CPZ19_10

PROCESS Zener Diode CPZ19 0.5 Watt Zener Diode Chip PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side Metalization EPITAXIAL PLANAR 17.7 x 17.7 MILS 7.5 MILS 11 x 11 MILS Al - 13,000Å Au - 14,000Å GEOMETRY GROSS DIE PER 4 INCH WAFER 36,642 PRINCIPAL DEVICE TYPES CMPZ5235B THRU CMPZ5261B BACKSIDE CATHODE R5 (22-March 2010) w w w. c e n t r a l s e m i . c o m PROCESS CPZ19 Typical Electrical Characteristics R5 (22-March 2010) w w w. c e n t r a l s e m i . c o m