CLD-DS45

C LD-DS45 Rev 1 P roduct family data sheet cree Xlamp XB-d White leds ® ® Product descriPtioN The XLamp XB-D is Cree’s newest lighting class LeD, bringing the next generation of performance and price to LeD lighting applications. The XLamp XB-D delivers similar performance to the XP-G LeD in a package that is 48% smaller than the XLamp XP footprint. Using Cree’s newest generation of silicon carbide-based LeD chips, XB-D is optimized to dramatically lower system cost in any illumination application. features • • • Cree’s smallest lighting class LeD: 2.45 X 2.45 mm Up to 136 lm/W in cool white (@ 85 °C, 350 mA) Available in white, 80-min CRI white, and 70-min CRI cool white • • • • • • • 1 A maximum drive current Low thermal resistance: 6.5 °C/W Wide viewing angle: 115° Reflow solderable - JEDEC J-STD-020C compatible Unlimited floor life at ≤ 30 °C/85% RH electrically neutral thermal path RoHS- and REACH-compliant taBle of coNteNts Flux Characteristics................... 2 Characteristics ......................... 3 Relative Spectral Power Distribution.............................. 3 Relative Flux vs. Junction Temperature (IF = 350 mA)........ 4 electrical Characteristics ............ 4 Thermal Design ........................ 5 Relative Flux vs. Current ........... 5 Relative Chromaticity vs. Temperature and Current........... 6 Typical Spatial Distribution ......... 7 Reflow Soldering Characteristics . 8 Notes ...................................... 9 mechanical Dimensions............ 10 Tape and Reel ........................ 11 Packaging .............................. 12 WWW. CRee.Com/XLAmP Copyright © 2011-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 xlamp xB-D white leDs fluX characteristics (tJ = 85 °c) - White The following table provides several base order codes for XLamp XB-D LeDs. It is important to note that the base order codes listed here are a subset of the total available order codes for the product family. For more order codes, as well as a complete description of the order-code nomenclature, please consult the XLamp XB-D Binning and Labeling document. Base order codes min. luminous flux @ 350 ma (lm) Group R4 Cool White 5,000 K 8,300 K R3 R2 R2 Neutral White 3,700 K 5,000 K Q5 Q4 Q4 80 CRI minimum White 2,600 K 4,300 K Q3 Q2 Q4 Warm White 2,600 K 3,700 K Q3 Q2 flux (lm) 130 122 114 114 107 100 100 93.9 87.4 100 93.9 87.4 color cct range min. max. calculated minimum luminous flux (lm)* 700 ma 227 213 199 199 187 172 172 164 153 172 164 153 1000 ma 287 270 252 252 236 222 222 207 193 222 207 193 order code XBDAWT-00-0000-000000G51 XBDAWT-00-0000-000000F51 XBDAWT-00-0000-000000e51 XBDAWT-00-0000-00000Lee4 XBDAWT-00-0000-00000LDe4 XBDAWT-00-0000-00000LCe4 XBDAWT-00-0000-00000HCE7 XBDAWT-00-0000-00000HBE7 XBDAWT-00-0000-00000HAE7 XBDAWT-00-0000-00000LCe7 XBDAWT-00-0000-00000LBe7 XBDAWT-00-0000-00000LAe7 Notes: • • • • Cree maintains a tolerance of ±7% on flux and power measurements and ±2 on CRI measurements. Typical CRI for Neutral White, 3700 K - 5000K CCT is 75. Typical CRI for Warm White, 2600 K - 3700 K CCT is 80. minimum CRI for 80 CRI minimum White is 80. * Calculated flux values are for reference only Copyright © 2011-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 2 xlamp xB-D white leDs characteristics characteristics Thermal resistance, junction to solder point - white Viewing angle (FWHM) - white Temperature coefficient of voltage - white ESD classification (HBM per Mil-Std-883D) DC forward current - white Reverse voltage Forward voltage (@ 350 mA, 85 °C) - white LeD junction temperature mA v v °C 2.9 unit °C/W degrees mv/°C minimum typical 6.5 115 -2.5 Class 2 1000 -5 3.5 150 maximum Relative Spectral Power relative sPectral PoWer distriButioN 100 Relative Radiant Power (%) 80 60 5000K - 8300K CCT 2600K - 3700K CCT 40 20 0 400 450 500 550 600 650 700 750 Wavelength (nm) Copyright © 2011-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 3 xlamp xB-D white leDs Relative Flux Output vs. Junction Temperature relative fluX vs. JuNctioN temPerature (if = 350 120% ma) Relative Luminous Flux 100% 80% 60% 40% 20% 0% 25 50 75 100 125 150 Junction Temperature (ºC) electrical characteristics (tJ = 85 °c) Electrical Characteristics (Tj = 85ºC) 1200 1000 Forward Current (mA) 800 600 400 200 0 2.70 2.80 2.90 3.00 3.10 3.20 3.30 Forward Voltage (V) Copyright © 2011-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 4 xlamp xB-D white leDs thermal desiGN The maximum forward current is determined by the thermal resistance between the LeD junction and ambient. It is crucial for the end product to be designed in a manner that minimizes the thermal resistance from the solder point to ambient in order to optomize lamp life and optical characteristics. 1200 Thermal Design 1000 Maximum Current (mA) 800 600 400 Rj-a Rj-a Rj-a Rj-a = = = = 10°C/W 15°C/W 20°C/W 25°C/W 200 0 0 20 40 60 80 100 120 140 Relative Intensity vs. Current (Tj = 85ºC) relative fluX vs. curreNt (tJ = 85 °c) 250% Ambient Temperature (ºC) Relative Luminous Flux (%) 200% 150% 100% 50% 0% 0 200 400 600 800 1000 Forward Current (mA) Copyright © 2011-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 5 xlamp xB-D white leDs Relative Chromaticity Vs. Current, WW relative chromaticity vs. curreNt aNd temPerature (Warm White) 0.020 0.015 0.010 0.005 T = 85 °C J 0.000 -0.005 -0.010 ΔCCx ΔCCy -0.015 -0.020 0 100 200 300 400 500 600 Current (mA) 700 800 900 1000 Relative Chromaticity Vs. Temperature WW 0.020 0.015 0.010 0.005 0.000 I = 350 mA F ΔCCx ΔCCy -0.005 -0.010 -0.015 -0.020 0 20 40 60 80 Tsp (°C) 100 120 140 160 Copyright © 2011-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 6 xlamp xB-D white leDs Typical Spatial Radiation Pattern tyPical sPatial distriButioN 120 Relative Luminous Intensity (%) 100 80 60 40 20 0 -90 -70 -50 -30 -10 10 30 50 70 90 Angle (º) Copyright © 2011-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 7 xlamp xB-D white leDs refloW solderiNG characteristics In testing, Cree has found XLamp XB-D LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of solder paste used. Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment. TP Ramp-up tP Critical Zone TL to TP Temperature TL Tsmax Tsmin ts Preheat tS Ramp-down 25 t 25˚C to Peak Time Profile Feature Average Ramp-Up Rate (Tsmax to Tp) Preheat: Temperature min (Tsmin) Preheat: Temperature max (Tsmax) Preheat: Time (tsmin to tsmax) Time maintained Above: Temperature (TL) Time maintained Above: Time (tL) Peak/Classification Temperature (Tp) Time Within 5 °C of Actual Peak Temperature (tp) Ramp-Down Rate Time 25 °C to Peak Temperature lead-Based solder 3 °C/second max. 100 °C 150 °C 60-120 seconds 183 °C 60-150 seconds 215 °C 10-30 seconds 6 °C/second max. 6 minutes max. lead-free solder 3 °C/second max. 150 °C 200 °C 60-180 seconds 217 °C 60-150 seconds 260 °C 20-40 seconds 6 °C/second max. 8 minutes max. Note: All temperatures refer to topside of the package, measured on the package body surface. Copyright © 2011-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 8 xlamp xB-D white leDs Notes Lumen maintenance Projections Please read the XLamp Long-Term Lumen maintenance application note for more details on Cree’s lumen maintenance testing and forecasting. Please read the XLamp Thermal management application note for details on how thermal design, ambient temperature, and drive current affect the LeD junction temperature. moisture Sensitivity In testing, Cree has found XLamp XB-D LEDs to have unlimited floor life in conditions ≤30 ºC/85% relative humidity (RH). Moisture testing included a 168-hour soak at 85 ºC/85% RH followed by 3 reflow cycles, with visual and electrical inspections at each stage. Cree recommends keeping XLamp LeDs in their sealed moisture-barrier packaging until immediately prior to use. Cree also recommends returning any unused LeDs to the resealable moisture-barrier bag and closing the bag immediately after use. RoHS Compliance The levels of environmentally sensitive, persistent biologically toxic (PBT), persistent organic pollutants (PoP), or otherwise restricted materials in this product are below the maximum concentration values (also referred to as the threshold limits) permitted for such substances, or are used in an exempted application, in accordance with eU Directive 2002/95/EC on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS), as amended through April 21, 2006. vision Advisory Claim WARNING: Do not look at exposed lamp in operation. eye injury can result. See LeD eye Safety at www.cree.com/ products/pdf/XLamp_eyeSafety.pdf. Copyright © 2011-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 9 xlamp xB-D white leDs 6 NOTICE CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION CONTAINED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY UNAUTHORIZED PERSON WITHOUTTHE WRITTEN CONSENT OF CREE INC. 5 4 3 REV 2 mechaNical dimeNsioNs All measurements are ±.13 mm unless otherwise indicated. 5 4 3 REV 6 NOTICE CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION CONTAINED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY UNAUTHORIZED PERSON WITHOUTTHE WRITTEN CONSENT OF CREE INC. 2 DESCRIPTION RE D 2.45 1.84 0.355 0.76 0.817 1.633 D 2.45 1.84 0.355 0.76 0.817 1.633 2.45 2.285 2.45 C 2.285 R1.086 C 0.462 0.65 0.65 0.462 R1.086 0.923 0.923 0.36 0.36 B B 0.82 0.46 0.82 0.46 0.426 0.426 0.426 0.426 0.852 0.852 0.36 0.36 2.34 2.34 0.284 0.284 1.136 1.136 2.272 2.272 A 0.28 A 0.36 0.28 0.36 0.284 0.92 0.92 2.34 0.284 0.284 2.272 RECOMMENDED STENCIL PATTERN (HATCHED AREA IS OPENING) UNLESS OTHERWISE SPECIFIED D. CRONIN DIMENSIONS ARE IN UNLESS OTHERWISE CHECK MILLIMETERS AND AFTER FINISH. SPECIFIED DIMENSIONS ARE -TOLERANCE UNLESS SPECIFIED: IN MILLIMETERS.25 AND AFTER FINISH. .XX ± APPROVED .XXX ± TOLERANCE.125 UNLESS SPECIFIED: X° ± .5 ° DRAWN BY DATE 0.284 DRAWN BY DATE 09/19/11 -- DAT 2.34 RECOMMENDED PCB SOLDER PAD RECOMMENDED PCB SOLDER PAD 2.272 D. CRONIN CHECK DATE 09/ TITLE DAT RECOMMENDED STENCIL PATTERN (HATCHED AREA IS OPENING) THIRD ANGLE PROJECTION MATERIAL FOR SHEET METAL PARTS ONLY .125 .XXX ± .X ± X° 1.5 ± .5 ° .XX ± .75 THIRD ANGLE PROJECTION FOR SHEET.25 METAL PARTS PROTECTIVE FINISH ONLY MATERIAL .XXX ± FINAL X° ± .X.5 ° ± 1.5 .XX ± .25 --- APPROVED DAT --- SIZE 1.6 SURFACE FINISH: .XX 6 5 4 3 ± .XXX ± X° ± .75 .25 .5 ° --2 C SCALE 30 2 FINAL PROTECTIVE FINISH SURFACE FINISH: 1.6 6 5 4 3 Copyright © 2011-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 10 xlamp xB-D white leDs taPe aNd reel All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard. All dimensions in mm. 4.0±.1 1.75±.10 8.0±.1 1.5±.1 2.5±.1 Cathode Side +.3 12.0 .0 Anode Side (denoted by + and circle) User Feed Direction END START Trailer 160mm (min) of empty pockets sealed with tape (20 pockets min.) Loaded Pockets (1,000 Lamps) Leader 400mm (min) of empty pockets with at least 100mm sealed by tape (50 empty pockets min.) User Feed Direction Cover Tape Pocket Tape 13mm 7" Copyright © 2011-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 11 xlamp xB-D white leDs Dessicant Desiccant (inside bag) (inside bag) PackaGiNG Humidity Indicator Humidity Indicator Card (inside bag) (inside bag) All dimensions in mm. Vacuum-Sealed Moisture Barrier Bag Moisture Barrier Bag Vacuum-Sealed Vacuum-Sealed Vacuum-Sealed Moisture Barrier Bag Moisture Barrier Bag Label with Cree Bin CREE Bin Code & Barcode Label # Code, Qty, Lot Label with CREE Bin Code Cree Bin & Barcode Label Code, Qty, Lot # Labelwith CustomerBin Label with Cree P/N, Qty, Lot Lot # Code, Qty, #, PO # Label with Cree Bin Label with Customer P/N, Qty, Lot #, PO Code, Qty, Lot# # Patent Label Patent Label Label with Customer Order Code, Qty, Reel ID, PO # Label with Customer Order Code, Qty, Reel ID, PO # Label with Customer Order Code, Qty, Reel ID, PO# Label with Cree Bin Code, Qty, Lot # Copyright © 2011-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 12