US1B

US1B

  • 厂商:

    CHENG-YI

  • 封装:

  • 描述:

    US1B - SURFACE MOUNT ULTRAFAST RECTIFIER - CHENG-YI ELECTRONIC CO., LTD.

  • 详情介绍
  • 数据手册
  • 价格&库存
US1B 数据手册
US1A thru US1K SURFACE MOUNT ULTRAFAST S URFACE RECTIFIER CHENG- YI CHENGELECTRONIC VOLTAGE RANGE -50 TO 800 VOLTS CURRENT -1.0 Amperes SMA/DO-214AC FEATURES For surface mounted applications Low profile package Built-in strain relief Easy pick and place Ultrafast recovery times for high efficiency Plastic package has Underwriters Laboratory Flammability Classification 94V-O Glass passivated junction High temperature soldering 260oC/10 seconds at terminals .055(1.40) .062(1.60) .098(2.50) .114(2.90) .157(4.00) .181(4.60) .006(.152) .012(.305) .078(2.00) .096(2.44) .002(.051) .008(.203) .188(4.80) .208(5.28) MECHANICAL DATA Case: JEDEC DO-214AC molded plastic Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 Polarity: Indicated by cathode band Standard Packaging: 12mm tape (EIA-481) Weight: 0.002 ounces, 0.064 gram .030(0.76) .060(1.52) Dimensions in inches and (millimeters) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 250C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, reistive or inductive load. For capacitive load, derate current by 20%. SYMBOLS US1A 50 35 50 US1B 100 70 100 US1D 200 140 200 1.0 US1G 400 280 400 US1J 600 420 600 US1K 800 560 800 UNITS V V V A Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Rectified Current, at TL=100 C 0 VRRM VRMS VDC I(AV) Peak Forward Surge Current 8.3 ms single half sine-wave superimposed on rated load (JEDEC Method) TA=55 C 0 IFSM VF IR 0 30.0 A Maximum Instantaneous Forward Voltage at 1.0A Maximum DC Reverse Current at Rated DC Blocking Voltage @ TA=250C @ TA=1000C 1.0 10.0 100 50.0 17.0 1.4 1.7 V A 100.0 Maximum Reverse Recovery Time (Note 1) TJ=25 C Typical Junction Capacitance (Note 2) Maximum Thermal Resistance (Note 3) Operating and Storage Temperature Range R TRR CJ JL TJ , TSTG nS pF 0 30.0 -50 to +150 C/W 0 C Notes : 1. Reverse Recovery Test Conditions: IF=0.5A, I R=1.0A, I RR=0.25A 2. Measured at 1.0 MHZ and Applied Vr=4.0 volts. 3. 8.0mm2 (.013mm thick) land areas. US1A thru US1K SURFACE MOUNT ULTRAFAST S URFACE RECTIFIER CHENG- YI ELECTRONIC RATING AND CHARACTERISTICS CURVES US1A THRU US1K Fig. 1 - REVERSE RECOVERY TIME CHARACTERISTIC AND TEST CIRCUIT DIAGRAM 50 Noninductive 10 Noninductive trr +0.5A () PULSE GENERATOR NOTE 2 (+) 25 Vdc (approx) () D.U.T. 0 -0.25 1 NONInductive OSCILLOSCOPE NOTE 1 (+) NOTES:1. Rise Time=7ns max. Input Impedance=1 megohm. 22pF 2. Rise Time=10ns max. Source Impedance=50 Ohms. -1.0 SET TIME BASE FOR 10ns/cm 1cm Fig. 2 - FORWARD CHARACTERISTICS 10 US1A Fig. 3 - FORWARD CURRENT DERATING CURVE AVERAGE FORWARD CURRENT, AMPERES 2.0 SINGLE PHASE HALF W AVE 60HZ RESISTIVE OR INDUCTIVE LOAD P.C.B MOUNTED ON 0.315x0.315"(8.0x8.0mm) COPPER PAD AREAS TYPICAL 1.0 US1G US1K IFM. Apk 1.0 0.1 TJ=250C .01 0 .2 .4 .6 .8 1.0 1.2 1.4 25 50 75 100 125 150 175 o LEAD TEMPERATURE, C Fig. 4 - TYPICAL JUNCTION CAPACITANCE 100 JUNCTION CAPACITANCE, pF Fig. 5 - PEAK FORWARD SURGE CURRENT 0 TJ=25C f=1.0MHz Vsig=50mVp-p 30 25 PEAK FORWARD SURGE CURRENT, AMPERES 10 20 15 10 5 8.3ms SINGLE HALF SINCE-WAVE JEDEC METHOD 1 0.1 1 10 100 REVERSE VOLTAGE, VOLTS 1 2 5 10 20 50 100 NUMBER OF CYCLES AT 60Hz
US1B
1. 物料型号: - 型号包括US1A至US1K,这些是表面贴装超快速整流器。

2. 器件简介: - 这些器件适用于表面贴装应用,具有低轮廓封装、内置应力消除、易于拾放、超快速恢复时间以提高效率。塑料封装具有UL94V-0可燃性等级认证,玻璃钝化结,高温焊接260°C/10秒,适用于端子。

3. 引脚分配: - 极性由阴极带表示,符合JEDEC DO-214AC塑封标准,端子为镀锡,符合MIL-STD-750方法2026,标准包装为12mm胶带(EIA-481)。

4. 参数特性: - 最大重复峰值反向电压(VRRM)从50V至800V不等,最大RMS电压(VRMS)从35V至560V不等,最大直流阻断电压(Vc)与VRRM相同,最大平均正向整流电流(IAM)为1.0A,峰值正向浪涌电流(IFSM)最高为30.0A,最大瞬时正向电压(VF)从1.0V至1.7V不等,最大直流反向电流(IR)从10.0mA至100mA不等,最大反向恢复时间(TRR)从50ns至100ns不等,典型结电容(Cj)为17.0pF,最大热阻(RthJL)为30.0°C/W,工作和存储温度范围(T_OP, T_STG)为-50至+150°C。

5. 功能详解: - 这些整流器适用于单相、半波、60Hz的电阻性或感性负载。对于电容性负载,电流需降低20%。反向恢复测试条件为Ik=0.5A,Ir=1.0A,Irr=0.25A。结电容测量在1.0MHz和4.0V的反向电压下进行。热阻测量在8.0mm²(0.013mm厚)的接地面积上进行。

6. 应用信息: - 这些超快速整流器适用于需要快速恢复时间和高效率的应用场合。

7. 封装信息: - 封装为SMA/DO-214AC,尺寸以英寸和毫米给出,重量为0.002盎司或0.064克。

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