CMPD6001CBK

CMPD6001 CMPD6001A CMPD6001C CMPD6001S SURFACE MOUNT SILICON ULTRA LOW LEAKAGE SWITCHING DIODES w w w. c e n t r a l s e m i . c o m DESCRIPTION: The CENTRAL SEMICONDUCTOR CMPD6001 series devices are silicon switching diodes manufactured by the epitaxial planar process, designed for switching applications requiring an extremely low leakage diode. SOT-23 CASE The following CMPD6001 CMPD6001A CMPD6001C CMPD6001S configurations are available: SINGLE DUAL, COMMON ANODE DUAL, COMMON CATHODE DUAL, IN SERIES MAXIMUM RATINGS: (TA=25°C) Continuous Reverse Voltage Peak Repetitive Reverse Voltage Continuous Forward Current Peak Repetitive Forward Current Peak Forward Surge Current, tp=1.0μs Peak Forward Surge Current, tp=1.0s Power Dissipation Operating and Storage Junction Temperature Thermal Resistance MARKING MARKING MARKING MARKING SYMBOL VR VRRM CODE: CODE: CODE: CODE: ULO ULA ULC ULS 75 UNITS V 100 V IF IFRM IFSM 250 mA 250 mA 4.0 A IFSM PD 1.0 A 350 mW TJ, Tstg ΘJA -65 to +150 °C 357 °C/W ELECTRICAL SYMBOL IR BVR CHARACTERISTICS PER DIODE: (TA=25°C unless otherwise noted) TEST CONDITIONS MIN MAX VR=75V 500 VF IF=1.0mA 0.85 V VF IF=10mA 0.95 V VF IF=100mA 1.1 V CJ VR=0, f =1.0MHz 2.0 pF trr IR=IF=10mA, Irr=1.0mA, RL=100Ω 3.0 μs IR=100μA 100 UNITS pA V R6 (16-February 2017) CMPD6001 CMPD6001A CMPD6001C CMPD6001S SURFACE MOUNT SILICON ULTRA LOW LEAKAGE SWITCHING DIODES SOT-23 CASE - MECHANICAL OUTLINE 2 1 3 PIN CONFIGURATIONS CMPD6001 CMPD6001A CMPD6001C CMPD6001S LEAD CODE: 1) Anode 2) No Connection 3) Cathode LEAD CODE: 1) Cathode D2 2) Cathode D1 3) Anode D1, D2 LEAD CODE: 1) Anode D2 2) Anode D1 3) Cathode D1, D2 LEAD CODE: 1) Anode D2 2) Cathode D1 3) Anode D1, Cathode D2 MARKING CODE: ULO MARKING CODE: ULA MARKING CODE: ULC MARKING CODE: ULS R6 (16-February 2017) w w w. c e n t r a l s e m i . c o m CMPD6001 CMPD6001A CMPD6001C CMPD6001S SURFACE MOUNT SILICON ULTRA LOW LEAKAGE SWITCHING DIODES TYPICAL ELECTRICAL CHARACTERISTICS R6 (16-February 2017) w w w. c e n t r a l s e m i . c o m OUTSTANDING SUPPORT AND SUPERIOR SERVICES PRODUCT SUPPORT Central’s operations team provides the highest level of support to insure product is delivered on-time. • Supply management (Customer portals) • Custom bar coding for shipments • Inventory bonding • Custom product packing • Consolidated shipping options DESIGNER SUPPORT/SERVICES Central’s applications engineering team is ready to discuss your design challenges. Just ask. • Free quick ship samples (2nd day air) • Special wafer diffusions • Online technical data and parametric search • PbSn plating options • SPICE models • Package details • Custom electrical curves • Application notes • Environmental regulation compliance • Application and design sample kits • Customer specific screening • Custom product and package development • Up-screening capabilities REQUESTING PRODUCT PLATING 1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when ordering (example: 2N2222A TIN/LEAD). 2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number when ordering (example: 2N2222A PBFREE). CONTACT US Corporate Headquarters & Customer Support Team Central Semiconductor Corp. 145 Adams Avenue Hauppauge, NY 11788 USA Main Tel: (631) 435-1110 Main Fax: (631) 435-1824 Support Team Fax: (631) 435-3388 www.centralsemi.com Worldwide Field Representatives: www.centralsemi.com/wwreps Worldwide Distributors: www.centralsemi.com/wwdistributors For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER, which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms w w w. c e n t r a l s e m i . c o m (001)