CXDM1002NTR

CXDM1002N SURFACE MOUNT SILICON N-CHANNEL ENHANCEMENT-MODE MOSFET w w w. c e n t r a l s e m i . c o m DESCRIPTION: The CENTRAL SEMICONDUCTOR CXDM1002N is a high voltage silicon N-Channel enhancement-mode MOSFET designed for high speed pulsed amplifier and driver applications. This MOSFET offers high voltage, low rDS(ON), low threshold voltage, and low leakage current. MARKING: FULL PART NUMBER SOT-89 CASE APPLICATIONS: • Load/Power switches • Power supply converter circuits • Battery powered portable equipment MAXIMUM RATINGS: (TA=25°C) Drain-Source Voltage FEATURES: • Low rDS(ON) (140mΩ TYP @ VGS=4.5V) • High voltage (VDS=100V) • Logic level compatibility • 2kV ESD protection SYMBOL VDS VGS 100 UNITS V 20 V Continuous Drain Current (Steady State) ID 2.0 A Maximum Pulsed Drain Current, tp=10μs IDM PD 7.0 A 1.2 W TJ, Tstg ΘJA -55 to +150 °C 104 °C/W Gate-Source Voltage Power Dissipation Operating and Storage Junction Temperature Thermal Resistance ELECTRICAL CHARACTERISTICS: (TA=25°C unless otherwise noted) SYMBOL TEST CONDITIONS MIN TYP VGS=20V, VDS=0 IGSSF, IGSSR IDSS VDS=100V, VGS=0 MAX 15 UNITS μA 100 nA 2.1 2.5 V 1.1 V VGS=10V, ID=2.0A VGS=4.5V, ID=1.0A 125 300 mΩ 140 350 mΩ 48 pF Ciss VDS=25V, VGS=0, f=1.0MHz VDS=25V, VGS=0, f=1.0MHz 550 pF Coss Qg(tot) VDS=25V, VGS=0, f=1.0MHz VDS=80V, VGS=5.0V, ID=2.0A 45 pF 6.0 nC Qgs 1.2 nC 3.0 nC ton VDS=80V, VGS=5.0V, ID=2.0A VDS=80V, VGS=5.0V, ID=2.0A VDD=50V, VGS=5.0V, ID=3.5A 32 ns toff RG=4.7Ω 50 BVDSS VGS(th) VSD rDS(ON) rDS(ON) Crss Qgd VGS=0, ID=250μA VGS=VDS, ID=250μA VGS=0, IS=1.0A 100 1.5 V ns R2 (28-November 2017) CXDM1002N SURFACE MOUNT SILICON N-CHANNEL ENHANCEMENT-MODE MOSFET SOT-89 CASE - MECHANICAL OUTLINE PIN CONFIGURATION LEAD CODE: 1) Gate 2) Drain 3) Source MARKING: FULL PART NUMBER R2 (28-November 2017) w w w. c e n t r a l s e m i . c o m CXDM1002N SURFACE MOUNT SILICON N-CHANNEL ENHANCEMENT-MODE MOSFET TYPICAL ELECTRICAL CHARACTERISTICS R2 (28-November 2017) w w w. c e n t r a l s e m i . c o m OUTSTANDING SUPPORT AND SUPERIOR SERVICES PRODUCT SUPPORT Central’s operations team provides the highest level of support to insure product is delivered on-time. • Supply management (Customer portals) • Custom bar coding for shipments • Inventory bonding • Custom product packing • Consolidated shipping options DESIGNER SUPPORT/SERVICES Central’s applications engineering team is ready to discuss your design challenges. Just ask. • Free quick ship samples (2nd day air) • Special wafer diffusions • Online technical data and parametric search • PbSn plating options • SPICE models • Package details • Custom electrical curves • Application notes • Environmental regulation compliance • Application and design sample kits • Customer specific screening • Custom product and package development • Up-screening capabilities REQUESTING PRODUCT PLATING 1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when ordering (example: 2N2222A TIN/LEAD). 2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number when ordering (example: 2N2222A PBFREE). CONTACT US Corporate Headquarters & Customer Support Team Central Semiconductor Corp. 145 Adams Avenue Hauppauge, NY 11788 USA Main Tel: (631) 435-1110 Main Fax: (631) 435-1824 Support Team Fax: (631) 435-3388 www.centralsemi.com Worldwide Field Representatives: www.centralsemi.com/wwreps Worldwide Distributors: www.centralsemi.com/wwdistributors For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER, which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms w w w. c e n t r a l s e m i . c o m (001)