CP734V

PROCESS CP734V Small Signal Transistors PNP - Chopper Transistor Chip PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 11,210 PRINCIPAL DEVICE TYPES CMPT404A MPS404A Epitaxial Planar 31.5 x 31.5 MILS 7.1 MILS 4.7 x 6.7 MILS 4.7 x 8.7 MILS Al - 30,000Å Au - 18,000Å 145 Adams Avenue Hauppauge, NY 11788 USA Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com R0 (5- January 2006)