PROCESS CPD24
Fast Recovery Rectifier
1 Amp Glass Passivated Rectifier Chip
PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side Metalization GLASS PASSIVATED MESA 51 x 51 MILS 11 MILS 35 x 35 MILS Ni/Au - 5,000Å/2,000Å Ni/Au - 5,000Å/2,000Å
GEOMETRY GROSS DIE PER 4 INCH WAFER 4,250 PRINCIPAL DEVICE TYPES 1N4933 thru 1N4937 1N4942 thru 1N4948 1N5615 thru 1N5623 CMR1F-02M Series
BACKSIDE CATHODE
R1
R3 (29-April 2010)
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PROCESS
CPD24
Typical Electrical Characteristics
R3 (29-April 2010)
w w w. c e n t r a l s e m i . c o m
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