CBRHD-01BK

CBRHD-01 SURFACE MOUNT SILICON HIGH DENSITY 0.8 AMP BRIDGE RECTIFIER w w w. c e n t r a l s e m i . c o m DESCRIPTION: The CENTRAL SEMICONDUCTOR CBRHD-01 is a silicon full wave bridge rectifier mounted in a durable epoxy surface mount molded case, utilizing glass passivated chips. MARKING CODE: CBD1 FEATURES: HD DIP CASE • Efficient use of board space: requires only 42mm2 of board space vs. 120mm2 of board space needed for industry standard 1.0 Amp surface mount bridge rectifier. • 50% higher density (Amps/mm2) than the industry standard 1.0 Amp surface mount bridge rectifier. • Glass passivated chips for high reliability. MAXIMUM RATINGS: (TA=25°C unless otherwise noted) Peak Repetitive Reverse Voltage SYMBOL VRRM DC Blocking Voltage RMS Reverse Voltage Average Forward Current (TA=40°C) (Note1) Average Forward Current (TA=40°C) (Note 2) Peak Forward Surge Current Operating and Storage Junction Temperature Thermal Resistance (Note 3) 100 UNITS V VR VR(RMS) IO 100 V 70 V 0.5 A IO 0.8 A IFSM TJ, Tstg ΘJA 30 A -65 to +150 °C 85 °C/W ELECTRICAL CHARACTERISTICS PER DIODE: (TA=25°C unless otherwise noted) SYMBOL TEST CONDITIONS TYP MAX IR VR= 100V 5.0 IR VF VR= 100V, TA=125°C IF=400mA CJ VR=4.0V, f=1.0MHz 500 1.0 9.0 UNITS µA µA V pF Notes: (1) Mounted on Glass-Epoxy PCB. (2) Mounted on Ceramic PCB. (3) Mounted on PCB with 0.5” x 0.5” copper pads. R4 (19-August 2020) CBRHD-01 SURFACE MOUNT SILICON HIGH DENSITY 0.8 AMP BRIDGE RECTIFIER HD DIP CASE - MECHANICAL OUTLINE SYMBOL A B C D E F G H J K L DIMENSIONS INCHES MILLIMETERS MIN MAX MIN MAX 0.006 0.014 0.15 0.35 0.275 7.00 0.027 0.043 0.70 1.10 0.035 0.051 0.90 1.30 0.090 0.106 2.30 2.70 0.019 0.031 0.50 0.80 0.146 0.165 3.70 4.20 0.051 0.067 1.30 1.70 0.177 0.193 4.50 4.90 0.090 0.106 2.30 2.70 0.000 0.008 0.00 0.20 HD DIP (REV: R3) MARKING CODE: CBD1 R4 (19-August 2020) w w w. c e n t r a l s e m i . c o m OUTSTANDING SUPPORT AND SUPERIOR SERVICES PRODUCT SUPPORT Central’s operations team provides the highest level of support to insure product is delivered on-time. • Supply management (Customer portals) • Custom bar coding for shipments • Inventory bonding • Custom product packing • Consolidated shipping options DESIGNER SUPPORT/SERVICES Central’s applications engineering team is ready to discuss your design challenges. Just ask. • Free quick ship samples (2nd day air) • Special wafer diffusions • Online technical data and parametric search • PbSn plating options • SPICE models • Package details • Custom electrical curves • Application notes • Environmental regulation compliance • Application and design sample kits • Customer specific screening • Custom product and package development • Up-screening capabilities REQUESTING PRODUCT PLATING 1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when ordering (example: 2N2222A TIN/LEAD). 2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number when ordering (example: 2N2222A PBFREE). CONTACT US Corporate Headquarters & Customer Support Team Central Semiconductor Corp. 145 Adams Avenue Hauppauge, NY 11788 USA Main Tel: (631) 435-1110 Main Fax: (631) 435-1824 Support Team Fax: (631) 435-3388 www.centralsemi.com Worldwide Field Representatives: www.centralsemi.com/wwreps Worldwide Distributors: www.centralsemi.com/wwdistributors For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER, which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms w w w. c e n t r a l s e m i . c o m (001)