Product Comparison Table".
1, 3
0011-00-07-01-000
(Issue F) July 15, 2014
Removed "Preliminary" status for this datasheet. Updated Programming Fixture
Product Photography
1, 5
0011-00-07-01-000
(Issue G) July 20, 2014
Added part numbers ZICM3588SP2-2(C), updated Logos
0011-00-07-01-000
(Issue H) October 11, 2016
Changed "Industry Canada" to "IC Canada" throughout document. Updated Antenna
Section and added a new part number to Agency Certifications table.
Added ZICM35xSP0-1C to Software compliance table. Removed option for tray
configuration
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Disclaimer
The information in this document is current as of the published date. The information is subject to change without notice. For actual
design-in, refer to the latest publications of CEL Data Sheets or Data Books, etc., for the most up-to-date specifications of CEL
products. Not all products and/or types are available in every country. Please check with an CEL sales representative for availability and
additional information.
No part of this document may be copied or reproduced in any form or by any means without the prior written consent of CEL.
CEL assumes no responsibility for any errors that may appear in this document.
CEL does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising
from the use of CEL products listed in this document or any other liability arising from the use of such products. No license, express,
implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of CEL or others.
Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor
product operation and application examples. The incorporation of these circuits, software and information in the design of a customer’s
equipment shall be done under the full responsibility of the customer. CEL assumes no responsibility for any losses incurred by
customers or third parties arising from the use of these circuits, software and information.
While CEL endeavors to enhance the quality, reliability and safety of CEL products, customers agree and acknowledge that the
possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons
arising from defects in CEL products, customers must incorporate sufficient safety measures in their design, such as redundancy, firecontainment and anti-failure features.
For More Information
For more information about CEL MeshConnect products and solutions, visit our website at:
www.cel.com/MeshConnect.
Technical Assistance
For Technical Assistance, visit www.cel.com/MeshConnectHelp.
This document is subject to change without notice
Document No: 0011-00-07-01-000 (Issue H)
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