CMKT5089M10
SURFACE MOUNT
DUAL NPN SILICON
MATCHED hFE TRANSISTORS
SOT-363 CASE
MAXIMUM RATINGS: (TA=25°C)
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Continuous Collector Current
Power Dissipation
Operating and Storage Junction Temperature
Thermal Resistance
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DESCRIPTION:
The CENTRAL SEMICONDUCTOR CMKT5089M10
consists of two (2) individually isolated 5089
NPN silicon transistors with matched hFE. This
ULTRAmini™ device is manufactured by the epitaxial
planar process and epoxy molded in an SOT-363
surface mount package. The CMKT5089M10 has
been designed for applications requiring high gain
and low noise.
MARKING CODE: C9M0
SYMBOL
VCBO
VCEO
VEBO
IC
PD
TJ, Tstg
ΘJA
UNITS
V
V
V
mA
mW
°C
°C/W
30
25
4.5
50
350
-65 to +150
357
ELECTRICAL CHARACTERISTICS PER TRANSISTOR: (TA=25°C unless otherwise noted)
SYMBOL
TEST CONDITIONS
MIN
MAX
ICBO
VCB=15V
50
IEBO
VEB=4.5V
100
UNITS
nA
nA
BVCBO
IC=100μA
30
V
BVCEO
IC=1.0mA
25
V
BVEBO
IE=100μA
4.5
VCE(SAT)
IC=10mA, IB=1.0mA
IC=10mA, IB=1.0mA
VBE(SAT)
hFE
hFE
hFE
fT
Cob
Cib
hfe
NF
VCE=5.0V, IC=0.1mA
VCE=5.0V, IC=1.0mA
400
VCE=5.0V, IC=10mA
VCE=5.0V, IC=500μA, f=20MHz
400
* The lowest hFE reading is taken as hFE1.
0.8
V
1200
50
450
f=10Hz to 15.7kHz
MATCHING CHARACTERISTICS:
SYMBOL
TEST CONDITIONS
hFE1/hFE2 *
VCE=5.0V, IC=1.0mA
|VBE1-VBE2| VCE=5.0V, IC=100μA
V
450
VCB=5.0V, IE=0, f=1.0MHz
VBE=0.5V, IC=0, f=1.0MHz
VCE=5.0V, IC=1.0mA, f=1.0kHz
VCE=5.0V, IC=100μA, RS=1.0kΩ,
V
0.5
MIN
0.9
MHz
4.0
pF
10
pF
1800
2.0
dB
MAX
1.0
5.0
UNITS
mV
R4 (13-January 2010)
CMKT5089M10
SURFACE MOUNT
DUAL NPN SILICON
MATCHED hFE TRANSISTORS
SOT-363 CASE - MECHANICAL OUTLINE
PIN CONFIGURATION
LEAD CODE:
1) Emitter Q1
2) Base Q1
3) Collector Q2
4) Emitter Q2
5) Base Q2
6) Collector Q1
MARKING CODE: C9M0
R4 (13-January 2010)
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OUTSTANDING SUPPORT AND SUPERIOR SERVICES
PRODUCT SUPPORT
Central’s operations team provides the highest level of support to insure product is delivered on-time.
• Supply management (Customer portals)
• Custom bar coding for shipments
• Inventory bonding
• Custom product packing
• Consolidated shipping options
DESIGNER SUPPORT/SERVICES
Central’s applications engineering team is ready to discuss your design challenges. Just ask.
• Free quick ship samples (2nd day air)
• Special wafer diffusions
• Online technical data and parametric search
• PbSn plating options
• SPICE models
• Package details
• Custom electrical curves
• Application notes
• Environmental regulation compliance
• Application and design sample kits
• Customer specific screening
• Custom product and package development
• Up-screening capabilities
REQUESTING PRODUCT PLATING
1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when
ordering (example: 2N2222A TIN/LEAD).
2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number
when ordering (example: 2N2222A PBFREE).
CONTACT US
Corporate Headquarters & Customer Support Team
Central Semiconductor Corp.
145 Adams Avenue
Hauppauge, NY 11788 USA
Main Tel: (631) 435-1110
Main Fax: (631) 435-1824
Support Team Fax: (631) 435-3388
www.centralsemi.com
Worldwide Field Representatives:
www.centralsemi.com/wwreps
Worldwide Distributors:
www.centralsemi.com/wwdistributors
For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER,
which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms
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