CP704

PROCESS CP704 Central TM Small Signal Transistors PNP - High Current Transistor Chip Semiconductor Corp. PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 23,450 PRINCIPAL DEVICE TYPES MPSA55 MPSA56 EPITAXIAL PLANAR 22 x 22 MILS 9.0 MILS 3.7 X 3.7 MILS 4.2 X 4.2 MILS Al - 30,000Å Au - 18,000Å BACKSIDE COLLECTOR 145 Adams Avenue Hauppauge, NY 11788 USA Tel: (631) 435-1110 Fax: (631) 435-1824 R1 (15 -April 2005) Central TM PROCESS CP704 Semiconductor Corp. Typical Electrical Characteristics 145 Adams Avenue Hauppauge, NY 11788 USA Tel: (631) 435-1110 Fax: (631) 435-1824 R1 (15 -April 2005)