CP305-2N3019
NPN - High Current Transistor Die
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The CP305-2N3019 is a silicon NPN transistor designed for high current, general purpose
applications.
MECHANICAL SPECIFICATIONS:
E
B
Die Size
31 x 31 MILS
Die Thickness
9.0 MILS
Base Bonding Pad Size
5.9 x 11.8 MILS
Emitter Bonding Pad Size
6.5 x 13.8 MILS
Top Side Metalization
Al – 30,000Å
Back Side Metalization
Au – 18,000Å
Scribe Alley Width
1.96 MILS
Wafer Diameter
4 INCHES
Gross Die Per Wafer
11,212
MAXIMUM RATINGS: (TA=25°C)
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Continuous Collector Current
Operating and Storage Junction Temperature
ELECTRICAL
SYMBOL
ICBO
IEBO
BVCBO
BVCEO
BVEBO
VCE(SAT)
VCE(SAT)
VBE(SAT)
hFE
hFE
hFE
hFE
hFE
fT
Cob
Cib
CHARACTERISTICS: (TA=25°C)
TEST CONDITIONS
VCB=90V
VEB=5.0V
IC=100μA
IC=30mA
IE=100μA
IC=150mA, IB=15mA
IC=500mA, IB=50mA
IC=150mA, IB=15mA
VCE=10V, IC=100μA
VCE=10V, IC=10mA
VCE=10V, IC=150mA
VCE=10V, IC=500mA
VCE=10V, IC=1.0A
VCE=10V, IC=50mA, f=20MHz
VCB=10V, IE=0, f=1.0MHz
VEB=0.5V, IC=0, f=1.0MHz
SYMBOL
VCBO
VCEO
VEBO
IC
TJ, Tstg
MIN
140
80
7.0
1.0
-65 to +150
MAX
10
10
140
80
7.0
0.2
0.5
1.1
50
90
100
50
15
100
UNITS
V
V
V
A
°C
UNITS
nA
nA
V
V
V
V
V
V
300
12
60
MHz
pF
pF
PACKING OPTIONS:
• CP305-2N3019-CT: Singulated die in waffle pack; 400 die per tray.
• CP305-2N3019-WN: Full wafer, unsawn, 100% tested with reject die inked.
• CP305-2N3019-WR: Full wafer, sawn and mounted on plastic ring, 100% tested with reject die inked.
R0 (12-March 2015)
CP305-2N3019
Typical Electrical Characteristics
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R0 (12-March 2015)
BARE DIE PACKING OPTIONS
BARE DIE IN TRAY (WAFFLE) PACK
CT: Singulated die in tray (waffle) pack.
(example: CP211-PART NUMBER-CT)
CM: S
ingulated die in tray (waffle) pack 100% visually inspected as
per MIL-STD-750, (method 2072 transistors, method 2073 diodes).
(example: CP211-PART NUMBER-CM)
UNSAWN WAFER
WN: Full wafer, unsawn, 100% tested with reject die inked.
(example: CP211-PART NUMBER-WN)
SAWN WAFER ON PLASTIC RING
WR: F
ull wafer, sawn and mounted on plastic ring,
100% tested with reject die inked.
(example: CP211-PART NUMBER-WR)
Please note: Sawn Wafer on Metal Frame (WS)
is possible as a special order. Please contact your
Central Sales Representative at 631-435-1110.
Visit the Central website for a complete listing of specifications:
www.centralsemi.com/bdspecs
R2 (3-April 2017)
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OUTSTANDING SUPPORT AND SUPERIOR SERVICES
PRODUCT SUPPORT
Central’s operations team provides the highest level of support to insure product is delivered on-time.
• Supply management (Customer portals)
• Custom bar coding for shipments
• Inventory bonding
• Custom product packing
• Consolidated shipping options
DESIGNER SUPPORT/SERVICES
Central’s applications engineering team is ready to discuss your design challenges. Just ask.
• Free quick ship samples (2nd day air)
• Special wafer diffusions
• Online technical data and parametric search
• PbSn plating options
• SPICE models
• Package details
• Custom electrical curves
• Application notes
• Environmental regulation compliance
• Application and design sample kits
• Customer specific screening
• Custom product and package development
• Up-screening capabilities
REQUESTING PRODUCT PLATING
1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when
ordering (example: 2N2222A TIN/LEAD).
2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number
when ordering (example: 2N2222A PBFREE).
CONTACT US
Corporate Headquarters & Customer Support Team
Central Semiconductor Corp.
145 Adams Avenue
Hauppauge, NY 11788 USA
Main Tel: (631) 435-1110
Main Fax: (631) 435-1824
Support Team Fax: (631) 435-3388
www.centralsemi.com
Worldwide Field Representatives:
www.centralsemi.com/wwreps
Worldwide Distributors:
www.centralsemi.com/wwdistributors
For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER,
which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms
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