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Document 195-1
Chip Inductors – 0603CS (1608)
Typical Q vs Frequency
D
F
A
70
68 nH
60
J
F
I
120 nH
30
20
10
100
1000
F
G
H
I J
Note: Height dimension (C) is before optional solder application. For maximum
height dimension including solder, add 0.006 in / 0,152 mm.
270 nH
10
Recommended
Land Pattern
Terminal wraparound:
approx 0.007/0,18 both ends
1,80 1,12 1,02 0,38 0,76 0,33 0,86 1,02 0,64 0,64
mm
3.9 nH
50
40
I
0.071 0.044 0.040 0.015 0.030 0.013 0.034 0.040 0.025 0.025 inches
12 nH
33 nH
80
H
Pick and
place
material
G
A B C D
max max max ref E
90
0
C
B
overall
E
terminal
100
Q factor
AEC
Q200 +125°C
Ultra-small size, exceptional Q and high SRFs
make these inductors ideal for high frequency
applications where size is at a premium. They
also have excellent DCR and current carrying
characteristics.
10000
Frequency (MHz)
Typical L vs Frequency
400
Core material Ceramic
Environmental RoHS compliant, halogen free
Terminations RoHS compliant silver-palladium-platinum-glass frit.
Other terminations available at additional cost.
Weight 3.2 – 3.7 mg
Ambient temperature –40°C to +125°C with Irms current
Maximum part temperature +140°C (ambient + temp rise).
Storage temperature Component: –40°C to +140°C.
Tape and reel packaging: –40°C to +80°C
Resistance to soldering heat Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
Temperature Coefficient of Inductance (TCL) +25 to +125 ppm/°C
Moisture Sensitivity Level (MSL) 1 (unlimited floor life at
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