HPX2126LD

Document 489 -1 High Power PoE Signal Path Magnetics • Meets the current requirements of Gigabit PoE Plus. • Open circuit inductance is ≥350 µH with a 22.5 mA dc offset Core material Ferrite Terminations  RoHS Tin-silver-copper over tin over nickel over phos bronze. Other terminations available at additional cost. Weight  HPF2187L: 240 mg; HPX2126L: 3.9 g Ambient temperature  –40°C to +85°C Storage temperature  Component: –40°C to +85°C. Tape and reel packaging: –40°C to +80°C Resistance to soldering heat  Max three 40 second reflows at +260°C, parts cooled to room temperature between cycles Moisture Sensitivity Level (MSL)  1 (unlimited floor life at