PROCESS
CP307
Small Signal Transistor
NPN - Silicon Darlington Transistor Chip
PROCESS DETAILS
Process
EPITAXIAL PLANAR
Die Size
27 x 27 MILS
Die Thickness
9.0 MILS
Base Bonding Pad Area
5.3 x 3.8 MILS
Emitter Bonding Pad Area
5.3 x 6.5 MILS
Top Side Metalization
Al - 30,000Å
Back Side Metalization
Au - 18,000Å
GEOMETRY
GROSS DIE PER 4 INCH WAFER
15,165
BACKSIDE COLLECTOR
PRINCIPAL DEVICE TYPES
2N6426
2N6427
CMPT6427
CMPTA13
CMPTA14
CXTA14
CZTA14
MPSA13
MPSA14
MPSA27
R6 (22-March 2010)
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PROCESS
CP307
Typical Electrical Characteristics
R6 (22-March 2010)
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BARE DIE PACKING OPTIONS
BARE DIE IN TRAY (WAFFLE) PACK
CT: Singulated die in tray (waffle) pack.
(example: CP211-PART NUMBER-CT)
CM: S
ingulated die in tray (waffle) pack 100% visually inspected as
per MIL-STD-750, (method 2072 transistors, method 2073 diodes).
(example: CP211-PART NUMBER-CM)
UNSAWN WAFER
WN: Full wafer, unsawn, 100% tested with reject die inked.
(example: CP211-PART NUMBER-WN)
SAWN WAFER ON PLASTIC RING
WR: F
ull wafer, sawn and mounted on plastic ring,
100% tested with reject die inked.
(example: CP211-PART NUMBER-WR)
Please note: Sawn Wafer on Metal Frame (WS)
is possible as a special order. Please contact your
Central Sales Representative at 631-435-1110.
Visit the Central website for a complete listing of specifications:
www.centralsemi.com/bdspecs
R2 (3-April 2017)
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OUTSTANDING SUPPORT AND SUPERIOR SERVICES
PRODUCT SUPPORT
Central’s operations team provides the highest level of support to insure product is delivered on-time.
• Supply management (Customer portals)
• Custom bar coding for shipments
• Inventory bonding
• Custom product packing
• Consolidated shipping options
DESIGNER SUPPORT/SERVICES
Central’s applications engineering team is ready to discuss your design challenges. Just ask.
• Free quick ship samples (2nd day air)
• Special wafer diffusions
• Online technical data and parametric search
• PbSn plating options
• SPICE models
• Package details
• Custom electrical curves
• Application notes
• Environmental regulation compliance
• Application and design sample kits
• Customer specific screening
• Custom product and package development
• Up-screening capabilities
REQUESTING PRODUCT PLATING
1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when
ordering (example: 2N2222A TIN/LEAD).
2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number
when ordering (example: 2N2222A PBFREE).
CONTACT US
Corporate Headquarters & Customer Support Team
Central Semiconductor Corp.
145 Adams Avenue
Hauppauge, NY 11788 USA
Main Tel: (631) 435-1110
Main Fax: (631) 435-1824
Support Team Fax: (631) 435-3388
www.centralsemi.com
Worldwide Field Representatives:
www.centralsemi.com/wwreps
Worldwide Distributors:
www.centralsemi.com/wwdistributors
For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER,
which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms
w w w. c e n t r a l s e m i . c o m
(001)
PDN01146
2/18/20
8/18/20
2/18/21
http://www.centralsemi.com
Summary:The CP307 and CP307V wafer processes are being discontinued and are now classified as End of Life (EOL). The replacement
wafer process for both is CP327V.
Although Central Semiconductor Corp. makes every effort to continue to produce devices that have been proclaimed EOL (End of Life) by
other manufacturers, it is an accepted industry practice to discontinue certain devices when customer demand falls below a minimum level of
sustainability. Accordingly, the following product(s) have been transitioned to End of Life status as part of Central's ongoing Product
Management Process. Any replacement products are noted below. The effective date for placing last purchase orders will be six (6) months
from the date of this notice and twelve (12) months from the notice date for final shipments, and minimum order quantities may apply.
The last purchase and shipment dates may be extended if inventory is available.
Central Part Number
CP307-CZTA27-CT
CP307-MPSA13-CT
CP307-MPSA13-WN
CP307-MPSA27-CT
CP307-MPSA27-WN
CP307-2N5308-CT
CP307-2N5308-WN
CP307V-MPSA13-WN
CP307V-2N5308-WN
Replacement
CP327V-CZTA27-CT
CP327V-MPSA13-CT
CP327V-MPSA13-WN
CP327V-MPSA27-CT
CP327V-MPSA27-WN
CP327V-2N5308-CT
CP327V-2N5308-WN
CP327V-MPSA13-WN
CP327V-2N5308-WN
Central would be happy to assist you by providing additional information or technical data to help locate an alternate source if we
have no replacement available. Please email your requests to engineering@centralsemi.com.
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