CFSH01-30
w w w. c e n t r a l s e m i . c o m
SURFACE MOUNT SILICON
SCHOTTKY DIODE
DESCRIPTION:
The CENTRAL SEMICONDUCTOR CFSH01-30 is
a high quality Schottky diode designed for applications
where ultra small size and low leakage current
are prime requirements. Packaged in a SOD-882L
package, this component provides performance
characteristics suitable for the most demanding size
constrained applications.
MARKING CODE: Z
SOD-882L CASE
APPLICATIONS:
FEATURES:
• DC-DC converters
• Voltage clamping
• Protection circuits
• Battery powered applications including
cell phones, digital cameras, pagers,
PDAs, laptop computers, etc.
• Current (IO=100mA)
• Very low reverse current (30nA TYP @ 10V)
• Low forward voltage drop (VF=0.41V TYP @ 10mA)
• Small, ultra low profile 1.0mm x 0.6mm x 0.4mm
leadless surface mount package
MAXIMUM RATINGS: (TA=25°C)
Peak Repetitive Reverse Voltage
SYMBOL
VRRM
30
UNITS
V
IO
100
mA
IFSM
500
mA
PD
100
mW
Average Forward Current
Peak Forward Surge Current, tp=8.3ms
Power Dissipation
Operating Junction Temperature
TJ
-65 to +125
°C
Storage Temperature
Tstg
-65 to +150
°C
Thermal Resistance
ΘJA
1000
°C/W
ELECTRICAL
SYMBOL
IR
CHARACTERISTICS: (TA=25°C unless otherwise noted)
TEST CONDITIONS
MIN
TYP
VR=10V
30
BVR
IR=100μA
VF
IF=10mA
0.41
CJ
VR=0, f=1.0MHz
7.0
MAX
300
30
UNITS
nA
V
0.46
V
pF
R1 (29-September 2015)
CFSH01-30
SURFACE MOUNT SILICON
SCHOTTKY DIODE
SOD-882L CASE - MECHANICAL OUTLINE
LEAD CODE:
1) Cathode
2) Anode
MARKING CODE: Z
R1 (29-September 2015)
w w w. c e n t r a l s e m i . c o m
CFSH01-30
SURFACE MOUNT SILICON
SCHOTTKY DIODE
TYPICAL ELECTRICAL CHARACTERISTICS
R1 (29-September 2015)
w w w. c e n t r a l s e m i . c o m
CFSH01-30
SURFACE MOUNT SILICON
SCHOTTKY DIODE
TYPICAL ELECTRICAL CHARACTERISTICS
R1 (29-September 2015)
w w w. c e n t r a l s e m i . c o m
OUTSTANDING SUPPORT AND SUPERIOR SERVICES
PRODUCT SUPPORT
Central’s operations team provides the highest level of support to insure product is delivered on-time.
• Supply management (Customer portals)
• Custom bar coding for shipments
• Inventory bonding
• Custom product packing
• Consolidated shipping options
DESIGNER SUPPORT/SERVICES
Central’s applications engineering team is ready to discuss your design challenges. Just ask.
• Free quick ship samples (2nd day air)
• Special wafer diffusions
• Online technical data and parametric search
• PbSn plating options
• SPICE models
• Package details
• Custom electrical curves
• Application notes
• Environmental regulation compliance
• Application and design sample kits
• Customer specific screening
• Custom product and package development
• Up-screening capabilities
REQUESTING PRODUCT PLATING
1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when
ordering (example: 2N2222A TIN/LEAD).
2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number
when ordering (example: 2N2222A PBFREE).
CONTACT US
Corporate Headquarters & Customer Support Team
Central Semiconductor Corp.
145 Adams Avenue
Hauppauge, NY 11788 USA
Main Tel: (631) 435-1110
Main Fax: (631) 435-1824
Support Team Fax: (631) 435-3388
www.centralsemi.com
Worldwide Field Representatives:
www.centralsemi.com/wwreps
Worldwide Distributors:
www.centralsemi.com/wwdistributors
For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER,
which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms
w w w. c e n t r a l s e m i . c o m
(001)
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