CMLDM7003E

CMLDM7003E

  • 厂商:

    CENTRAL(中环)

  • 封装:

  • 描述:

    CMLDM7003E - SURFACE MOUNT DUAL N-CHANNEL ENHANCEMENT-MODE SILICON MOSFET - Central Semiconductor Co...

  • 详情介绍
  • 数据手册
  • 价格&库存
CMLDM7003E 数据手册
CMLDM7003E CMLDM7003JE ENHANCED SPECIFICATION SURFACE MOUNT DUAL N-CHANNEL ENHANCEMENT-MODE SILICON MOSFET w w w. c e n t r a l s e m i . c o m SOT-563 CASE FEATURES • ESD protected up to 2kV MAXIMUM RATINGS: (TA=25°C) Drain-Source Voltage Drain-Gate Voltage Gate-Source Voltage Continuous Drain Current Maximum Pulsed Drain Current Power Dissipation (Note 1) Power Dissipation (Note 2) Power Dissipation (Note 3) Operating and Storage Junction Temperature Thermal Resistance DESCRIPTION: The CENTRAL SEMICONDUCTOR CMLDM7003E and CMLDM7003JE are Enhancement-mode N-Channel Field Effect Transistors, manufactured by the N-Channel DMOS Process, designed for high speed pulsed amplifier and driver applications. The CMLDM7003E utilizes the USA pinout configuration, while the CMLDM7003JE utilizes the Japanese pinout configuration. These special Dual Transistor devices offer low drain-source on state resistance (rDS(ON)) and ESD protection up to 2kV. MARKING CODES: CMLDM7003E: C73 CMLDM7003JE: C7J SYMBOL VDS VDG VGS ID IDM PD PD PD TJ, Tstg ΘJA UNITS V V V mA A mW mW mW °C °C/W 50 50 12 280 1.5 350 300 150 -65 to +150 357 ELECTRICAL CHARACTERISTICS PER TRANSISTOR: (TA=25°C unless otherwise noted) SYMBOL TEST CONDITIONS MIN TYP MAX VGS=5.0V 50 ♦ IGSSF, IGSSR VGS=10V 0.5 ♦ IGSSF, IGSSR VGS=12V 1.0 ♦ IGSSF, IGSSR IDSS VDS=50V, VGS=0 50 BVDSS VGS=0, ID=10μA 50 VGS(th) VDS=VGS, ID=250μA 0.49 1.2 VSD VGS=0, IS=115mA 1.4 VGS=1.8V, ID=50mA 1.6 2.3 ♦ rDS(ON) ♦ rDS(ON) VGS=2.5V, ID=50mA 1.3 1.9 ♦ rDS(ON) VGS=5.0V, ID=50mA 1.1 1.5 gFS VDS=10V, ID=200mA 200 Crss VDS=25V, VGS=0, f=1.0MHz 5.0 Ciss VDS=25V, VGS=0, f=1.0MHz 50 Coss VDS=25V, VGS=0, f=1.0MHz 25 UNITS nA μA μA nA V V V Ω Ω Ω mS pF pF pF ♦ Enhanced specification Notes: (1) Ceramic or aluminum core PC Board with copper mounting pad area of 4.0mm2 (2) FR-4 Epoxy PC Board with copper mounting pad area of 4.0mm2 (3) FR-4 Epoxy PC Board with copper mounting pad area of 1.4mm2 R2 (18-January 2010) CMLDM7003E CMLDM7003JE ENHANCED SPECIFICATION SURFACE MOUNT DUAL N-CHANNEL ENHANCEMENT-MODE SILICON MOSFET SOT-563 CASE - MECHANICAL OUTLINE PIN CONFIGURATIONS CMLDM7003E (USA Pinout) CMLDM7003JE (Japanese Pinout) LEAD CODE: 1) Gate Q1 2) Source Q1 3) Drain Q2 4) Gate Q2 5) Source Q2 6) Drain Q1 MARKING CODE: C73 LEAD CODE: 1) Source Q1 2) Gate Q1 3) Drain Q2 4) Source Q2 5) Gate Q2 6) Drain Q1 MARKING CODE: C7J R2 (18-January 2010) w w w. c e n t r a l s e m i . c o m
CMLDM7003E
1. 物料型号: - CMLDM7003E:美国引脚配置的型号。 - CMLDM7003JE:日本引脚配置的型号。

2. 器件简介: - 这两种型号均为增强型N沟道MOSFET,采用N沟道DMOS工艺制造,适用于高速脉冲放大器和驱动应用。它们具备低漏源导通电阻(rDS(ON))和高达2kV的ESD保护。

3. 引脚分配: - CMLDM7003E(美国引脚配置):1脚为Q1栅极,2脚为Q1源极,3脚为Q2漏极,4脚为Q2栅极。 - CMLDM7003JE(日本引脚配置):1脚为Q1源极,2脚为Q1栅极,3脚为Q2漏极,4脚为Q2源极,5脚为Q2源极,6脚为Q1漏极。

4. 参数特性: - 最大漏源电压(VDs):未提供具体数值。 - 最大栅漏电压(VDG):未提供具体数值。 - 最大栅源电压(VGS):未提供具体数值。 - 连续漏电流(ID):280mA。 - 最大脉冲漏电流(IDM):1.5A。 - 功率耗散(PD):根据安装方式不同,分别为350mW、300mW和150mW。 - 工作和储存结温(TJTstg):-65至+150°C。 - 热阻(OJA):357°C/W。

5. 功能详解: - 该器件为双N沟道增强型硅MOSFET,具有低导通电阻和高ESD保护特性,适用于高速脉冲放大和驱动应用。

6. 应用信息: - 适用于高速脉冲放大器和驱动应用。

7. 封装信息: - SOT-563封装,具体尺寸和机械轮廓图在文档中有所描述。
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