CMLDM7003

CMLDM7003

  • 厂商:

    CENTRAL(中环)

  • 封装:

  • 描述:

    CMLDM7003 - SURFACE MOUNT DUAL N-CHANNEL ENHANCEMENT-MODE SILICON MOSFET - Central Semiconductor Cor...

  • 详情介绍
  • 数据手册
  • 价格&库存
CMLDM7003 数据手册
CMLDM7003 CMLDM7003G* CMLDM7003J SURFACE MOUNT DUAL N-CHANNEL ENHANCEMENT-MODE SILICON MOSFET w w w. c e n t r a l s e m i . c o m DESCRIPTION: These CENTRAL SEMICONDUCTOR devices are dual Enhancement-mode N-Channel Field Effect Transistors, manufactured by the N-Channel DMOS Process, designed for high speed pulsed amplifier and driver applications. The CMLDM7003 utilizes the USA pinout configuration, while the CMLDM7003J utilizes the Japanese pinout configuration. These devices offer low rDS(ON) and ESD protection up to 2kV. MARKING CODES: CMLDM7003: C30 CMLDM7003G*: C3G CMLDM7003J: C3J SYMBOL VDS VDG VGS ID IDM PD PD PD TJ, Tstg ΘJA UNITS V V V mA A mW mW mW °C °C/W SOT-563 CASE * Device is Halogen Free by design MAXIMUM RATINGS: (TA=25°C) Drain-Source Voltage Drain-Gate Voltage Gate-Source Voltage Continuous Drain Current Maximum Pulsed Drain Current Power Dissipation (Note 1) Power Dissipation (Note 2) Power Dissipation (Note 3) Operating and Storage Junction Temperature Thermal Resistance 50 50 12 280 1.5 350 300 150 -65 to +150 357 ELECTRICAL CHARACTERISTICS PER TRANSISTOR: (TA=25°C unless otherwise noted) SYMBOL TEST CONDITIONS MIN TYP MAX IGSSF, IGSSR VGS=5.0V 100 IGSSF, IGSSR VGS=10V 2.0 IGSSF, IGSSR VGS=12V 2.0 IDSS VDS=50V, VGS=0 50 BVDSS VGS=0, ID=10μA 50 VGS(th) VDS=VGS, ID=250μA 0.49 1.0 VSD VGS=0, IS=115mA 1.4 rDS(ON) VGS=1.8V, ID=50mA 1.6 3.0 rDS(ON) VGS=2.5V, ID=50mA 1.3 2.5 rDS(ON) VGS=5.0V, ID=50mA 1.1 2.0 gFS VDS=10V, ID=200mA 200 Crss VDS=25V, VGS=0, f=1.0MHz 5.0 Ciss VDS=25V, VGS=0, f=1.0MHz 50 Coss VDS=25V, VGS=0, f=1.0MHz 25 Notes: (1) Ceramic or aluminum core PC Board with copper mounting pad area of 4.0mm2 (2) FR-4 Epoxy PC Board with copper mounting pad area of 4.0mm2 (3) FR-4 Epoxy PC Board with copper mounting pad area of 1.4mm2 UNITS nA μA μA nA V V V Ω Ω Ω mS pF pF pF R6 (18-January 2010) CMLDM7003 CMLDM7003G* CMLDM7003J SURFACE MOUNT DUAL N-CHANNEL ENHANCEMENT-MODE SILICON MOSFET SOT-563 CASE - MECHANICAL OUTLINE PIN CONFIGURATIONS CMLDM7003 (USA Pinout) CMLDM7003G* CMLDM7003J (Japanese Pinout) LEAD CODE: 1) Gate Q1 2) Source Q1 3) Drain Q2 4) Gate Q2 5) Source Q2 6) Drain Q1 MARKING CODES: CMLDM7003: C30 CMLDM7003G*: C3G * Device is Halogen Free by design LEAD CODE: 1) Source Q1 2) Gate Q1 3) Drain Q2 4) Source Q2 5) Gate Q2 6) Drain Q1 MARKING CODE: C3J R6 (18-January 2010) w w w. c e n t r a l s e m i . c o m
CMLDM7003
1. 物料型号: - CMLDM7003 - CMLDM7003G(无卤设计) - CMLDM7003J(日本引脚配置)

2. 器件简介: - 这些是中央半导体公司的双增强型N沟道MOSFET,采用N沟道DMOS工艺制造,设计用于高速脉冲放大器和驱动应用。CMLDM7003采用美国引脚配置,而CMLDM7003J采用日本引脚配置。这些器件提供低导通电阻和高达2kV的ESD保护。

3. 引脚分配: - CMLDM7003(美国引脚配置): - 1)Gate Q1 - 2)Source Q1 - 3)Drain Q2 - 4)Gate Q2 - 5)Source Q2 - 6)Drain Q1 - CMLDM7003J(日本引脚配置): - 1)Source Q1 - 2)Gate Q1 - 3)Drain Q2 - 4)Source Q2 - 5)Gate Q2 - 6)Drain Q1

4. 参数特性: - 最大漏源电压(VDS):50V - 最大漏栅电压(VDG):50V - 最大栅源电压(VGs):12V - 连续漏电流(ID):280mA - 最大脉冲漏电流(M):1.5A - 功耗(PD):350mW(陶瓷或铝芯PCB,铜敷垫面积4.0mm²)、300mW(FR-4环氧PCB,铜敷垫面积4.0mm²)、150mW(FR-4环氧PCB,铜敷垫面积1.4mm²) - 工作和存储结温(TJTstg):-65至+150°C - 热阻(OJA):357°C/W

5. 功能详解: - 电气特性表提供了在不同条件下的最小、典型和最大值,如栅源电流(IGSSF,IGSSR)、漏源电压(BVDSS)、栅源阈值电压(VGS(th))、导通电阻(rDS(ON))等。

6. 应用信息: - 适用于高速脉冲放大器和驱动应用。

7. 封装信息: - SOT-563封装,详细尺寸在PDF中有提供。
CMLDM7003 价格&库存

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