MCE4WT-A2-0000-000JE4

C LD-DS16 Rev 7 Product family data sheet cree Xlamp mc-e led ® ® mc-e White mc-e color mc-e dynamic White Product descriPtion The XLamp mC-e LeD is a family of lighting-class, multi-chip LeDs that provides high lumen output in a small package. Compared to discrete LeDs, XLamp mC-e LeDs reduce the distance between LeD die, creating a small optical source for excellent optical control and efficient color mixing. XLamp MC-E LeDs can reduce LeD system complexity by reducing the number of components required. Cree XLamp LeDs bring high performance and quality of light to a wide range of lighting applications, including color-changing lighting, portable and personal lighting, outdoor lighting, indoor directional lighting, and entertainment lighting. features • available in white (2600 K – 10,000 K CCT), easywhite™, Dynamic white, or color (RGBw) • • • aNSI-compatible neutral & warm white chromaticity bins Individually addressable LeDs mC-e Dynamic white LeDs have two cool-white (6,500 K) and two warm-white (2,700 K) LeD die • mC-e easywhite LeDs available in 2 and 4-step bins, up to 85 CRI • • • • maximum drive current: 700 ma per LeD die Reflow solderable – JEDEC J-STD-020 electrically neutral thermal path RoHS and ReaCH-compliant table of contents Flux Characteristics.................... 2 Flux Characteristics, easywhite ... 3 Characteristics Complete package ................. 4 Characteristics per LeD Die (white) ............... 4 Characteristics per LeD Die (Color) ................ 5 Relative Spectral power Distribution - white .................................... 5 Relative Spectral power Distribution - Color ..................................... 5 Relative Flux Output vs Junction Temperature ............................. 6 electrical Characteristics ............. 7 Relative Intensity vs. Current ...... 7 Typical Spatial Radiation pattern .. 8 Reflow Soldering Characteristics .. 9 Notes ......................................10 mechanical Dimensions..............11 Tape and Reel ..........................12 Dry packaging and packaging .....13 www. CRee.Com/XLamp Copyright © 2008-2011 Cree, Inc. all rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USa Tel: +1.919.313.5300 xlamp mC-e leds fluX characteristics, White, dynamic White, color (tJ = 25°c) The following tables provide several base order codes for XLamp mC-e. It is important to note that the base order codes listed here are a subset of the total available order codes for the product family. For more order codes, as well as a complete description of the order-code nomenclature, please consult the XLamp mC-e Binning and Labeling document. base order codes min luminous flux (lm) @ 350 ma* Group K m J K G warm white 2,600 K 3,700 K H J 2 cool-white die dynamic White 2 warm-white die 2 cool-white die 2 warm-white die Red Green Blue color Cool white Red Green Blue Neutral white 620 nm 520 nm 450 nm 5,700 K 620 nm 520 nm 450 nm 3,700 K 6,500 K 2,700 K 6,000 K 2,700 K 630 nm 535 nm 465 nm 7,000 K 630 nm 535 nm 465 nm 4,300 K a4 a5 K G K G flux (lm) 370 430 320 370 240 280 320 100 70 100 70 30.6 67.2 8.2 100 30.6 67.2 8.2 80 mCe4CT-a2-0000-00a4aaaB1 mCe4CT-a2-0000-00a5aaaa1 mCe4wT-a2-0000-000K01 mCe4wT-a2-0000-000m01 MCE4WT-A2-0000-000JE4 mCe4wT-a2-0000-000Ke4 mCe4wT-a2-0000-000Ge7 mCe4wT-a2-0000-000He7 MCE4WT-A2-0000-000JE7 mCeDwT-a1-0000-0000a1001 Part color cct / dominant Wavelength range min. max. 10,000 K order code Cool white 5,000 K White Neutral white 3,700 K 5,000 K mCeDwT-a1-0000-0000a1002 Notes: • • • • Cree maintains a tolerance of ±7% on flux and power measurements and ±2 on CRI measurements. Typical CRI for cool white and neutral white (3,700 K - 10,000 K CCT) is 75. Typical CRI for warm white (2,600 K - 3,700 K CCT) is 80. Flux and chromaticity are measured with each LED die connected to independent drive circuits at 350 mA. The flux and chromaticity of XLamp MC-E White are measured with all LEDs lit simultaneously. The flux and color of each LED in XLamp mC-e Dynamic white and mC-e Color are measured individually. Copyright © 2008-2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 2 xlamp mC-e leds fluX characteristics, easyWhite mc-e leds (tJ = 25°c) The following table provides order codes for XLamp mC-e easywhite LeDs. For a complete description of the order-code nomenclature, please consult the XLamp mC-e Binning and Labeling document. base order codes min luminous flux @ 350 ma, 25° C Group K J J H J H J H K J J H J H J H H G H G flux (lm) 370 320 320 280 320 280 320 280 370 320 320 280 320 280 320 280 280 240 280 240 color cct range 2-step order code chromaticity region 40H mCeeZw-a1-0000-0000K040H MCEEZW-A1-0000-0000J040H MCEEZW-A1-0000-0000J035H mCeeZw-a1-0000-0000H035H MCEEZW-A1-0000-0000J030H mCeeZw-a1-0000-0000H030H MCEEZW-A1-0000-0000J027H mCeeZw-a1-0000-0000H027H mCeeZw-H1-0000-0000K040H MCEEZW-H1-0000-0000J040H MCEEZW-H1-0000-0000J035H mCeeZw-H1-0000-0000H035H MCEEZW-H1-0000-0000J030H mCeeZw-H1-0000-0000H030H MCEEZW-H1-0000-0000J027H mCeeZw-H1-0000-0000H027H mCeeZw-p1-0000-0000H030H mCeeZw-p1-0000-0000G030H mCeeZw-p1-0000-0000H027H mCeeZw-p1-0000-0000G027H 4-step order code chromaticity region 40F mCeeZw-a1-0000-0000K040F MCEEZW-A1-0000-0000J040F MCEEZW-A1-0000-0000J035F mCeeZw-a1-0000-0000H035F MCEEZW-A1-0000-0000J030F mCeeZw-a1-0000-0000H030F MCEEZW-A1-0000-0000J027F mCeeZw-a1-0000-0000H027F mCeeZw-H1-0000-0000K040F MCEEZW-H1-0000-0000J040F MCEEZW-H1-0000-0000J035F mCeeZw-H1-0000-0000H035F MCEEZW-H1-0000-0000J030F mCeeZw-H1-0000-0000H030F MCEEZW-H1-0000-0000J027F mCeeZw-H1-0000-0000H027F mCeeZw-p1-0000-0000H030F mCeeZw-p1-0000-0000G030F mCeeZw-p1-0000-0000H027F mCeeZw-p1-0000-0000G027F 4000 K Standard CRI easywhite 3500 K 35H 35F 3000 K 30H 30F 2700 K 27H 27F 4000 K 40H 40F 80-CRI minimum easywhite 3500 K 35H 35F 3000 K 30H 30F 2700 K 27H 27F 85-CRI minimum easywhite 3000 K 30H 30F 2700 K 27H 27F Notes: • • • • For Standard CRI parts, the typical CRI is 80 for 4000 and 3500 K CCT parts and typical CRI is 82 for 3000 and 2700 K CCT. Cree maintains a tolerance of ±7% on flux and power measurements. Cree maintains a tolerance of ±2 on CRI measurements. Flux and chromaticity are measured with each LeD die connected to independent drive circuits at 350 ma and with all LeDs lit simultaneously. Copyright © 2008-2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 3 xlamp mC-e leds characteristics - comPlete PackaGe The following table lists the product characteristics for the XLamp mC-e LeD package. characteristics Thermal Resistance, junction to solder point - white Thermal Resistance, junction to solder point - color viewing angle (FwHm) - white viewing angle (FwHm) - color ESD Classification (HBM per Mil-Std-883D) LED Junction Temperature °C unit °C/w °C/w degrees degrees minimum typical 3 4 110 115 Class 2 150 maximum characteristics - Per led die (White, easyWhite, dynamic White) The following table lists the product characteristics of each individual LeD die within the XLamp mC-e white LeD package. characteristics Temperature Coefficient of Voltage DC Forward Current Reverse voltage Forward voltage (@ 350 ma) Forward voltage (@ 700 ma) unit mv/°C ma v v v 3.2 3.4 minimum typical -4 700 5 3.9 maximum characteristics - Per led die (color) The following table lists the product characteristics for each LeD die within the XLamp mC-e Color LeD package. characteristics Temperature Coefficient of Voltage DC Forward Current Reverse voltage Forward voltage (@ 350 ma) Forward voltage (@ 700 ma) unit mv/°C ma v v v Typ. max. max. Typ. max. Typ. red -2 700 5 2.1 2.5 2.3 Green -4 700 5 3.4 3.9 3.7 blue -4 700 5 3.2 3.9 3.5 White -4 700 5 3.2 3.9 3.5 Copyright © 2008-2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 4 xlamp mC-e leds relative sPectral PoWer distribution (if = 350 ma Per led) - White The following graph graph represents typical spectral output of the XLamp MC-E White LED with all fouron simultaneously. The following represents typical spectral output of the XLamp mC-e white LeD with all four LeDs LEDs on simultaneously. Relative Spectral Power Distribution (If = 350 mA per LED) - Whit 100 Relative Radiant Power (%) 80 60 5000K - 10000K CCT 3700K - 5000K CCT 40 2600K - 3700K CCT 20 0 400 450 500 550 600 650 700 750 Wavelength (nm) relative sPectral PoWer distribution (if = 350 ma Per led) - color The following graph represents typical spectral output of the XLamp mC-e Color LeD with all four LeDs on simultaneously. The following graph represents typical spectral output of the XLamp MC-E Color LED with all four LEDs on simultaneously. Relative Spectral Power Distribution (If = 350 mA per LED) - Color 100 Relative Radiant Power (%) 80 60 RGBW (6000K) RGBW (4000K) 40 20 0 400 450 500 550 600 650 700 750 Wavelength (nm) Copyright © 2008-2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 5 xlamp mC-e leds relative sPectral PoWer distribution (if = 350 ma Per led) - color (continued) The following graph represents typical spectral output of the XLamp MC-E Color LED with each LED on independently. The following graph represents typical spectral output of the XLamp mC-e Color LeD with each LeD on independently. 100 Relative Radiant Power (%) 80 60 Red Green Blue White (6000K) White (4000K) 40 20 0 400 450 500 550 600 650 700 750 Wavelength (nm) relative fluX outPut vs Junction temPerature (if = 350 ma) The following graph represents typical performance of each LeD die in the XLamp mC-e LeD. 100% 90% Relative Luminous Flux 80% 70% 60% 50% 40% 30% White Red Green Blue 20% 10% 0% 25 50 75 100 125 150 Junction Temperature (ºC) Copyright © 2008-2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 6 xlamp mC-e leds electrical characteristics (tJ = 25˚C) The following graph represents typical performance of each LeD die in the XLamp mC-e LeD. 700 600 Forward Current (mA) 500 400 300 200 White, Blue Red Green 100 0 1.5 2.0 2.5 3.0 3.5 4.0 Forward Voltage (V) J The following graph represents typical performance of each LED die in the XLamp MC-E LED Relative Intensity current (t = 25˚C) = 25ºC) vs. Current (Tj relative intensity vs. 200 The following graph represents typical performance of each LeD die in the XLamp mC-e LeD. Relative Luminous Flux (%) 180 160 140 120 100 White, Blue Red Green 80 60 40 20 0 0 100 200 300 400 500 600 700 Forward Current (mA) Copyright © 2008-2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 7 xlamp mC-e leds tyPical sPatial radiation Pattern The following graph represents typical output of the XLamp mC-e LeD with all four LeDs on simultaneously. 120 Relative Luminous Intensity (%) 100 80 60 White Color 40 20 0 -90 -60 -30 0 30 60 90 Angle (º) Copyright © 2008-2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 8 xlamp mC-e leds refloW solderinG characteristics In testing, Cree has found XLamp MC-E LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of solder paste used. Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment. TP Ramp-up tP Critical Zone TL to TP Temperature TL Tsmax Tsmin ts Preheat tS Ramp-down 25 t 25˚C to Peak Time Profile Feature average Ramp-Up Rate (Tsmax to Tp) preheat: Temperature min (Tsmin) preheat: Temperature max (Tsmax) preheat: Time (tsmin to tsmax) Time maintained above: Temperature (TL) Time maintained above: Time (tL) Peak/Classification Temperature (Tp) Time within 5°C of actual peak Temperature (tp) Ramp-Down Rate Time 25°C to peak Temperature lead-based solder 3°C/second max. 100°C 150°C 60-120 seconds 183°C 60-150 seconds 215°C 10-30 seconds 6°C/second max. 6 minutes max. lead-free solder 3°C/second max. 150°C 200°C 60-180 seconds 217°C 60-150 seconds 260°C 20-40 seconds 6°C/second max 8 minutes max. Note: all temperatures refer to topside of the package, measured on the package body surface. Copyright © 2008-2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 9 xlamp mC-e leds notes moisture sensitivity XLamp mC-e LeDs are shipped in sealed, moisture-barrier bags (mBB) designed for long shelf life. If XLamp mC-e LeDs are exposed to moist environments after opening the mBB packaging but before soldering, damage to the LeD may occur during the soldering operation. The following derating table defines the maximum exposure time (in days) for an XLamp mC-e LeD in the listed humidity and temperature conditions. LeDs with exposure time longer than the time specified below must be baked according to the baking conditions listed here. temperature 30ºC 25ºC 20ºC 30% 9 12 17 maximum Percent relative humidity 40% 5 7 9 50% 4 5 7 60% 3 4 6 70% 1 2 2 80% 1 1 2 90% 1 1 1 baking conditions It is not necessary to bake all XLamp mC-e LeDs. only the LeDs that meet all of the following criteria must be baked: LeDs that have been removed from the original mBB packaging LeDs that have been exposed to a humid environment longer than listed in the moisture Sensitivity section above LeDs that have not been soldered LeDs should be baked at 80ºC for 24 hours. LeDs may be baked on the original reels. Remove LeDs from mBB packaging before baking. Do not bake parts at temperatures higher than 80ºC. This baking operation resets the exposure time as defined in the Moisture Sensitivity section above. storage conditions XLamp mC-e LeDs that have been removed from original mBB packaging but not soldered yet should be stored in a room or cabinet that will maintain an atmosphere of 25 ±5ºC and no greater than 10% RH. For LeDs stored in these conditions, storage time does not add to exposure time as defined in the above Moisture Sensitivity section. rohs compliance The levels of environmentally sensitive, persistent biologically toxic (pBT), persistent organic pollutants (pop), or otherwise restricted materials in this product are below the maximum concentration values (also referred to as the threshold limits) permitted for such substances, or are used in an exempted application, in accordance with eU Directive 2002/95/ eC on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS), as amended through april 21, 2006. vision advisory claim waRNING. Do not look at exposed LeD lamps in operation. eye injury can result. For more information about LeDs and eye safety, please refer to the Cree LeD eye Safety application Note (http://www.cree.com/products/pdf/XLamp_eyeSafety.pdf). Copyright © 2008-2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 10 A B C D E Initial Release Change height due to new lens Change recommended solder pad footprint Height change due to new lens (was 3.86) - Change package height FROM 1.5 TO 1.45 - Add LED reference designators - Delete Series Configuration schematic - Add tabs to recommended PCB footprint 10/16/07 10/23/2007 11/26/2007 12/26/2007 5/12/2008 RC RC RC RC 6 5 4 .80 TYP. 3 4 NOTICE RC CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION CONTAINED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT OF CREE INC. D xlamp mC-e leds mechanical dimensions D 4.48±.20 all measurements are ±.1mm unless otherwise indicated. .05±.05 3 1.45 D3 D4 6 5 4 NOTICE CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION CONTAINED WITHIN ARE THE PROPRIETARY AND CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT OF CREE INC. HEATSINK REV Bottom view C A B C D E 6 ARE THE PROPRIETARY AND ORMATION OF CREE, INC. THIS PLOT IED, REPRODUCED OR DISCLOSED TO ANY T AND THE INFORMATION 00 .10 RSON WITHOUT THE WRITTEN CONSENT ROPRIETARY AND OF CREE, INC. THIS PLOT DUCED OR DISCLOSED TO ANY OUT THE WRITTEN CONSENT 1.50 OTICE BSC L. THIS D PITCH PLOT AND THE INFORMATION 5 6 5 Top view 2.60 4 3 A 2 2 REV A COMMENTS Initial .80 Release REVISIONS Change height due to new lens TYP. 5 4 4.48±.20 1.45 C REVISIO 3 .05±.05 5.40 +.13 .75 -.03 REV A B C D E COMMENTS B DAT C Change recommended solder pad footprint Initial Release 10/16 D due Height change due to new lens (was 3.86) Change height to new lens 10/23/ R3.18 HEATSINK 1.454.48±.20 1.45 NK .05±.05 .05±.05 - Change package height Change recommended solder pad footprint FROM 1.5 TO 1.45 11/26/ - Add LED reference designators E Height change due - Dnew lens (was 3.86) to elete Series Configuration schematic 12/26/ - Add tabs to recommended PCB footprint - Change package height FROM 1.5 TO 1.45 - Add LED reference designators - Delete Series Configuration schematic - Add tabs to recommended PCB footprint 1 2 3 .25 4 4.48±.20 +.13 .75 -.03 .80 TYP. .80 +.2 TYP. 9.0 2 .0 1 1 2 3 4 3 7.50 4 5/12/2 2.60 A +.13 .75 -.03 B Color D3 D2 D1: Red D1 D4 D2: Green D3: Blue D4: white Top view 8 7 6 5 1.50 BSC 7090 C Side view 2.60 2.60 A A 5.40 .25 +.2 1.16 9.0 .0 B R3.18 5.60 +.2 9.0 .0 7.50 7.50 D2 1.00 TYP. D3 D1 D4 D2 D3 D1 D4 R3.18 5.40 5.40 UNLESS OTHERWISE SPECIFIED R.Chaloupecky DIMENSIONS ARE IN MILLIMETERS & BEFORE FINISH. CHECK Ban Loh TOLERANCE UNLESS SPECIFIED: APPROVED .X ± 0.3 .XX ± .13 X° ± 1° DRAWN BY DATE .25 .25 10/16/07 DATE R3.18 3.85 8 7 8 6 7 5 6 5 2.00 1.50 BSC PITCH 7.00 PITCH Dynamic white NEGATIVE (-) 1 D1: Cool white 7.00 .10 D2: warm white D3: Cool white NEGATIVE (-) 2 D4: warm white 7.70 10.02 .10 NEGATIVE (-) 4 8 7 1.50 BSC PITCH 4600 Silicon Drive Durham, N.C 27703 2.84 NEGATIVE (-) 3 6 5.60 TITLE 2.75 A 7090MC PARALLEL / INDEPENDENT CONFIGURATION 1.30 7.00 .10 5 DATE 1.16 MATERIAL 1.00 TYP. SIZE OUTLINE DRAWING, 7090MC PACKAGE FOR SHEET METAL PARTS ONLY B .X ± .25 .XX ± .10 X° ± 2° FINAL PROTECTIVE FINISH SCALE C 20:1 DRAWING NO. 2610-00005 2.00 A REV. 1.50 BSC PITCH NEGATIVE (-) 1 8 D5 D1 1 POSITIVE (+) 1 E 5.60 SHEET 1 OF 1 3.85 2 5.60 TYP. NEGATIVE (-) 1. Tolerances: .10 2 1 7090MC PARALLEL / INDEPENDENT 2. Solder mask windows must be .05 mm bigger D6 CONFIGURATION than PCB Solder Pad. NEGATIVE (-) 1 8 NEGATIVE (-) 2 7 NEGATIVE (-) 3 6 NEGATIVE (-) 4 5 D8 D7 D6 6 D5 7 7090MC PARALLEL / INDEPENDENT RECOMMENDED PCB CONFIGURATION 7 SOLDER PAD D2 2 POSITIVE (+) 2 1.00 TYP. 2.84 NEGATIVE (-) 1 7.70 10.02 8 D1 D5 D1 1 NEGATIVE (-) 3 POSITIVE (+) 1 6 POSITIVE (+) 1 D7 D3 3 POSITIVE (+) 3 1 6 D2 5 D4 4 POSITIVE (+) 4 2.75 2.00 2.00 1.50 BSC PITCH 1.30 2 NEGATIVE (-) 4 POSITIVE (+) 2 5 POSITIVE (+) 2 D8 4 NEGATIVE (-) 2 D2 D6 2 D3 A 2.84 7.70 10.02 3 POSITIVE (+) 3 2.75 5 1.30 1. Tolerances: Recommended.10 pCB Solder pad 2. Solder mask windows must be .05 mm bigger than PCB Solder Pad. 1.30 2.84 7.70 10.02 RECOMMENDED PCB SOLDER PAD (-) 3 NEGATIVE D3 D7 3 D4 POSITIVE (+) 3 4 POSITIVE (+) 4 THIRD ANGLE PROJECTION 5 D8 UNLESS OTHERWISE SPECIFIED R.C DIMENSIONS ARE IN MILLIMETERS & BEFORE FINISH. CHE Ba TOLERANCE UNLESS SPECIFIED: APPR .X ± 0.3 .XX ± .13 X° ± 1° DRA MATE NEGATIVE (-) 4 D4 4 POSITIVE (+) 4 DRAWN BY COMMENDED PCB SOLDER PAD Copyright © 2008-2011 Cree, Inc. All rights reserved. The information in this document is subject to marks of Cree, Inc. 6 5 lerances: .10 DED PCB SOLDER PAD lder mask windows must be .05 mm bigger an PCB Solder Pad. UNLESS OTHERWISE SPECIFIED 10/16/07 R.Chaloupecky DIMENSIONS ARE IN X° ± 2° change without notice. Cree, the Cree logo and XLamp are registered tradeDATE MILLIMETERS & BEFORE FINISH. CHECK DRAWN BY DATE Loh Ban 4 TOLERANCE UNLESS OTHERWISE SPECIFIED UNLESS SPECIFIED: 3 10/16/07 R.Chaloupecky APPROVED DATE DIMENSIONS ARE IN .X ± 0.3 DATE TITLE MILLIMETERS & BEFORE FINISH. ± CHECK .XX .13 Ban Loh TOLERANCE THIRD ANGLE PROJECTION UNLESS SPECIFIED: MATERIAL X° ± 1° APPROVED DATE .X ± 0.3 TITLE .XX ± .13 SHEET METAL PARTS ONLY FOR FOR SHEET METAL PARTS ONLY .X ± .25 .XX ± .10 DATE FINAL 11 O 7 xlamp mC-e leds taPe and reel all measurements in mm. 4.0±.1 1.75±.10 12.0±.1 1.5±.1 5.5±.1 Cathode Side +.3 16.0 .0 Anode Side (denoted by chamfer) User Feed Direction END START Trailer 160mm (min) of empty pockets sealed with tape (13 pockets min.) Loaded Pockets (200 Lamps) Leader 400mm (min) of empty pockets with at least 100mm sealed by tape (34 empty pockets min.) User Feed Direction Cover Tape Pocket Tape 13mm 7" Copyright © 2008-2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 12 xlamp mC-e leds dry PackaGinG and PackaGinG Dessicant Desiccant Dessicant bag) Desiccant bag) (inside (inside (inside bag) (inside bag) Humidity Indicator Indicator HumidityHumiditybag) Indicator Card (inside Humidity Indicator (inside bag) Card (inside bag) (inside bag) Vacuum-Sealed Vacuum-Sealed Vacuum-Sealed Moisture Barrier Bag Vacuum-Sealed Moisture Barrier Bag Moisture Barrier Bag Moisture Barrier Bag Label with Cree Bin CREE Bin Code Label with Cree Bin CREE Bin Code Lot # & Barcode Label Code, Qty, & Barcode Label # Code, Qty, Lot Labelwith CustomerBin Label with Cree Labelwith CustomerBin Label with Lot #, PO # P/N, Qty, Cree Code, Qty, Lot # P/N, Qty, Lot Lot # Code, Qty, #, PO # Patent Label Patent Label Label with Customer Order Label with Customer Order Code, Qty, Reel ID, PO # Code, Qty, Reel ID, PO # Label with Customer Order Code, Qty, Reel ID, PO# Label with Cree Bin Code, Qty, Lot # Copyright © 2008-2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks of Cree, Inc. 13