PROCESS
CPD74
Switching Diode
Monolithic Isolated Quad Switching Diode Chip
PROCESS DETAILS Die Size Die Thickness Anode 1, 2, 3, 4 Bonding Pad Area Cathode 1, 2, 3, 4 Bonding Pad Area Top Side Metalization Back Side Metalization 25 x 25 MILS 6.0 MILS 3.5 x 4.0 MILS 3.5 x 4.0 MILS Al - 12,000Å Au - 5,000Å
GEOMETRY GROSS DIE PER 3 INCH WAFER 10,000 PRINCIPAL DEVICE TYPES CMEDA-6i
R2 (22-March 2010)
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PROCESS
CPD74
Typical Electrical Characteristics
R2 (22-March 2010)
w w w. c e n t r a l s e m i . c o m
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