CEP02N7G

N-Channel Enhancement Mode Field Effect Transistor FEATURES Type CEP02N7G CEB02N7G CEF02N7G VDSS 700V 700V 700V RDS(ON) 6.75Ω 6.75Ω 6.75Ω ID 2A 2A 2A d @VGS 10V 10V 10V CEP02N7G/CEB02N7G CEF02N7G Super high dense cell design for extremely low RDS(ON). High power and current handing capability. Lead free product is acquired. D D G G D S G CEP SERIES TO-220 S CEB SERIES TO-263(DD-PAK) G D S CEF SERIES TO-220F S ABSOLUTE MAXIMUM RATINGS Parameter Drain-Source Voltage Gate-Source Voltage Drain Current-Continuous @ TC = 25 C @ TC = 100 C Drain Current-Pulsed a Maximum Power Dissipation @ TC = 25 C - Derate above 25 C Single Pulsed Avalanche Energy h Single Pulsed Avalanche Current h Operating and Store Temperature Range Tc = 25 C unless otherwise noted Limit Symbol TO-220/263 VDS VGS ID IDM e PD EAS IAS TJ,Tstg 2 1.3 8 60 0.48 11.25 1.5 700 TO-220F Units V V ±30 2 d d A A A W W/ C mJ A C 1.3 8d 33 0.26 -55 to 150 Thermal Characteristics Parameter Thermal Resistance, Junction-to-Case Thermal Resistance, Junction-to-Ambient Symbol RθJC RθJA 2.1 62.5 Limit 3.9 65 Units C/W C/W Details are subject to change without notice . 1 Rev 3. 2011.Jan http://www.cetsemi.com Electrical Characteristics Parameter Off Characteristics Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate Body Leakage Current, Forward Gate Body Leakage Current, Reverse On Characteristics b Gate Threshold Voltage Static Drain-Source On-Resistance Dynamic Characteristics c Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Switching Characteristics c Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge Drain-Source Diode Forward Current Drain-Source Diode Forward Voltage b CEP02N7G/CEB02N7G CEF02N7G Tc = 25 C unless otherwise noted Symbol BVDSS IDSS IGSSF IGSSR VGS(th) RDS(on) Test Condition VGS = 0V, ID = 250µA VDS = 700V, VGS = 0V VGS = 30V, VDS = 0V VGS = -30V, VDS = 0V VGS = VDS, ID = 250µA VGS = 10V, ID = 1A 2 5.4 Min 700 25 100 -100 4 6.75 Typ Max Units V µA nA nA V Ω gFS Ciss Coss Crss td(on) tr td(off) tf Qg Qgs Qgd IS f VSD VDS = 50V, ID = 1A VDS = 25V, VGS = 0V, f = 1.0 MHz 1.5 315 55 20 14 12.5 23 10 9 1.5 5 2 S pF pF pF ns ns ns ns nC nC nC A V VDD = 300V, ID = 2A, VGS = 10V, RGEN = 18Ω VDS = 480V, ID = 2A, VGS = 10V Drain-Source Diode Characteristics and Maximun Ratings VGS = 0V, IS = 1A g 1.5 Notes : a.Repetitive Rating : Pulse width limited by maximum junction temperature . b.Pulse Test : Pulse Width < 300µs, Duty Cycle < 2% . c.Guaranteed by design, not subject to production testing. d.Limited only by maximum temperature allowed . e.Pulse width limited by safe operating area . f.Full package IS(max) = 1.5A . g.Full package VSD test condition IS = 1.5A . h.L =10mH, IAS =1.5A, VDD = 50V, RG = 25Ω, Starting TJ = 25 C 2 CEP02N7G/CEB02N7G CEF02N7G 1.8 1.5 1.2 0.9 0.6 0.3 0 VGS=10,9,8,7V 3.0 2.5 2.0 1.5 1.0 0.5 0 ID, Drain Current (A) VGS=6V ID, Drain Current (A) VGS=5V 25 C TJ=125C 0 1.5 3.0 4.5 -55 C 6.0 7.5 0 5 10 15 20 25 30 VDS, Drain-to-Source Voltage (V) Figure 1. Output Characteristics 600 500 400 300 200 100 0 Coss Crss 0 5 10 15 20 25 Ciss 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -100 VGS, Gate-to-Source Voltage (V) Figure 2. Transfer Characteristics ID= 2A VGS=10V RDS(ON), Normalized RDS(ON), On-Resistance(Ohms) C, Capacitance (pF) -50 0 50 100 150 200 VDS, Drain-to-Source Voltage (V) Figure 3. Capacitance 1.3 1.2 1.1 1.0 0.9 0.8 0.7 0.6 -50 VDS=VGS TJ, Junction Temperature( C) Figure 4. On-Resistance Variation with Temperature 10 1 VTH, Normalized Gate-Source Threshold Voltage IS, Source-drain current (A) ID=250µA VGS=0V 10 0 10 -25 0 25 50 75 100 125 150 -1 0.4 0.6 0.8 1.0 1.2 1.4 1.6 TJ, Junction Temperature( C) Figure 5. Gate Threshold Variation with Temperature VSD, Body Diode Forward Voltage (V) Figure 6. Body Diode Forward Voltage Variation with Source Current 3 CEP02N7G/CEB02N7G CEF02N7G VGS, Gate to Source Voltage (V) 10 8 6 4 2 0 VDS=480V ID=2A 10 1 RDS(ON)Limit ID, Drain Current (A) 100ms 1ms 10ms DC 10 0 10 -1 0 3 6 9 12 10 -2 TC=25 C TJ=175 C Single Pulse 10 0 10 1 10 2 10 3 Qg, Total Gate Charge (nC) Figure 7. Gate Charge VDD t on V IN VGS RGEN G RL D VOUT td(on) VOUT 10% VDS, Drain-Source Voltage (V) Figure 8. Maximum Safe Operating Area toff tr 90% td(off) 90% 10% tf INVERTED 90% S VIN 50% 10% 50% PULSE WIDTH Figure 9. Switching Test Circuit Figure 10. Switching Waveforms r(t),Normalized Effective Transient Thermal Impedance 10 0 D=0.5 0.2 0.1 -1 10 PDM 0.05 0.02 0.01 t1 t2 10 -2 Single Pulse -5 1. RθJC (t)=r (t) * RθJC 2. RθJC=See Datasheet 3. TJM-TC = P* RθJC (t) 4. Duty Cycle, D=t1/t2 10 10 -4 10 -3 10 -2 10 -1 10 0 10 1 Square Wave Pulse Duration (sec) Figure 11. Normalized Thermal Transient Impedance Curve 4