CPD83V-1N4148
High Speed Switching Diode Die
0.15 Amp, 100 Volt
w w w. c e n t r a l s e m i . c o m
The CPD83V-1N4148 is a silicon high speed switching diode ideal for all types of commercial,
industrial, entertainment, and computer applications.
MECHANICAL SPECIFICATIONS:
ANODE
BACKSIDE CATHODE
Die Size
11 x 11 MILS
Die Thickness
7.1 MILS
Anode Bonding Pad Size
3.35 x 3.35 MILS
Top Side Metalization
Al – 30,000Å
Back Side Metalization
Au-As – 9,000Å
Scribe Alley Width
2.3 MILS
Wafer Diameter
5 INCHES
Gross Die Per Wafer
137,880
R0
MAXIMUM RATINGS: (TA=25°C)
Peak Repetitive Reverse Voltage
Peak Working Reverse Voltage
Average Forward Current
SYMBOL
VRRM
100
VRWM
IO
75
V
150
mA
IF
200
mA
IFSM
TJ, Tstg
2.0
A
-65 to +150
°C
MAX
25
UNITS
nA
Continuous Forward Current
Peak Forward Surge Current, tp=1.0μs
Operating and Storage Junction Temperature
ELECTRICAL CHARACTERISTICS: (TA=25°C)
SYMBOL TEST CONDITIONS
IR
VR=20V
MIN
UNITS
V
BVR
BVR
IR=1.0mA
100
V
IR=100μA
75
V
VF
IF=10mA
CJ
trr
1.0
V
VR=0, f=1.0MHz
4.0
pF
VR=6.0V, IF=10mA, Irr=1.0mA, RL=100Ω
4.0
ns
R1 (16-September 2016)
CPD83V-1N4148
Typical Electrical Characteristics
w w w. c e n t r a l s e m i . c o m
R1 (16-September 2016)
CPD83V-1N4148
Typical Electrical Characteristics
w w w. c e n t r a l s e m i . c o m
R1 (16-September 2016)
BARE DIE PACKING OPTIONS
BARE DIE IN TRAY (WAFFLE) PACK
CT: Singulated die in tray (waffle) pack.
(example: CP211-PART NUMBER-CT)
CM: S
ingulated die in tray (waffle) pack 100% visually inspected as
per MIL-STD-750, (method 2072 transistors, method 2073 diodes).
(example: CP211-PART NUMBER-CM)
UNSAWN WAFER
WN: Full wafer, unsawn, 100% tested with reject die inked.
(example: CP211-PART NUMBER-WN)
SAWN WAFER ON PLASTIC RING
WR: F
ull wafer, sawn and mounted on plastic ring,
100% tested with reject die inked.
(example: CP211-PART NUMBER-WR)
Please note: Sawn Wafer on Metal Frame (WS)
is possible as a special order. Please contact your
Central Sales Representative at 631-435-1110.
Visit the Central website for a complete listing of specifications:
www.centralsemi.com/bdspecs
R2 (3-April 2017)
w w w. c e n t r a l s e m i . c o m
OUTSTANDING SUPPORT AND SUPERIOR SERVICES
PRODUCT SUPPORT
Central’s operations team provides the highest level of support to insure product is delivered on-time.
• Supply management (Customer portals)
• Custom bar coding for shipments
• Inventory bonding
• Custom product packing
• Consolidated shipping options
DESIGNER SUPPORT/SERVICES
Central’s applications engineering team is ready to discuss your design challenges. Just ask.
• Free quick ship samples (2nd day air)
• Special wafer diffusions
• Online technical data and parametric search
• PbSn plating options
• SPICE models
• Package details
• Custom electrical curves
• Application notes
• Environmental regulation compliance
• Application and design sample kits
• Customer specific screening
• Custom product and package development
• Up-screening capabilities
REQUESTING PRODUCT PLATING
1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when
ordering (example: 2N2222A TIN/LEAD).
2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number
when ordering (example: 2N2222A PBFREE).
CONTACT US
Corporate Headquarters & Customer Support Team
Central Semiconductor Corp.
145 Adams Avenue
Hauppauge, NY 11788 USA
Main Tel: (631) 435-1110
Main Fax: (631) 435-1824
Support Team Fax: (631) 435-3388
www.centralsemi.com
Worldwide Field Representatives:
www.centralsemi.com/wwreps
Worldwide Distributors:
www.centralsemi.com/wwdistributors
For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER,
which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms
w w w. c e n t r a l s e m i . c o m
(001)
很抱歉,暂时无法提供与“CPD83V-1N4148-CT20”相匹配的价格&库存,您可以联系我们找货
免费人工找货