WM7211IMSE/RV

WM7211, WM7211E w Top Port Digital Silicon Microphone DESCRIPTION The WM7211 is a low-profile silicon digital microphone. It offers high Signal to Noise Ratio (SNR) and low power consumption and is suited to a wide variety of consumer applications. The WM7211 incorporates Wolfson’s proprietary CMOS/MEMS membrane technology, offering high reliability and high performance in a miniature, low-profile package. The WM7211 is designed to withstand the high temperatures associated with automated flow solder assembly processes. (Note that conventional microphones can be damaged by this process.) The WM7211 incorporates a high performance ADC, which outputs a single-bit Pulse Density Modulated (PDM) audio data stream. The WM7211 supports selectable left/right channel assignment for a two-channel digital microphone interface, enabling efficient connection of multiple microphones in stereo/array configurations. The WM7211E variant offers a tighter tolerance on the microphone sensitivity, giving reduced variation between parts. This removes the need for in-line production calibration of part-to-part microphone variations. FEATURES High SNR; selectable sensitivity tolerance options  - WM7211 – SNR 61dB, Sensitivity +/-3dB - WM7211E – SNR 61dB, Sensitivity +/-1dB Low power - Sleep mode - 2μA - Normal operation - 735μA  Low profile packaging  Support for automated flow solder assembly  PDM digital audio output  Stereo/array operation  Proprietary ADC technology - Reduced clock jitter sensitivity - Low noise floor modulation - Stable in overload condition  Top port package  1.64V to 3.7V supply  4.00 x 3.00 x 1.00mm thin package design APPLICATIONS  Mobile telephone handsets  Portable computers  Portable media players  Digital still cameras  Digital video cameras  Bluetooth headsets  Portable navigation devices BLOCK DIAGRAM WOLFSON MICROELECTRONICS plc Pre-Production, January 2014, Rev 3.1 Copyright 2014 Wolfson Microelectronics plc WM7211 Pre-Production TABLE OF CONTENTS DESCRIPTION ....................................................................................................... 1  FEATURES ............................................................................................................ 1  APPLICATIONS..................................................................................................... 1  BLOCK DIAGRAM ................................................................................................ 1  TABLE OF CONTENTS ......................................................................................... 2  PIN CONFIGURATION .......................................................................................... 3  PIN DESCRIPTION ................................................................................................ 3  ORDERING INFORMATION .................................................................................. 3  ABSOLUTE MAXIMUM RATINGS ........................................................................ 4  IMPORTANT ASSEMBLY GUIDELINES .............................................................. 4  RECOMMENDED OPERATING CONDITIONS ..................................................... 4  ACOUSTIC AND ELECTRICAL CHARACTERISTICS ......................................... 5  TERMINOLOGY ............................................................................................................... 5  AUDIO INTERFACE TIMING ........................................................................................... 7  TYPICAL PERFORMANCE ................................................................................... 8  FREQUENCY RESPONSE .............................................................................................. 8  THD RATIO ...................................................................................................................... 8  APPLICATIONS INFORMATION .......................................................................... 9  RECOMMENDED EXTERNAL COMPONENTS .............................................................. 9  OPTIMISED SYSTEM RF DESIGN ................................................................................. 9  CONNECTION TO A WOLFSON AUDIO CODEC .......................................................... 9  RECOMMENDED PCB LAND PATTERNS ................................................................... 10  PACKAGE DIMENSIONS (LGA) ......................................................................... 11  IMPORTANT NOTICE ......................................................................................... 12  ADDRESS: .......................................................................................................... 12  REVISION HISTORY ........................................................................................... 13  w PP, Rev 3.1, January 2014 2 WM7211 Pre-Production PIN CONFIGURATION PIN DESCRIPTION PIN NAME TYPE DESCRIPTION 1 VDD Supply 2 LRSEL Digital Input Supply Channel Select 0 = Data output following falling CLK edge 1 = Data output following rising CLK edge 3 CLK Digital Input 4 DAT Digital Output Clock input 5 GND Supply PDM Data Output Ground ORDERING INFORMATION MOISTURE SENSITIVITY LEVEL PEAK SOLDERING TEMPERATURE o MSL2A +260 C o MSL2A +260 C DEVICE DESCRIPTION TEMPERATURE RANGE WM7211IMS/RV Standard (tape and reel) -40 to +100 C WM7211IMSE/RV Standard Enhanced (tape and reel) -40 to +100 C o o Note: Reel Quantity = 4800 All devices are Pb-free and Halogen free. w PP, Rev 3.1, January 2014 3 WM7211 Pre-Production ABSOLUTE MAXIMUM RATINGS Absolute Maximum Ratings are stress ratings only. Permanent damage to the device may be caused by continuously operating at or beyond these limits. Device functional operating limits and guaranteed performance specifications are given under Electrical Characteristics at the test conditions specified. ESD Sensitive Device. This device is manufactured on a CMOS process. It is therefore generically susceptible to damage from excessive static voltages. Proper ESD precautions must be taken during handling and storage of this device. Wolfson tests its package types according to IPC/JEDEC J-STD-020 for Moisture Sensitivity to determine acceptable storage conditions prior to surface mount assembly. These levels are: MSL1 = unlimited floor life at