CMLT2907A
w w w. c e n t r a l s e m i . c o m
SURFACE MOUNT SILICON
DUAL PNP TRANSISTOR
DESCRIPTION:
The CENTRAL SEMICONDUCTOR CMLT2907A
consists of two individual, isolated 2907A PNP
silicon transistors, manufactured by the epitaxial planar
process and epoxy molded in an SOT-563 surface
mount package. This device has been designed
for small signal general purpose and switching
applications.
MARKING CODE: L07
SOT-563 CASE
MAXIMUM RATINGS: (TA=25°C)
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Continuous Collector Current
Power Dissipation
Operating and Storage Junction Temperature
Thermal Resistance
ELECTRICAL
SYMBOL
ICBO
ICBO
ICEV
BVCBO
BVCEO
BVEBO
VCE(SAT)
VCE(SAT)
VBE(SAT)
VBE(SAT)
hFE
hFE
hFE
hFE
hFE
SYMBOL
VCBO
VCEO
VEBO
IC
PD
TJ, Tstg
ΘJA
60
60
5.0
600
350
-65 to +150
357
CHARACTERISTICS PER TRANSISTOR: (TA=25°C unless otherwise noted)
TEST CONDITIONS
MIN
MAX
VCB=50V
10
VCB=50V, TA=125°C
10
VCE=30V, VBE=0.5V
50
IC=10μA
60
IC=10mA
60
IE=10μA
5.0
IC=150mA, IB=15mA
0.4
IC=500mA, IB=50mA
1.6
IC=150mA, IB=15mA
1.3
IC=500mA, IB=50mA
2.6
VCE=10V, IC=0.1mA
75
VCE=10V, IC=1.0mA
100
VCE=10V, IC=10mA
100
VCE=10V, IC=150mA
100
300
VCE=10V, IC=500mA
50
UNITS
V
V
V
mA
mW
°C
°C/W
UNITS
nA
μA
nA
V
V
V
V
V
V
V
R4 (29-June 2015)
CMLT2907A
SURFACE MOUNT SILICON
DUAL PNP TRANSISTOR
ELECTRICAL
SYMBOL
fT
Cob
Cib
ton
td
tr
toff
ts
tf
CHARACTERISTICS PER TRANSISTOR - Continued: (TA=25°C unless otherwise noted)
TEST CONDITIONS
MIN
MAX
UNITS
VCE=20V, IC=50mA, f=100MHz
200
MHz
VCB=10V, IE=0, f=1.0MHz
8.0
pF
VBE=2.0V, IC=0, f=1.0MHz
30
pF
VCC=30V, VBE=0.5V, IC=150mA, IB1=15mA
45
ns
VCC=30V, VBE=0.5V, IC=150mA, IB1=15mA
10
ns
VCC=30V, VBE=0.5V, IC=150mA, IB1=15mA
40
ns
VCC=6.0V, IC=150mA, IB1=IB2=15mA
100
ns
VCC=6.0V, IC=150mA, IB1=IB2=15mA
80
ns
VCC=6.0V, IC=150mA, IB1=IB2=15mA
30
ns
SOT-563 CASE - MECHANICAL OUTLINE
LEAD CODE:
1) Emitter Q1
2) Base Q1
3) Collector Q2
4) Emitter Q2
5) Base Q2
6) Collector Q1
MARKING CODE: L07
R4 (29-June 2015)
w w w. c e n t r a l s e m i . c o m
OUTSTANDING SUPPORT AND SUPERIOR SERVICES
PRODUCT SUPPORT
Central’s operations team provides the highest level of support to insure product is delivered on-time.
• Supply management (Customer portals)
• Custom bar coding for shipments
• Inventory bonding
• Custom product packing
• Consolidated shipping options
DESIGNER SUPPORT/SERVICES
Central’s applications engineering team is ready to discuss your design challenges. Just ask.
• Free quick ship samples (2nd day air)
• Special wafer diffusions
• Online technical data and parametric search
• PbSn plating options
• SPICE models
• Package details
• Custom electrical curves
• Application notes
• Environmental regulation compliance
• Application and design sample kits
• Customer specific screening
• Custom product and package development
• Up-screening capabilities
REQUESTING PRODUCT PLATING
1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when
ordering (example: 2N2222A TIN/LEAD).
2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number
when ordering (example: 2N2222A PBFREE).
CONTACT US
Corporate Headquarters & Customer Support Team
Central Semiconductor Corp.
145 Adams Avenue
Hauppauge, NY 11788 USA
Main Tel: (631) 435-1110
Main Fax: (631) 435-1824
Support Team Fax: (631) 435-3388
www.centralsemi.com
Worldwide Field Representatives:
www.centralsemi.com/wwreps
Worldwide Distributors:
www.centralsemi.com/wwdistributors
For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER,
which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms
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