CTLSH01-30TR

CTLSH01-30 w w w. c e n t r a l s e m i . c o m SURFACE MOUNT SILICON SCHOTTKY DIODE DESCRIPTION: The CENTRAL SEMICONDUCTOR CTLSH01-30 is a high quality Schottky Diode designed for applications where ultra small size and power dissipation are prime requirements. Packaged in a TLM2D3D6 package, this component provides performance characteristics suitable for the most demanding size constrained applications. MARKING CODE: C TLM2D3D6 CASE APPLICATIONS: FEATURES: • DC-DC converters • Voltage clamping • Protection circuits • Battery powered applications including cell phones, digital cameras, pagers, PDAs, laptop computers, etc. • Current (IO=100mA) • Low forward voltage drop (VF=0.41V TYP @ 10mA) • Low reverse current (30nA TYP @ 10V) • Ultra small, ultra low profile 0.3mm x 0.6mm x 0.3mm leadless surface mount package MAXIMUM RATINGS: (TA=25°C) Peak Repetitive Reverse Voltage Average Forward Current Peak Forward Surge Current, tp=8.3ms Power Dissipation Operating Junction Temperature Storage Temperature Thermal Resistance SYMBOL VRRM IO IFSM PD TJ Tstg ΘJA UNITS V mA mA mW °C °C °C/W 30 100 500 100 -65 to +125 -65 to +150 1000 ELECTRICAL CHARACTERISTICS: (TA=25°C unless otherwise noted) SYMBOL TEST CONDITIONS MIN TYP MAX UNITS IR 30 300 nA 0.46 V BVR VR=10V IR=100μA VF IF=10mA 0.41 CJ VR=0, f=1.0MHz 7.0 30 V pF R4 (29-September 2015) CTLSH01-30 SURFACE MOUNT SILICON SCHOTTKY DIODE TLM2D3D6 CASE - MECHANICAL OUTLINE LEAD CODE: 1) Cathode 2) Anode MARKING CODE: C R4 (29-September 2015) w w w. c e n t r a l s e m i . c o m CTLSH01-30 SURFACE MOUNT SILICON SCHOTTKY DIODE TYPICAL ELECTRICAL CHARACTERISTICS R4 (29-September 2015) w w w. c e n t r a l s e m i . c o m CTLSH01-30 SURFACE MOUNT SILICON SCHOTTKY DIODE TYPICAL ELECTRICAL CHARACTERISTICS R4 (29-September 2015) w w w. c e n t r a l s e m i . c o m OUTSTANDING SUPPORT AND SUPERIOR SERVICES PRODUCT SUPPORT Central’s operations team provides the highest level of support to insure product is delivered on-time. • Supply management (Customer portals) • Custom bar coding for shipments • Inventory bonding • Custom product packing • Consolidated shipping options DESIGNER SUPPORT/SERVICES Central’s applications engineering team is ready to discuss your design challenges. Just ask. • Free quick ship samples (2nd day air) • Special wafer diffusions • Online technical data and parametric search • PbSn plating options • SPICE models • Package details • Custom electrical curves • Application notes • Environmental regulation compliance • Application and design sample kits • Customer specific screening • Custom product and package development • Up-screening capabilities REQUESTING PRODUCT PLATING 1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when ordering (example: 2N2222A TIN/LEAD). 2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number when ordering (example: 2N2222A PBFREE). CONTACT US Corporate Headquarters & Customer Support Team Central Semiconductor Corp. 145 Adams Avenue Hauppauge, NY 11788 USA Main Tel: (631) 435-1110 Main Fax: (631) 435-1824 Support Team Fax: (631) 435-3388 www.centralsemi.com Worldwide Field Representatives: www.centralsemi.com/wwreps Worldwide Distributors: www.centralsemi.com/wwdistributors For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER, which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms w w w. c e n t r a l s e m i . c o m (001)