MFBM1V3216-101-R

Technical Data 11113 Effective June 2020 MFBM1V3216 Multilayer chip ferrite bead Applications • Industrial connectivity (IoT) • Wireless communications • Bluetooth • WiFi • Antenna • Machine-to-machine (M2M) • Mobile phones Product features • Wearable devices • 1206 (3216 metric) package • Wireless LAN • High current handling • Computing/gaming consoles • Multilayer monolithic construction yields high reliability • Broadband components • Impedance range from 0 Ω to 1000 Ω • RF transceiver modules Environmental compliance and general specifications • Operating temperature range: -40 °C to +85 °C (ambient plus self-temperature rise) HALOGEN Pb HF FREE MFBM1V3216 Multilayer chip ferrite bead  Technical Data 11113 Effective June 2020 Product specifications Impedance tolerance Part number3 Impedance (Ω) DCR (Ω) maximum @ +25 °C Test frequency1 (MHz) Test voltage1 (mV) Rated I2 (mA) maximum MFBM1V3216-000-R 0~15 Ω 0 0.01 100 50 6000 MFBM1V3216-050-R 0~15 Ω 5 0.01 100 50 6000 MFBM1V3216-070-R 0~11 Ω 7 0.01 100 50 6000 MFBM1V3216-090-R 5~13 Ω 9 0.015 100 50 6000 MFBM1V3216-110-R 7~15 Ω 11 0.015 100 50 6000 MFBM1V3216-150-R 9~21 Ω 15 0.015 100 50 6000 MFBM1V3216-190-R 12~25 Ω 19 0.015 100 50 6000 MFBM1V3216-260-R ±25% 26 0.015 100 50 6000 MFBM1V3216-280-R ±25% 28 0.015 100 50 6000 MFBM1V3216-300-R ±25% 30 0.015 100 50 6000 MFBM1V3216-310-R ±25% 31 0.025 100 50 4000 MFBM1V3216-500-R ±25% 50 0.025 100 50 4000 MFBM1V3216-600-R ±25% 60 0.025 100 50 4000 MFBM1V3216-700-R ±25% 70 0.035 100 50 4000 MFBM1V3216-800-R ±25% 80 0.035 100 50 4000 MFBM1V3216-101-R ±25% 100 0.035 100 50 4000 MFBM1V3216-121-R ±25% 120 0.035 100 50 4000 MFBM1V3216-151-R ±25% 150 0.045 100 50 3000 MFBM1V3216-181-R ±25% 180 0.055 100 50 3000 MFBM1V3216-221-R ±25% 220 0.055 100 50 3000 MFBM1V3216-301-R ±25% 300 0.065 100 50 2500 MFBM1V3216-501-R ±25% 500 0.085 100 50 2500 MFBM1V3216-601-R ±25% 600 0.10 100 50 2000 MFBM1V3216-801-R ±25% 800 0.11 100 50 2000 MFBM1V3216-102-R ±25% 1000 0.12 100 50 2000 1. Impedance test frequency and voltage. 2. Rated I: Current rating for an approximate self-temperature rise of 40 °C or less. 3. Part number definition: MFBM1V3216-xxx-R MFBM1V3216 = Product code and size xxx = Impedance value in Ω, last character equals number of zeros -R suffix = RoHS compliant Mechanical parameters, schematic, pad layout (mm) Recommended pad layout Schematic a (2plcs) Part number L W T a F G H MFBM1V3216-xxx-R 3.2 ±0.20 1.6 ±0.20 0.9 ±0.20 0.5 ±0.3 2.00 ref 1.40 ref 1.20 ref Part marking: No marking All soldering surfaces to be coplanar within 0.1 millimeters Tolerances are ±0.1 millimeters unless stated otherwise Pad layout dimensions are reference only Traces or vias underneath the inductor is not recommended 2 www.eaton.com/electronics Technical Data 11113 MFBM1V3216  Multilayer chip ferrite bead Effective June 2020  Packaging information (mm) Drawing not to scale Supplied in tape and reel packaging, 4000 parts per 7” diameter reel W±0.2 8.00 F±0.1 3.50 E1±0.2 1.75 E2 Min na P0±0.2 4.00 P1±0.2 4.00 P2±0.1 2.00 D0±0.1 1.55 A0 1.9±0.2 B0 3.5±0.2 T 0.95±0.1 T1 Max na www.eaton.com/electronics 3 MFBM1V3216 Multilayer chip ferrite bead  Technical Data 11113 Effective June 2020 Qualification testing No. Test item Sample size (pcs) Test condition Acceptable value/range 1 External visual 72 Specification No physical damage 2 Physical dimension 72 Specification Specification 3 Initial electrical test 72 Specification User specification 4 Solderability 6 +245 °C ±5 °C, dipping 5 ±1s >95% solder coverage 5 Resistance to soldering heat 6 +260 ±5 °C for 10 ±1 s 1. ΔZ/Z