CMPDM7002AHCTR

CMPDM7002AHC SURFACE MOUNT N-CHANNEL ENHANCEMENT-MODE SILICON MOSFET w w w. c e n t r a l s e m i . c o m DESCRIPTION: The CENTRAL SEMICONDUCTOR CMPDM7002AHC is a High Current version of the 2N7002A Enhancementmode N-Channel MOSFET, designed for high speed pulsed amplifier and driver applications. MARKING CODE: 702H SOT-23 CASE APPLICATIONS: • Load/Power Switches • Power Supply Converter Circuits • Battery Powered Portable Equipment FEATURES: • ESD Protection up to 2kV • 350mW Power Dissipation • Low rDS(ON): 0.22Ω MAX @ VGS=10V • Industry Standard SOT-23 Surface Mount Package MAXIMUM RATINGS: (TA=25°C) Drain-Source Voltage Drain-Gate Voltage Gate-Source Voltage Continuous Drain Current (Steady State) Maximum Pulsed Drain Current (tp=10μs) Power Dissipation Operating and Storage Junction Temperature Thermal Resistance SYMBOL VDS VDG VGS ID IDM PD TJ, Tstg ΘJA • Device is Halogen Free by design ELECTRICAL CHARACTERISTICS: (TA=25°C unless SYMBOL TEST CONDITIONS IGSSF, IGSSR VGS=20V, VDS=0 IDSS VDS=60V, VGS=0 BVDSS VGS=0, ID=100μA VGS(th) VDS=VGS, ID=250μA VSD VGS=0, IS=500mA rDS(ON) VGS=10V, ID=500mA rDS(ON) VGS=5.0V, ID=500mA Qg(tot) VDS=10V, VGS=4.5V, ID=1.0A Qgs VDS=10V, VGS=4.5V, ID=1.0A Qgd VDS=10V, VGS=4.5V, ID=1.0A Crss VDS=25V, VGS=0, f=1.0MHz Ciss VDS=25V, VGS=0, f=1.0MHz Coss VDS=25V, VGS=0, f=1.0MHz ton VDD=30V, VGS=4.5V, ID=1.0A RG=6.0Ω, RL=30Ω toff VDD=30V, VGS=4.5V, ID=1.0A RG=6.0Ω, RL=30Ω UNITS V V V A A mW °C °C/W 60 60 20 1.0 5.0 350 -65 to +150 357 otherwise noted) MIN TYP 63 1.2 0.15 0.20 2.3 1.0 0.7 MAX 10 500 25 240 50 UNITS μA nA V V V Ω Ω nC nC nC pF pF pF 35 ns 50 ns 2.3 0.9 0.22 0.30 R2 (2-August 2011) CMPDM7002AHC SURFACE MOUNT N-CHANNEL ENHANCEMENT-MODE SILICON MOSFET SOT-23 CASE - MECHANICAL OUTLINE PIN CONFIGURATION LEAD CODE: 1) Gate 2) Source 3) Drain MARKING CODE: 702H R2 (2-August 2011) w w w. c e n t r a l s e m i . c o m OUTSTANDING SUPPORT AND SUPERIOR SERVICES PRODUCT SUPPORT Central’s operations team provides the highest level of support to insure product is delivered on-time. • Supply management (Customer portals) • Custom bar coding for shipments • Inventory bonding • Custom product packing • Consolidated shipping options DESIGNER SUPPORT/SERVICES Central’s applications engineering team is ready to discuss your design challenges. Just ask. • Free quick ship samples (2nd day air) • Special wafer diffusions • Online technical data and parametric search • PbSn plating options • SPICE models • Package details • Custom electrical curves • Application notes • Environmental regulation compliance • Application and design sample kits • Customer specific screening • Custom product and package development • Up-screening capabilities REQUESTING PRODUCT PLATING 1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when ordering (example: 2N2222A TIN/LEAD). 2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number when ordering (example: 2N2222A PBFREE). CONTACT US Corporate Headquarters & Customer Support Team Central Semiconductor Corp. 145 Adams Avenue Hauppauge, NY 11788 USA Main Tel: (631) 435-1110 Main Fax: (631) 435-1824 Support Team Fax: (631) 435-3388 www.centralsemi.com Worldwide Field Representatives: www.centralsemi.com/wwreps Worldwide Distributors: www.centralsemi.com/wwdistributors For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER, which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms w w w. c e n t r a l s e m i . c o m (001)