CFS20632768HZF

RoHS Compliance Document № Date Page : : : 04DA3-346 TM-5290 2014/5/15 1 OF 8 SPECIFICATIONS Approved by Messrs. Product CRYSTAL UNIT Type of Holder CFS-206 Nominal Frequency 32.768 kHz Customer's Parts Number Our Parts Number Sales Manufacturer CFS-20632768HZFB CITIZEN FINETECH MIYOTA Co.,LTD. Crystal Devices Department. 4107-5,MIYOTA,MIYOTA-MACHI,KITASAKU-GUN,NAGANO,389-0295,JAPAN TEL ： +81-267-31-1111 FAX ： +81-267-31-1129 Revision History Document № Date Page Record Page Revision number Date 1 st 2014/5/15 Section Changes : : : TM-5290 2014/5/15 2 OF 8 Prepared Document № Date Page : : : TM-5290 2014/5/15 3 OF 8 1． ． Scope This document contains specifications for the crystal unit to be supplied by CITIZEN FINETECH MIYOTA Co.,LTD. 1.1 If something defined ambiguously or undefined in document happened, the customer and CITIZEN FINETECH MIYOTA would discuss and take necessary steps by mutual consent. 1.2 Product test data can't be attached to this document. The contents except Electrical Specifications in specifiations are subject the change without notice. 1.3 This product is not authorized for use as a critical component in life support devices or systems. 2． ． Electrical Specifications 2.1 Nominal Frequency 32.768 kHz 2.2 Operating Temperature Range -20～+70℃ 2.3 Storage Temperature Range -40～+85℃ 2.4 Frequency Tolerance ±5ppm Max. at 25℃ 2.5 Frequency Tolerance over Operating Temperature Range Turnover Temp.；25±5℃ 2.6 Equivalent Series Resistance 35kΩ Max.at 25℃ 2.7 Insulation Resistance 500MΩ Min./DC100V±15V 2.8 Shunt Capacitance 1.20pF Typ. Temp.Coefficient：-0.034±0.006ppm／℃2 3． ． Test Conditions 3.1 Load Capacitance 12.5pF This Load Capacitance has been fixed on customer's request. 3.2 Level of Drive 1µW Max. Document № Date Page : : : TM-5290 2014/5/15 4 OF 8 4. Mechanical and Environmental Tests Test Name Test Conditions Criteria № 1.Mechanical Tests Drop 3 times from the height of 75 ㎝ onto hard wooden board with thickness of 3 ㎝. 1-1 Shock A 1-2 Vibration Vibration Frequency : 10～500 Hz, 1.5mm, full wave, or acceleration 10G, Cycle : 1.5 minutes, Direction : X.Y.Z. A Time : 2 hours in each direction, for 6 hours in total. 1-3 Lead Pull Weight : 1.0kg , Time : 30±5 seconds. A・C 1-4 Bending Weight : 0.5kg , Bending Angle : 90 degrees, Bending Count : 2 times. (See Fig.1) A・C strength 1-5 Solderability After applying RMA flux, dip in solder. Dipping Time : 5±0.5seconds. Soldering Temperature : 230±5 ℃. D Dipping Depth : 2 mm from the edge of terminals of samples. 1-6 Resistance to Dip in solder. Dipping Time : 10±0.5 seconds. Soldering Heat Soldering Temperature : 260±5 ℃. B Dipping Depth : 2mm from the edge of lead-wires of samples 1-7 Sealing Tightness Leak rate shall be measured by using Helium Leak Detector. E ２．Environmental Tests 2-1 Storage In Expose the sample in an inoperative mode to 240 hours at -40℃. A Low Temperature 2-2 Storage In Expose the sample in an inoperative mode to 240 hours at +85℃. B High Temperature 2-3 Humidity Expose the sample in an inoperative mode to 240 hours at +65℃, and 95%RH. 2-4 Thermal Shock Subject the sample to 5 temperature variation cycles at -40℃ for 30 minutes and +100℃ for the next 30 minutes in each cycle. Criteria Criteria № A B C D E Criteria Any variation between the pre- and post-test frequencies shall remain within ±5ppm. The equivalent series resistance shall remain within its specified tolerance range after the post-test. Any variation between the pre- and post-test frequencies shall remain within ±10ppm. The equivalent series resistance shall remain within its specified tolerance range,after the post-test. After each test, no visible damage, nor the hermetic seal break down. At least 90% of each dipped area shall be covered by fresh solder. -2 B A Tool Load 0.5R 1.5mm Ｆig.1 3 1×10 µPa・m /s Max. ※ Measurements should be taken place at 25±2℃ after each test, the samples shall be left at 25℃ for one to two hours. Document № Date Page : : : TM-5290 2014/5/15 5 OF 8 5． ． Dimensions φ0.26±0.05 φ1.9±0.1 0.7±0.2 （unit:mm） 6±0.2 6.1±0.2 6． ． Marking Standards 22： Manufacture's ID Code Y： The last digit of production year. M： Production month.(See Table 1) Table 1 Month 月 Code　記号 １ １ ****： Ｌｏｔ no. ２ … ２ … ９ １０ １１ １２ 9 Ｘ Ｙ Ｚ Document № Date Page 7． ． Packing (1)Inner Carton 【Bar Code Label Item】 * Customer P/N * Lot.No. * CITIZEN P/N * Ctl No * Date Code * Quantity * Country Code yy : The last 2 digits of shipment year ww : Week Code CN=China 【Inner Carton for 10000pcs】 Bar Code Label (2)Quantity 1000pcs/bag at max. 10000pcs/carton (10 bags) 8. Storage Condition 8.1 Storage Condition 8.2 A period of guarantee Temperature 5～35℃ Humidity 45～75％ Twelve　months : : : TM-5290 2014/5/15 6 OF 8 Document № Date Page : : : TM-5290 2014/5/15 7 OF 8 9． ． Manufacturer MASTER CROWN ELECTRONICS (WUZHOU) LIMITED. No3 BUILDING 137.XINXING ER ROAD, WUZHOU, GUANGXI, CHINA TEL ： +86-774-3863148 Country of Origin ：CHINA * This manufacture is under the control of CITIZEN FINETECH MIYOTA CO.,LTD. 10． ． Ｏzone Depleting Substance　（ 　（ODS） ） 　（ This Product doesn't use the class Ⅰ ODS at any of production processes, and component parts. 11． ． Precautionary Statement 11-1 When dropped by mistake The crystal products are designed and manufactured to resist physical shocks. However,in the event the crystal is subjected to excessive impact such as being dropped onto the floor or giving shocks during mounting. Need to make sure its satisfactory performance before using it. 11-2 Soldering and Mounting (1) Lead wires should be soldered within 3 seconds with the iron heated to a temperature no higher than 380degC. (2) In solder-dip mounting ,it should be within 10 seconds with a temperature no higher than 260degC. And beware not to heat the whole crystal unit in the dip mounting process. Mounting in upright bearing is recommendable (prevent heat conduction directly to the body of a crystal unit.) (Such as by isolating the unit body from the board with a heat insulating member, see Fig.2. ) (3) Soldering on the body of the cylinder type crystal unit must be strictly avoided due to deteriorate the characteristics or damage the products. Rubber adhesive is recommended. (See Fig.-2) 　Fig.-2 Rubber adhesive Heat Insulating Member 断熱材 (4) Heating the whole crystal unit,for example,in a reflow oven may deterioration of the performance. Because the holder is quite small and it is sealed by solder material with press sealing so that such reflow process not allowed to be proceeded. Document № Date Page : : : TM-5290 2014/5/15 8 OF 8 (5) Please (3.0mm recommendation) separate, and bend it as much as possible with a treatment device when it lays in the substrate of the crystal oscillator and it installs it. Please avoid bending it directly from the lead wire root. (6) Please do not shave off the solder plating of the lead wire when you bend the lead wire of the crystal oscillator. (7) Lead forming by hand when you do the following please * Hand with a sealed tube * With fine forceps and bending. 0.5mm position is bending over, bent by hand and if you get into that work, with minimal possible that the 3.0mm hermetically recommended that bend over the place. * 90 degree bend while holding the lead with tweezers. At this time, please note that you do not have enough pull to lead. 11-3 Cleaning (1) Crystal products may be affected and destroyed at worst by ultrasonic cleaning.Please be sure to check if your cleaning process affects any damage to crystal products prior to use. (2) Some kind of cleaning fluid may cause any damage to crystal products . Please be sure to check suitability of the cleaning fluid in advance. 11-4 Storage Storage of Crystal products under higher temperature or high humidity for a long term may affect frequency stability or solderability. Please store the Crystal products under the normal temperature and humidity without exposing to direct sunlight and dew condensation,and avoid the storage of Crystal products for more than 6 months, and mount them as soon as possible after unpacking. 11-5 Replacement If the defect is caused by our company within one year from the delivery time, we provide the replacements with free of charge. ＱＣ工程図 水晶振動子 ＱＣ　Ｃｈａｒｔ CFS-206/CFV-206 Quartz Crystal Unit 2013年11月11日 承認 November-11-2013 Approved 審査 担当 Checked Prepared 水晶部　技術課 Crystal Devices Div.　Production Dept. Product Engineering Section 工程名 Process Name 工程図 Flowchart 1 水晶片 Crystal Element START ▽ 気密端子 Heametically Sealed Base 受入検査 仕様 （水晶片） Specification Acceptance Inspection （Crystal Element） 2 蒸着 Evaporation 1 管理仕様　 Control Specifications 管理項目 管理規格 抜取 Control Item Control Criteria Sampling 納入仕様書 Specifications 湿度 Humidity 真空度 Pressure トータル膜厚 Total Thickness 作業指示書 Manufacturing Process Instruction 3 周波数粗調整 Frequency Rough Tuning 周波数 Frequency 外観 Appearance 作業指示書 Manufacturing Process Instruction 4 受入検査 （気密端子） Acceptance Inspection (Heametically Sealed Base) 5 組立 Assembly 仕様 Specification 納入仕様書 Specifications 外観 Appearance 6 周波数微調整 Fine Tuning 周波数 Frequency 7 アニール (半完成品) Annealing 真空度 Pressure 温度 Temperature 時間 Ｔime 仕様 Specification 作業指示書 Manufacturing Process Instruction 作業指示書 Manufacturing Process Instruction 作業指示書 Manufacturing Process 2 品質受入 検査基準書 Quality Acceptance Inspection Standard － － － 記録 Record 検査表 （水晶片） Inspection Sheets （Crystal Element） 記録紙 Printed Data 稼動表 Operating Sheets 推移グラフ Change Graph ▽ 4 3 5 封止管 Cap 6 ▽ 8 7 9 10 11 8 受入検査 （封止管） Acceptance Inspection (Cap) 納入仕様書 Specifications 9 封止 Sealing 真空度 Pressure 寸法 Dimension 作業指示書 Manufacturing Process 12 10 印刷 Marking 印刷外観 Marking Appearance 作業指示書 Manufacturing Process 13 11 ベーキング Baking 温度 Temperature 時間 Ｔime 作業指示書 Manufacturing Process Instruction 電気的特性 Electrical Characteristics 作業指示書 Manufacturing Process Instruction 出荷判定基準書 Delivery Judgment Standard 14 END 12 電気特性検査 Electrical Characteristics Inspection 13 出荷判定 Delivery Judgment 電気的特性 Electrical Characteristics 14 梱包 Packing 個数 Quantity CITIZEN FINETECH MIYOTA CO.,LTD. 梱包仕様書 Packing Specification 抜取 Sampling 抜取 Sampling チェックシート Check Sheets 送品検査表 Process Inspection Sheets 品質受入 検査表 検査基準書 Inspection Sheets Quality Acceptance Inspection Standard 全数 チェックシート 100% Check sheets 抜取 Sampling 分布図 Distribution Chart チェックシート Check Sheets チェックシート － Check Sheets チェックシート － Check Sheets 品質受入 検査表 検査基準書 Inspection Sheets Quality Acceptance Inspection Standard チェックシート － Check Sheets 抜取 Xbar-R管理図 Sampling Xbar-R Control Chart 抜取 チェックシート Sampling Check Sheets － － － 全数 100% 抜取 Sampling － チェックシート Check Sheets 作業履歴票 Manufacturing Record チェックシート Check Sheets 出荷判定成績表 Delivery Judgment Sheets －