PROCESS
CPD91
Switching Diode
Low Leakage Switching Diode Chip
Central
TM
Semiconductor Corp.
PROCESS DETAILS Process Die Size Die Thickness Anode Bonding pad Area Top Side Metalization Back Side Metalization EPITAXIAL PLANAR 11 x 11 MILS 9.1 MILS 3.4 x 3.4 MILS Al - 15,000Å Au - 18,000Å
GEOMETRY GROSS DIE PER 4 INCH WAFER 94,130 PRINCIPAL DEVICE TYPES CMPD6001 Series CMOD6001 CMLD6001 CMLD6001DO CMDD6001
145 Adams Avenue Hauppauge, NY 11788 USA Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com
R0 (20- January 2006)
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