CP734V_10

PROCESS Small Signal Transistors PNP - Chopper Transistor Chip CP734V PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 5 INCH WAFER 16,986 PRINCIPAL DEVICE TYPES CMPT404A MPS404A EPITAXIAL PLANAR 31.5 x 31.5 MILS 7.0 MILS 4.7 x 6.7 MILS 4.7 x 8.7 MILS Al - 30,000Å Au - 18,000Å R2 (22-March 2010) w w w. c e n t r a l s e m i . c o m PROCESS CP734V Typical Electrical Characteristics R2 (22-March 2010) w w w. c e n t r a l s e m i . c o m