CEF655N

CEP655N/CEB655N CEI655N/CEF655N N-Channel Enhancement Mode Field Effect Transistor FEATURES Type CEP655N CEB655N CEI655N CEF655N VDSS 150V 150V 150V 150V RDS(ON) 0.153Ω 0.153Ω 0.153Ω 0.153Ω ID 15A 15A 15A 15A d PRELIMINARY @VGS 10V 10V 10V 10V D Super high dense cell design for extremely low RDS(ON). High power and current handing capability. Lead free product is acquired. TO-220 & TO-263 & TO-262 package & TO-220F full-pak for through hole. D G S CEB SERIES TO-263(DD-PAK) G G D S CEI SERIES TO-262(I2-PAK) G D S CEP SERIES TO-220 G D S CEF SERIES TO-220F S ABSOLUTE MAXIMUM RATINGS Parameter Drain-Source Voltage Gate-Source Voltage Drain Current-Continuous Drain Current-Pulsed a Tc = 25 C unless otherwise noted Limit Symbol TO-220/263/262 VDS VGS ID IDM PD TJ,Tstg e TO-220F Units V V 150 ±25 15 60 83 0.56 -55 to 175 15 60 39 0.26 d d A A W W/ C C Maximum Power Dissipation @ TC = 25 C - Derate above 25 C Operating and Store Temperature Range Thermal Characteristics Parameter Thermal Resistance, Junction-to-Case Thermal Resistance, Junction-to-Ambient Symbol RθJC RθJA 1.8 62.5 Limit 3.8 65 Units C/W C/W This is preliminary information on a new product in development now . Details are subject to change without notice . 1 Rev 1. 2005.June http://www.cetsemi.com CEP655N/CEB655N CEI655N/CEF655N Electrical Characteristics Parameter Off Characteristics Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate Body Leakage Current, Forward Gate Body Leakage Current, Reverse On Characteristics b Gate Threshold Voltage Static Drain-Source On-Resistance Forward Transconductance Dynamic Characteristics Input Capacitance Output Capacitance Reverse Transfer Capacitance Switching Characteristics c Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge Drain-Source Diode Forward Current Drain-Source Diode Forward Voltage b c Tc = 25 C unless otherwise noted Symbol BVDSS IDSS IGSSF IGSSR VGS(th) RDS(on) gFS Ciss Coss Crss td(on) tr td(off) tf Qg Qgs Qgd IS f VSD VGS = 0V, IS = 15A g VDS = 120V, ID = 15A, VGS = 10V VDD = 75V, ID = 15A, VGS = 10V, RGEN = 25Ω Test Condition VGS = 0V, ID = 250µA VDS = 150V, VGS = 0V VGS = 25V, VDS = 0V VGS = -25V, VDS = 0V VGS = VDS, ID = 250µA VGS = 10V, ID = 8.2A VDS = 40V, ID = 8.2A 2 118 5 750 175 70 17 48 40 46 26 6 12.5 15 1.5 35 100 80 90 34 Min 150 1 100 -100 4 153 Typ Max Units V µA 4 nA nA V mΩ S pF pF pF ns ns ns ns nC nC nC A V VDS = 25V, VGS = 0V, f = 1.0 MHz Drain-Source Diode Characteristics and Maximun Ratings Notes : a.Repetitive Rating : Pulse width limited by maximum junction temperature . b.Pulse Test : Pulse Width < 300µs, Duty Cycle < 2% . c.Guaranteed by design, not subject to production testing. d.Limited only by maximum temperature allowed . e .Pulse width limited by safe operating area . f .Full package IS(max) = 10A . g.Full package VSD test condition IS = 10A . 2 CEP655N/CEB655N CEI655N/CEF655N 30 VGS=10,8,6,4V 50 25 C ID, Drain Current (A) ID, Drain Current (A) 24 40 18 30 12 20 TJ=125 C -55 C 6 10 0 0 1 2 3 4 5 0 1 2 3 4 5 6 7 VDS, Drain-to-Source Voltage (V) Figure 1. Output Characteristics 1200 1000 Ciss 800 600 400 200 0 0 5 10 15 20 25 Coss Crss 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -100 VGS, Gate-to-Source Voltage (V) Figure 2. Transfer Characteristics RDS(ON), Normalized RDS(ON), On-Resistance(Ohms) ID=8.2A VGS=10V C, Capacitance (pF) -50 0 50 100 150 200 VDS, Drain-to-Source Voltage (V) Figure 3. Capacitance 1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 -50 TJ, Junction Temperature( C) Figure 4. On-Resistance Variation with Temperature VGS=0V VTH, Normalized Gate-Source Threshold Voltage VDS=VGS ID=250µA IS, Source-drain current (A) 10 1 10 0 10 -25 0 25 50 75 100 125 150 -1 0.4 0.6 0.8 1.0 1.2 1.4 TJ, Junction Temperature( C) Figure 5. Gate Threshold Variation with Temperature VSD, Body Diode Forward Voltage (V) Figure 6. Body Diode Forward Voltage Variation with Source Current 3 CEP655N/CEB655N CEI655N/CEF655N VGS, Gate to Source Voltage (V) 10 10 VDS=120V ID=15A 2 RDS(ON)Limit 100µs ID, Drain Current (A) 8 4 10 1 1ms 10ms DC 6 4 10 0 2 0 0 6 12 18 24 30 10 -1 TC=25 C TJ=175 C Single Pulse 0 10 10 1 10 2 10 3 Qg, Total Gate Charge (nC) Figure 7. Gate Charge VDS, Drain-Source Voltage (V) Figure 8. Maximum Safe Operating Area VDD t on V IN D VGS RGEN G 90% toff tr 90% RL VOUT td(on) VOUT td(off) 90% 10% tf 10% INVERTED S VIN 50% 10% 50% PULSE WIDTH Figure 9. Switching Test Circuit Figure 10. Switching Waveforms r(t),Normalized Effective Transient Thermal Impedance 10 0 D=0.5 0.2 10 -1 0.1 0.05 0.02 0.01 Single Pulse PDM t1 t2 1. RθJC (t)=r (t) * RθJC 2. RθJC=See Datasheet 3. TJM-TC = P* RθJC (t) 4. Duty Cycle, D=t1/t2 10 -2 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1 Square Wave Pulse Duration (sec) Figure 11. Normalized Thermal Transient Impedance Curve 4