CPD24-CMR1F06M-CT20

CPD24-CMR1F-06M Fast Rectifier Die 1.0 Amp, 600 Volt w w w. c e n t r a l s e m i . c o m The CPD24-CMR1F-06M is a silicon 1.0 Amp, 600 Volt fast recovery rectifier ideal for all types of commercial, industrial, entertainment, and computer applications. MECHANICAL SPECIFICATIONS: ANODE BACKSIDE CATHODE Die Size 50.5 x 50.5 MILS Die Thickness 11 MILS Anode Bonding Pad Size 33.8 x 33.8 MILS Top Side Metalization Ni/Au – 4,500Å/1,350Å Back Side Metalization Ni/Au – 4,500Å/1,350Å Scribe Alley Width 2.0 MILS Wafer Diameter 4 INCHES Gross Die Per Wafer 4,250 R1 MAXIMUM RATINGS: (TA=25°C) Peak Repetitive Reverse Voltage SYMBOL VRRM DC Blocking Voltage VR VR(RMS) IO RMS Reverse Voltage Average Forward Current (TA=120°C) Peak Forward Surge Current, tp=8.3ms Operating and Storage Junction Temperature IFSM TJ, Tstg 600 UNITS V 600 V 420 V 1.0 A 30 A -65 to +150 °C MAX 5.0 UNITS µA ELECTRICAL SYMBOL IR VF CHARACTERISTICS: (TA=25°C unless otherwise) TEST CONDITIONS MIN VR=600V IF=1.0A 1.3 V CJ VR=0, f=1.0MHz 35 pF trr IF=0.5A, IR=1.0A, Irr=0.25A 250 ns R2 (26-March 2019) CPD24-CMR1F-06M Typical Electrical Characteristics w w w. c e n t r a l s e m i . c o m R2 (26-March 2019) BARE DIE PACKING OPTIONS BARE DIE IN TRAY (WAFFLE) PACK CT: Singulated die in tray (waffle) pack. (example: CP211-PART NUMBER-CT) CM: S  ingulated die in tray (waffle) pack 100% visually inspected as per MIL-STD-750, (method 2072 transistors, method 2073 diodes). (example: CP211-PART NUMBER-CM) UNSAWN WAFER WN: Full wafer, unsawn, 100% tested with reject die inked. (example: CP211-PART NUMBER-WN) SAWN WAFER ON PLASTIC RING WR: F  ull wafer, sawn and mounted on plastic ring, 100% tested with reject die inked. (example: CP211-PART NUMBER-WR) Please note: Sawn Wafer on Metal Frame (WS) is possible as a special order. Please contact your Central Sales Representative at 631-435-1110. Visit the Central website for a complete listing of specifications: www.centralsemi.com/bdspecs R2 (3-April 2017) w w w. c e n t r a l s e m i . c o m OUTSTANDING SUPPORT AND SUPERIOR SERVICES PRODUCT SUPPORT Central’s operations team provides the highest level of support to insure product is delivered on-time. • Supply management (Customer portals) • Custom bar coding for shipments • Inventory bonding • Custom product packing • Consolidated shipping options DESIGNER SUPPORT/SERVICES Central’s applications engineering team is ready to discuss your design challenges. Just ask. • Free quick ship samples (2nd day air) • Special wafer diffusions • Online technical data and parametric search • PbSn plating options • SPICE models • Package details • Custom electrical curves • Application notes • Environmental regulation compliance • Application and design sample kits • Customer specific screening • Custom product and package development • Up-screening capabilities REQUESTING PRODUCT PLATING 1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when ordering (example: 2N2222A TIN/LEAD). 2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number when ordering (example: 2N2222A PBFREE). CONTACT US Corporate Headquarters & Customer Support Team Central Semiconductor Corp. 145 Adams Avenue Hauppauge, NY 11788 USA Main Tel: (631) 435-1110 Main Fax: (631) 435-1824 Support Team Fax: (631) 435-3388 www.centralsemi.com Worldwide Field Representatives: www.centralsemi.com/wwreps Worldwide Distributors: www.centralsemi.com/wwdistributors For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER, which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms w w w. c e n t r a l s e m i . c o m (001)