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CP147-MJ11016-CT

CP147-MJ11016-CT

  • 厂商:

    CENTRAL(中环)

  • 封装:

    Die

  • 描述:

    IC TRANSISTOR

  • 数据手册
  • 价格&库存
CP147-MJ11016-CT 数据手册
CP147-MJ11016 NPN - Darlington Transistor Die 30 Amp, 120 Volt w w w. c e n t r a l s e m i . c o m The CP147-MJ11016 die is a silicon NPN Darlington power transistor designed for high current applications. MECHANICAL SPECIFICATIONS: B E Die Size 195 x 195 MILS Die Thickness 11.4 MILS Base Bonding Pad Size 28 x 28 MILS Emitter Bonding Pad Size 70 x 44 MILS Top Side Metalization Al – 60,000Å Back Side Metalization Ti/Ni/Au – 1,100Å/4,000Å/500Å Scribe Alley Width 3 MILS Wafer Diameter 5 INCHES Gross Die Per Wafer 400 MAXIMUM RATINGS: (TC=25°C) Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Continuous Collector Current Continuous Base Current Operating and Storage Junction Temperature ELECTRICAL SYMBOL ICER ICEO IEBO BVCEO VCE(SAT) SYMBOL VCBO VCEO 120 V VEBO IC 5.0 V 30 A IB TJ, Tstg 1.0 A -65 to +200 °C MAX 1.0 UNITS mA 1.0 mA 5.0 mA CHARACTERISTICS: (TC=25°C unless otherwise noted) TEST CONDITIONS MIN VCE=120V, RBE=1.0kΩ VCE=50V VEB=5.0V IC=100mA UNITS V 120 120 V IC=20A, IB=200mA IC=30A, IB=300mA 3.0 V 4.0 V 3.5 V VBE(SAT) IC=20A, IB=200mA IC=30A, IB=300mA 5.0 V hFE VCE=5.0V, IC=20A 1.0K hFE VCE=5.0V, IC=30A VCE=3.0V, IC=10A, f=1.0MHz 200 VCE(SAT) VBE(SAT) fT 4.0 MHz R0 (4-February 2016) CP147-MJ11016 Typical Electrical Characteristics w w w. c e n t r a l s e m i . c o m R0 (4-February 2016) BARE DIE PACKING OPTIONS BARE DIE IN TRAY (WAFFLE) PACK CT: Singulated die in tray (waffle) pack. (example: CP211-PART NUMBER-CT) CM: S  ingulated die in tray (waffle) pack 100% visually inspected as per MIL-STD-750, (method 2072 transistors, method 2073 diodes). (example: CP211-PART NUMBER-CM) UNSAWN WAFER WN: Full wafer, unsawn, 100% tested with reject die inked. (example: CP211-PART NUMBER-WN) SAWN WAFER ON PLASTIC RING WR: F  ull wafer, sawn and mounted on plastic ring, 100% tested with reject die inked. (example: CP211-PART NUMBER-WR) Please note: Sawn Wafer on Metal Frame (WS) is possible as a special order. Please contact your Central Sales Representative at 631-435-1110. Visit the Central website for a complete listing of specifications: www.centralsemi.com/bdspecs R2 (3-April 2017) w w w. c e n t r a l s e m i . c o m OUTSTANDING SUPPORT AND SUPERIOR SERVICES PRODUCT SUPPORT Central’s operations team provides the highest level of support to insure product is delivered on-time. • Supply management (Customer portals) • Custom bar coding for shipments • Inventory bonding • Custom product packing • Consolidated shipping options DESIGNER SUPPORT/SERVICES Central’s applications engineering team is ready to discuss your design challenges. Just ask. • Free quick ship samples (2nd day air) • Special wafer diffusions • Online technical data and parametric search • PbSn plating options • SPICE models • Package details • Custom electrical curves • Application notes • Environmental regulation compliance • Application and design sample kits • Customer specific screening • Custom product and package development • Up-screening capabilities REQUESTING PRODUCT PLATING 1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when ordering (example: 2N2222A TIN/LEAD). 2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number when ordering (example: 2N2222A PBFREE). CONTACT US Corporate Headquarters & Customer Support Team Central Semiconductor Corp. 145 Adams Avenue Hauppauge, NY 11788 USA Main Tel: (631) 435-1110 Main Fax: (631) 435-1824 Support Team Fax: (631) 435-3388 www.centralsemi.com Worldwide Field Representatives: www.centralsemi.com/wwreps Worldwide Distributors: www.centralsemi.com/wwdistributors For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER, which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms w w w. c e n t r a l s e m i . c o m (001) http://www.centralsemi.com PDN01144 1/20/20 Stock Only Stock Only Please be advised that Central Semiconductor must immediately discontinue the product(s) listed in the attached PDN notice. We are unable to accept any further orders for these products unless _____ we have available inventory on hand. You may have purchased one or more of the products listed. Please do not hesitate to contact your local Central Semiconductor sales representative with any questions or needs you may have. Central regrets any inconvenience this may cause. Sincerely, Central Semiconductor Corp. PDN01144 1/20/20 Stock Only Stock Only http://www.centralsemi.com Summary:The CP147 wafer process is being discontinued and is now classified as End of Life (EOL). The replacement wafer process is CP247. Although Central Semiconductor Corp. makes every effort to continue to produce devices that have been proclaimed EOL (End of Life) by other manufacturers, it is an accepted industry practice to discontinue certain devices when customer demand falls below a minimum level of sustainability. Accordingly, the following product(s) have been transitioned to End of Life status as part of Central's ongoing Product Management Process. Any replacement products are noted below. The effective date for placing last purchase orders will be six (6) months from the date of this notice and twelve (12) months from the notice date for final shipments, and minimum order quantities may apply. The last purchase and shipment dates may be extended if inventory is available. Central Part Number CP147-CEN1104-CT CP147-MJ11016-CT CP147-MJ11016-WN CP147-2N6284-CM CP147-2N6284-CT CP147-2N6284-WN Replacement CP247-CEN1104-CT CP247-MJ11016-CT CP247-MJ11016-WN CP247-2N6284-CM CP247-2N6284-CT CP247-2N6284-WN Central would be happy to assist you by providing additional information or technical data to help locate an alternate source if we have no replacement available. Please email your requests to engineering@centralsemi.com.
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