2N3250

2N3250 2N3251 2N3250A 2N3251A SILICON PNP TRANSISTORS w w w. c e n t r a l s e m i . c o m DESCRIPTION: The CENTRAL SEMICONDUCTOR 2N3250, 2N3251 series devices are silicon PNP transistors designed for small signal, general purpose switching applications. MARKING: FULL PART NUMBER TO-18 CASE MAXIMUM RATINGS: (TA=25°C unless otherwise noted) 2N3250 2N3250A SYMBOL 2N3251 2N3251A UNITS Collector-Base Voltage VCBO 50 60 V Collector-Emitter Voltage VCEO 40 60 V Emitter-Base Voltage VEBO 5.0 V Continuous Collector Current IC 200 mA Power Dissipation PD 360 mW Power Dissipation (TC=25°C) PD 1.2 W Operating and Storage Junction Temperature TJ, Tstg -65 to +200 °C Thermal Resistance ΘJC 146 °C/W Thermal Resistance ΘJA 486 °C/W ELECTRICAL CHARACTERISTICS: (TA=25°C unless otherwise noted) SYMBOL TEST CONDITIONS MIN MAX UNITS ICEV VCE=40V, VEB=3.0V 20 nA BVCBO IC=10µA (2N3250, 2N3251) 50 V BVCBO IC=10µA (2N3250A, 2N3251A) 60 V BVCEO IC=10mA (2N3250, 2N3251) 40 V BVCEO IC=10mA (2N3250A, 2N3251A) 60 V BVEBO IE=10µA 5.0 V VCE(SAT) IC=10mA, IB=1.0mA 0.25 V VCE(SAT) IC=50mA, IB=5.0mA 0.50 V VBE(SAT) IC=10mA, IB=1.0mA 0.60 0.90 V VBE(SAT) IC=50mA, IB=5.0mA 1.20 V hFE VCE=1.0V, IC=0.1mA hFE VCE=1.0V, IC=1.0mA hFE VCE=1.0V, IC=10mA hFE VCE=1.0V, IC=50mA 2N3250 2N3251 2N3250A 2N3251A MIN MAX MIN MAX 40 - 80 45 - 90 50 150 100 300 15 - 30 - R2 (29-June 2022) 2N3250 2N3251 2N3250A 2N3251A SILICON PNP TRANSISTORS ELECTRICAL CHARACTERISTICS - Continued: (TA=25°C unless otherwise noted) 2N3250 2N3251 2N3250A 2N3251A SYMBOL TEST CONDITIONS MIN MAX MIN MAX UNITS fT VCE=20V, IC=10mA, f=100MHz 250 - 300 - MHz Cob VCB=10V, IE=0, f=100kHz - 6.0 - 6.0 pF Cib VEB=1.0V, IC=0, f=100kHz - 101 - 101 pF NF VCE=5.0V, IC=100μA, Rs=1.0kΩ, f=100Hz - 6.0 - 6.0 dB ton VCC=3.0V, VBE=0.5V, IC=10mA, IB1=1.0mA - 70 - 70 ns toff VCC=3.0V, IC=10mA, IB1=IB2=1.0mA - 225 - 250 ns Note 1: Typical limit TO-18 CASE - MECHANICAL OUTLINE LEAD CODE: 1) Emitter 2) Base 3) Collector MARKING: FULL PART NUMBER R2 (29-June 2022) w w w. c e n t r a l s e m i . c o m OUTSTANDING SUPPORT AND SUPERIOR SERVICES PRODUCT SUPPORT Central’s operations team provides the highest level of support to insure product is delivered on-time. • Supply management (Customer portals) • Custom bar coding for shipments • Inventory bonding • Custom product packing • Consolidated shipping options DESIGNER SUPPORT/SERVICES Central’s applications engineering team is ready to discuss your design challenges. Just ask. • Free quick ship samples (2nd day air) • Special wafer diffusions • Online technical data and parametric search • PbSn plating options • SPICE models • Package details • Custom electrical curves • Application notes • Environmental regulation compliance • Application and design sample kits • Customer specific screening • Custom product and package development • Up-screening capabilities REQUESTING PRODUCT PLATING 1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when ordering (example: 2N2222A TIN/LEAD). 2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number when ordering (example: 2N2222A PBFREE). CONTACT US Corporate Headquarters & Customer Support Team Central Semiconductor Corp. 145 Adams Avenue Hauppauge, NY 11788 USA Main Tel: (631) 435-1110 Main Fax: (631) 435-1824 Support Team Fax: (631) 435-3388 www.centralsemi.com Worldwide Field Representatives: www.centralsemi.com/wwreps Worldwide Distributors: www.centralsemi.com/wwdistributors For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER, which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms w w w. c e n t r a l s e m i . c o m (001)