CMSSH-3BK

CMSSH-3 CMSSH-3A CMSSH-3C CMSSH-3S SURFACE MOUNT SILICON SCHOTTKY DIODES w w w. c e n t r a l s e m i . c o m DESCRIPTION: The CENTRAL SEMICONDUCTOR CMSSH-3 series devices are silicon Schottky diodes, epoxy molded in an SOT-323 surface mount package, designed for fast switching applications requiring a low forward voltage drop. SOT-323 CASE CMSSH-3: CMSSH-3A: CMSSH-3C: CMSSH-3S: SINGLE DUAL, COMMON ANODE DUAL, COMMON CATHODE DUAL, IN SERIES MAXIMUM RATINGS: (TA=25°C) Peak Repetitive Reverse Voltage Continuous Forward Current Peak Repetitive Forward Current Peak Forward Surge Current, tp=10ms Power Dissipation Operating and Storage Junction Temperature Thermal Resistance MARKING MARKING MARKING MARKING CODE: CODE: CODE: CODE: 95D B1D B2D A5D SYMBOL VRRM 30 UNITS V IF 100 mA IFRM IFSM 200 mA 750 mA PD TJ, Tstg 275 mW -65 to +150 °C ΘJA 455 °C/W ELECTRICAL SYMBOL IR IR CHARACTERISTICS PER DIODE: (TA=25°C unless otherwise noted) TEST CONDITIONS MIN TYP MAX VR=25V 90 500 VR=25V, TA=100°C 25 100 BVR IR=100μA VF IF=2.0mA VF IF=15mA 0.37 0.45 V VF IF=100mA 0.51 1.00 V CJ VR=1.0V, f=1.0MHz 7.0 trr IF=IR=10mA, Irr=1.0mA, RL=100Ω 30 UNITS nA μA V 0.29 0.33 V pF 5.0 ns R4 (11-February 2016) CMSSH-3 CMSSH-3A CMSSH-3C CMSSH-3S SURFACE MOUNT SILICON SCHOTTKY DIODES SOT-323 CASE - MECHANICAL OUTLINE 2 1 3 PIN CONFIGURATIONS CMSSH-3 CMSSH-3A CMSSH-3C CMSSH-3S LEAD CODE: 1) Anode 2) NC 3) Cathode LEAD CODE: 1) Cathode D2 2) Cathode D1 3) Anode D1, D2 LEAD CODE: 1) Anode D2 2) Anode D1 3) Cathode D1, D2 LEAD CODE: 1) Anode D2 2) Cathode D1 3) Anode D1, Cathode D2 MARKING CODE: 95D MARKING CODE: B1D MARKING CODE: B2D MARKING CODE: A5D R4 (11-February 2016) w w w. c e n t r a l s e m i . c o m CMSSH-3 CMSSH-3A CMSSH-3C CMSSH-3S SURFACE MOUNT SILICON SCHOTTKY DIODES TYPICAL ELECTRICAL CHARACTERISTICS R4 (11-February 2016) w w w. c e n t r a l s e m i . c o m CMSSH-3 CMSSH-3A CMSSH-3C CMSSH-3S SURFACE MOUNT SILICON SCHOTTKY DIODES TYPICAL ELECTRICAL CHARACTERISTICS R4 (11-February 2016) w w w. c e n t r a l s e m i . c o m OUTSTANDING SUPPORT AND SUPERIOR SERVICES PRODUCT SUPPORT Central’s operations team provides the highest level of support to insure product is delivered on-time. • Supply management (Customer portals) • Custom bar coding for shipments • Inventory bonding • Custom product packing • Consolidated shipping options DESIGNER SUPPORT/SERVICES Central’s applications engineering team is ready to discuss your design challenges. Just ask. • Free quick ship samples (2nd day air) • Special wafer diffusions • Online technical data and parametric search • PbSn plating options • SPICE models • Package details • Custom electrical curves • Application notes • Environmental regulation compliance • Application and design sample kits • Customer specific screening • Custom product and package development • Up-screening capabilities REQUESTING PRODUCT PLATING 1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when ordering (example: 2N2222A TIN/LEAD). 2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number when ordering (example: 2N2222A PBFREE). CONTACT US Corporate Headquarters & Customer Support Team Central Semiconductor Corp. 145 Adams Avenue Hauppauge, NY 11788 USA Main Tel: (631) 435-1110 Main Fax: (631) 435-1824 Support Team Fax: (631) 435-3388 www.centralsemi.com Worldwide Field Representatives: www.centralsemi.com/wwreps Worldwide Distributors: www.centralsemi.com/wwdistributors For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER, which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms w w w. c e n t r a l s e m i . c o m (001)