CDBA120

CDBA120

  • 厂商:

    COMCHIP(典琦)

  • 封装:

  • 描述:

    CDBA120 - SMD Schottky Barrier Rectifier - Comchip Technology

  • 详情介绍
  • 数据手册
  • 价格&库存
CDBA120 数据手册
SMD Schottky Barrier Rectifier COMCHIP www.comchip.com.tw C DBA120 Thru CDBA1100 R everse Voltage: 20 - 100 Volts Forward Current: 1.0 Amp F eatures DO-214AC (SMA) I deal for surface mount applications Easy pick and place Plastic package has Underwriters Lab. flammability classification 94V-0 Built-in strain relief Low forward voltage drop 0.067(1.70) 0.051(1.29) 0.180(4.57) 0.160(4.06) 0.110(2.79) 0.086(2.18) Mechanical data 0.091(2.31) 0.067(1.70) 0.012(0.31) 0.006(0.15) C ase: JEDEC DO-214AC molded plastic Terminals: solderable per MIL-STD-750, method 2026 Polarity: Color band denotes cathode end Mounting position: Any Approx. weight:0.064 gram 0.059(1.50) 0.035(0.89) 0.209(5.31) 0.185(4.70) 0.008(0.20) 0.004(0.10) Dimensions in inches and (millimeters) Maximum Ratings and Electrical Characterics P arameter Max. Repetitive Peak Reverse Voltage Max. DC Blocking Voltage Max. RMS Voltage Peak Surge Forward Current 8.3ms single half sine-wave superimposed on rate load ( JEDEC method ) Max. Average Forward Current Max. Instantaneous Forward Current at 1.0 A Max. DC Reverse Current at Rated DC Blocking Voltage Ta=25 C Ta=100 C Max. Thermal Resistance (Note 1) R R Operating Junction Temperature Storage Temperature Tj T STG JA JL Symbol V RRM V DC V RMS I FSM CDBA120 CDBA140 CDBA160 CDBA180 CDBA1100 U nit V V V A 20 20 14 40 40 28 60 60 42 80 80 56 100 100 70 35 Io VF IR 10 0.50 1.0 0.70 0.85 A V . mA 0 .5 5 88 C/W 20 -50 to +125 -65 to +150 C C Note 1: Thermal resistance from junction to ambient and junction to to lead P.C.B. Mounted on 0.2 x 0.2 copper pad areas M DS0208007B Page 1 SMD Schottky Barrier Rectifier COMCHIP www.comchip.com.tw Rating and Characteristic Curves (CDBA120 Thru CDBA1100) Fig. 1 - Reverse Characteristics 100 100 F ig.2 - Forward Characteristics CDBA120-140 R everse Current ( mA ) Forward Current ( A ) 10 10 CDBA160 CDBA180-1100 1 1 Tj=75 C 0.1 0.1 Tj=25 C 0.01 0.01 Tj=25 C Pulse width 300uS 4% duty cycle 0 20 40 60 80 100 120 140 160 180 200 0 .1 0.3 0.5 0.7 0.9 1.1 1.3 1.5 1.7 Forward Voltage (V) 1.9 2.1 Percent of Rated Peak Reverse Voltage (%) Fig. 3 - Junction Capacitance 3 50 300 J unction Capacitance (pF) = 1MHz and applied 4VDC reverse voltage Fig. 4 - Current Derating Curve 250 200 150 100 50 0 0.01 0.1 1.0 10 100 Average Forward Current ( A ) 1.2 1.0 CD 0.8 0.6 0.4 0.2 0 20 40 60 80 BA Reverse Voltage (V) Ambient Temperature ( C) CD 100 16 BA 12 014 0 00 11 0 120 140 160 Fig. 5 - Non repetitive forward surge current Peak surge Forward Current ( A ) 50 40 30 8.3mS Single Half Sine Wave JEDEC methode Tj=25 C 20 10 0 1 5 10 50 1 00 N umber of Cycles at 60Hz M DS0208007B Page 2
CDBA120
### 物料型号 - CDBA120至CDBA1100

### 器件简介 这些器件是SMD(表面贴装)肖特基势垒整流器,适用于表面贴装应用,具有低正向电压降、内置的应变缓解等特点。

### 引脚分配 - 极性:通过色带来标识阴极端(Cathode end)

### 参数特性 - 反向电压:20 - 100伏特 - 正向电流:1.0安培 - 最大重复峰值反向电压(VRRM):20V至100V不等 - 最大直流阻断电压(VDc):20V至100V不等 - 最大RMS电压(VRMS):14V至70V不等 - 峰值浪涌正向电流(IFSM):对于CDBA160为35A - 最大平均正向电流(IF):1.0A - 最大瞬时正向电流在1.0A时(VF):0.50V至0.85V不等 - 最大直流反向电流在额定DC Ta=25C时(IR):0.5mA至10mA不等

### 功能详解 这些整流器具有低正向电压降和内置的应变缓解,适合在各种电子电路中进行整流应用,特别是在需要表面贴装技术的场合。

### 应用信息 - 适用于表面贴装应用 - 易于拾取和放置 - 塑料封装具有UL 94V-0的阻燃等级

### 封装信息 - 封装类型:DO-214AC(SMA) - 尺寸:按照JEDEC DO-214AC模塑塑料封装 - 重量:大约0.064克
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