CTLHR10-06TR13

CTLHR10-06 SURFACE MOUNT SILICON HYPERFAST RECOVERY RECTIFIER 10 AMP, 600 VOLT w w w. c e n t r a l s e m i . c o m DESCRIPTION: The CENTRAL SEMICONDUCTOR CTLHR10-06 is a HyperFast power rectifier designed for high voltage, high frequency applications such as PFC that require a low profile, high power density package. MARKING CODE: CHR1006 TLM364 CASE APPLICATIONS: • Power Factor Correction (PFC) • Motor control • Power management • DC-DC output rectification FEATURES: • HyperFast recovery time (22ns TYP) • Low reverse leakage current (1.2μA TYP) • Low profile 1.2mm MAX package height MAXIMUM RATINGS: (TA=25°C) Peak Repetitive Reverse Voltage SYMBOL VRRM VR DC Blocking Voltage RMS Reverse Voltage Average Forward Current (TL=90°C) Peak Forward Surge Current, tp=8.3ms Operating and Storage Junction Temperature Thermal Resistance (Note 1) Thermal Resistance (Note 1) UNITS V 600 VR(RMS) IO IFSM TJ, Tstg 600 V 420 V 10 A 150 A -65 to +175 °C 10 °C/W 23 °C/W ΘJL ΘJA ELECTRICAL SYMBOL IR IR CHARACTERISTICS: (TA=25°C unless otherwise noted) TEST CONDITIONS MIN TYP VR=600V 1.2 VR=600V, TA=150°C BVR IR=0.5mA VF IF=10A 1.6 VF 1.15 VF IF=10A, TA=125°C IF=10A, TA=-40°C 1.8 V CJ VR=4.0V, f=1.0MHz 42 pF trr IF=10A, VR=400V, di/dt=200A/μs 22 MAX 10 UNITS μA 500 μA 600 V 1.7 V V 25 ns Notes: (1) FR-4 epoxy PCB with 25cm2 copper pad area. R1 (27-February 2014) CTLHR10-06 SURFACE MOUNT SILICON HYPERFAST RECOVERY RECTIFIER 10 AMP, 600 VOLT TLM364 CASE - MECHANICAL OUTLINE SUGGESTED MOUNTING PADS (Dimensions in mm) LEAD CODE: 1) Anode 2) Anode 3) Cathode MARKING CODE: CHR1006 R1 (27-February 2014) w w w. c e n t r a l s e m i . c o m CTLHR10-06 SURFACE MOUNT SILICON HYPERFAST RECOVERY RECTIFIER 10 AMP, 600 VOLT TYPICAL ELECTRICAL CHARACTERISTICS R1 (27-February 2014) w w w. c e n t r a l s e m i . c o m OUTSTANDING SUPPORT AND SUPERIOR SERVICES PRODUCT SUPPORT Central’s operations team provides the highest level of support to insure product is delivered on-time. • Supply management (Customer portals) • Custom bar coding for shipments • Inventory bonding • Custom product packing • Consolidated shipping options DESIGNER SUPPORT/SERVICES Central’s applications engineering team is ready to discuss your design challenges. Just ask. • Free quick ship samples (2nd day air) • Special wafer diffusions • Online technical data and parametric search • PbSn plating options • SPICE models • Package details • Custom electrical curves • Application notes • Environmental regulation compliance • Application and design sample kits • Customer specific screening • Custom product and package development • Up-screening capabilities REQUESTING PRODUCT PLATING 1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when ordering (example: 2N2222A TIN/LEAD). 2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number when ordering (example: 2N2222A PBFREE). CONTACT US Corporate Headquarters & Customer Support Team Central Semiconductor Corp. 145 Adams Avenue Hauppauge, NY 11788 USA Main Tel: (631) 435-1110 Main Fax: (631) 435-1824 Support Team Fax: (631) 435-3388 www.centralsemi.com Worldwide Field Representatives: www.centralsemi.com/wwreps Worldwide Distributors: www.centralsemi.com/wwdistributors For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER, which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms w w w. c e n t r a l s e m i . c o m (001)