CMKT2907A
CMKT2907AG
SURFACE MOUNT
DUAL PNP SILICON TRANSISTORS
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DESCRIPTION:
The CENTRAL SEMICONDUCTOR CMKT2907A and
CMKT2907AG each consist of two individual isolated
2907A PNP silicon transistors, manufactured by the
epitaxial planar process and epoxy molded in an
SOT-363 surface mount package. This ULTRAmini™
device has been designed for small signal general
purpose and switching applications.
• The CMKT2907AG is Halogen Free by design.
SOT-363 CASE
MAXIMUM RATINGS: (TA=25°C)
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Continuous Collector Current
Power Dissipation
Operating and Storage Junction Temperature
Thermal Resistance
MARKING CODES:
CMKT2907A: K07
SYMBOL
VCBO
VCEO
VEBO
IC
PD
TJ, Tstg
ΘJA
CMKT2907AG: K7G
UNITS
V
V
V
mA
mW
°C
°C/W
60
60
5.0
600
350
-65 to +150
357
ELECTRICAL CHARACTERISTICS PER TRANSISTOR: (TA=25°C unless otherwise noted)
SYMBOL
TEST CONDITIONS
MIN
MAX
ICBO
VCB=50V
10
ICBO
VCB=50V, TA=125°C
10
ICEV
µA
BVCBO
VCE=30V, VBE=0.5V
IC=10µA
60
V
BVCEO
IC=10mA
60
V
BVEBO
IE=10µA
5.0
VCE(SAT)
IC=150mA, IB=15mA
IC=500mA, IB=50mA
0.4
V
1.6
V
IC=150mA, IB=15mA
IC=500mA, IB=50mA
1.3
V
2.6
V
VCE(SAT)
VBE(SAT)
VBE(SAT)
hFE
hFE
hFE
hFE
hFE
VCE=10V, IC=0.1mA
VCE=10V, IC=1.0mA
VCE=10V, IC=10mA
VCE=10V, IC=150mA
VCE=10V, IC=500mA
50
UNITS
nA
nA
V
75
100
100
100
300
50
R4 (13-January 2010)
CMKT2907A
CMKT2907AG
SURFACE MOUNT
DUAL PNP SILICON TRANSISTORS
ELECTRICAL CHARACTERISTICS PER TRANSISTOR - Continued:
SYMBOL
TEST CONDITIONS
MIN
fT
VCE=20V, IC=50mA, f=100MHz
200
Cob
Cib
ton
td
tr
toff
ts
tf
MAX
UNITS
MHz
VCB=10V, IE=0, f=1.0MHz
VBE=2.0V, IC=0, f=1.0MHz
8.0
pF
30
pF
VCC=30V, VBE=0.5V, IC=150mA, IB1=15mA
VCC=30V, VBE=0.5V, IC=150mA, IB1=15mA
VCC=30V, VBE=0.5V, IC=150mA, IB1=15mA
45
ns
10
ns
40
ns
VCC=6.0V, IC=150mA, IB1=IB2=15mA
VCC=6.0V, IC=150mA, IB1=IB2=15mA
VCC=6.0V, IC=150mA, IB1=IB2=15mA
100
ns
80
ns
30
ns
SOT-363 CASE - MECHANICAL OUTLINE
LEAD CODE:
1) Emitter Q1
2) Base Q1
3) Collector Q2
4) Emitter Q2
5) Base Q2
6) Collector Q1
MARKING CODES:
CMKT2907A: K07
CMKT2907AG: K7G
R4 (13-January 2010)
w w w. c e n t r a l s e m i . c o m
OUTSTANDING SUPPORT AND SUPERIOR SERVICES
PRODUCT SUPPORT
Central’s operations team provides the highest level of support to insure product is delivered on-time.
• Supply management (Customer portals)
• Custom bar coding for shipments
• Inventory bonding
• Custom product packing
• Consolidated shipping options
DESIGNER SUPPORT/SERVICES
Central’s applications engineering team is ready to discuss your design challenges. Just ask.
• Free quick ship samples (2nd day air)
• Special wafer diffusions
• Online technical data and parametric search
• PbSn plating options
• SPICE models
• Package details
• Custom electrical curves
• Application notes
• Environmental regulation compliance
• Application and design sample kits
• Customer specific screening
• Custom product and package development
• Up-screening capabilities
REQUESTING PRODUCT PLATING
1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when
ordering (example: 2N2222A TIN/LEAD).
2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number
when ordering (example: 2N2222A PBFREE).
CONTACT US
Corporate Headquarters & Customer Support Team
Central Semiconductor Corp.
145 Adams Avenue
Hauppauge, NY 11788 USA
Main Tel: (631) 435-1110
Main Fax: (631) 435-1824
Support Team Fax: (631) 435-3388
www.centralsemi.com
Worldwide Field Representatives:
www.centralsemi.com/wwreps
Worldwide Distributors:
www.centralsemi.com/wwdistributors
For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER,
which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms
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