CT817D(SL)(T3)-H

CT817 Series DC Input 4-Pin Phototransistor Optocoupler Features Description • High isolation 5000 VRMS The CT817 series consists of a photo transistor • CTR flexibility available see order information • DC input with transistor output • External Creepage ≥ 7.5mm (S/SL Type) • External Creepage ≥ 8.0mm (SLM Type) • Operating temperature range - 55 °C to 110 °C Applications • Regulatory Approvals • Switch mode power supplies  UL - UL1577 (E364000) • Computer peripheral interface  VDE - EN60747-5-5(VDE0884-5) • Microprocessor system interface  CQC – GB4943.1, GB8898  IEC60065, IEC60950 optically coupled to a gallium arsenide Infraredemitting diode in a 4-lead DIP package different lead forming options. Package Outline Schematic Note: Different lead forming options available. See package dimension. CT Micro Proprietary & Confidential Page 1 Rev 4 Oct, 2017 CT817 Series DC Input 4-Pin Phototransistor Optocoupler Absolute Maximum Rating at 25oC Symbol Parameters Ratings Units VISO Isolation voltage (AC, 1 minute) 5000 VRMS PTOT Total power dissipation 200 mW TOPR Operating temperature -55 ~ +110 oC TSTG Storage temperature -55 ~ +150 oC TSOL Soldering temperature 260 oC Forward current 60 mA 1 A 6 V Notes Emitter IF IF(TRANS) Peak transient current (≤1μs P.W,300pps) VR Reverse voltage PD Emitter power dissipation 100 mW Detector power dissipation 150 mW BVCEO Collector-Emitter Breakdown Voltage 35 V BVECO Emitter-Collector Breakdown Voltage 6 V Collector Current 50 mA Detector PD IC CT Micro Proprietary & Confidential Page 2 Rev 4 Oct, 2017 CT817 Series DC Input 4-Pin Phototransistor Optocoupler Electrical Characteristics T A = 25°C (unless otherwise specified) Emitter Characteristics Symbol Parameters Test Conditions Min Typ Max Units VF Forward voltage IF=10mA - 1.24 1.4 V IR Reverse Current VR = 6V - - 5 µA Input Capacitance f= 1MHz - 10 30 pF Min Typ Max Units CIN Notes Detector Characteristics Symbol Parameters Test Conditions BVCEO Collector-Emitter Breakdown IC= 100µA 35 - - V BVECO Emitter-Collector Breakdown IE= 100µA 6 - - V Collector-Emitter Dark Current VCE= 20V, IF=0mA - - 100 nA Min Typ Max Units CT817 50 - 600 CT817A 80 - 160 130 - 260 CT817C 200 - 400 CT817D 300 - 600 - 0.1 0.2 V 5x1010 - - Ω - 0.25 1 pF Min Typ Max Units ICEO Notes Transfer Characteristics Symbol Parameters Current Transfer CTR Ratio Test Conditions CT817B Collector-Emitter Saturation VCE(SAT) Voltage IF= 5mA, VCE= 5V IF= 20mA, IC= 1mA RIO Isolation Resistance VIO= 500VDC CIO Isolation Capacitance f= 1MHz Notes % Switching Characteristics Symbol Parameters Test Conditions tr Rise Time IC= 2mA, VCE= 2V - 6 18 tf Fall Time RL= 100Ω - 8 18 CT Micro Proprietary & Confidential Page 3 Notes µs Rev 4 Oct, 2017 CT817 Series DC Input 4-Pin Phototransistor Optocoupler Typical Characteristic Curves CT Micro Proprietary & Confidential Page 4 Rev 4 Oct, 2017 CT817 Series DC Input 4-Pin Phototransistor Optocoupler CT Micro Proprietary & Confidential Page 5 Rev 4 Oct, 2017 CT817 Series DC Input 4-Pin Phototransistor Optocoupler Test Circuit IC Input Pulse RL IF Input Output Output Pulse RIN tr ton tf toff Figure 12: Switching Time Test Circuits CT Micro Proprietary & Confidential Page 6 Rev 4 Oct, 2017 CT817 Series DC Input 4-Pin Phototransistor Optocoupler Package Dimension Dimensions in mm unless otherwise stated Standard DIP – Through Hole Gullwing (400mil) Lead Forming – Through Hole (M Type) CT Micro Proprietary & Confidential Page 7 Rev 4 Oct, 2017 CT817 Series DC Input 4-Pin Phototransistor Optocoupler Surface Mount Lead Forming (S Type) Surface Mount (Low Profile) Lead Forming (SL Type) CT Micro Proprietary & Confidential Page 8 Rev 4 Oct, 2017 CT817 Series DC Input 4-Pin Phototransistor Optocoupler Surface Mount (Gullwing) Lead Forming (SLM Type) CT Micro Proprietary & Confidential Page 9 Rev 4 Oct, 2017 CT817 Series DC Input 4-Pin Phototransistor Optocoupler Recommended Solder Mask Dimensions in mm unless otherwise stated Surface Mount Lead Forming & Surface Mount (Low Profile) Lead Forming Surface Mount (Gullwing) Lead Forming Marking Information CT 817R VYWWK Note: CT 817 V R Y WW K : Denotes “CT Micro” : Part Number : VDE Option : CTR Rank : Fiscal Year : Work Week : Manufacturing Code CT Micro Proprietary & Confidential Page 10 Rev 4 Oct, 2017 CT817 Series DC Input 4-Pin Phototransistor Optocoupler Ordering Information CT817X(V)(Y)(Z)-HG X = Part No. (X=A, B, C, D or None) V = VDE Option ( V or None) Y = Lead form option (S, SL, M, SLM or none) Z = Tape and reel option (T1, T2, T3, T4 or none) H = Lead frame option (H: Iron, None: Copper) G= Material option (G: Green, None: Non-green) Option Description Quantity None Standard 4 Pin Dip 100 Units/Tube M Gullwing (400mil) Lead Forming 100 Units/Tube S(T1) Surface Mount Lead Forming – With Option 1 Taping 1500 Units/Reel S(T2) Surface Mount Lead Forming – With Option 2 Taping 1500 Units/Reel S(T3) Surface Mount Lead Forming – With Option 3 Taping 1000 Units/Reel S(T4) Surface Mount Lead Forming – With Option 4 Taping 1000 Units/Reel SL(T1) Surface Mount (Low Profile) Lead Forming– With Option 1 Taping 1500 Units/Reel SL(T2) Surface Mount (Low Profile) Lead Forming – With Option 2 Taping 1500 Units/Reel SL(T3) Surface Mount (Low Profile) Lead Forming– With Option 3 Taping 1000 Units/Reel SL(T4) Surface Mount (Low Profile) Lead Forming – With Option 4 Taping 1000 Units/Reel SLM(T1) Surface Mount (Gullwing) Lead Forming– With Option 1 Taping 1500 Units/Reel SLM(T2) Surface Mount (Gullwing) Lead Forming – With Option 2 Taping 1500 Units/Reel CT Micro Proprietary & Confidential Page 11 Rev 4 Oct, 2017 CT817 Series DC Input 4-Pin Phototransistor Optocoupler Carrier Tape Specifications Dimensions in mm unless otherwise stated Option S(T1) & SL(T1) Option S(T2) & SL(T2) CT Micro Proprietary & Confidential Page 12 Rev 4 Oct, 2017 CT817 Series DC Input 4-Pin Phototransistor Optocoupler Option S(T3) & SL(T3) Option S(T4) & SL(T4) CT Micro Proprietary & Confidential Page 13 Rev 4 Oct, 2017 CT817 Series DC Input 4-Pin Phototransistor Optocoupler Option SLM(T1) Option SLM(T2) CT Micro Proprietary & Confidential Page 14 Rev 4 Oct, 2017 CT817 Series DC Input 4-Pin Phototransistor Optocoupler Wave soldering (follow the JEDEC standard JESD22-A111) One time soldering is recommended within the condition of temperature. Temperature: 260+0/-5˚C. Time: 10 sec. Preheat temperature:25 to 140˚C. Preheat time: 30 to 80 sec. Iron soldering (follow the standard MIL-STD 202G, Method 210F) Allow single lead soldering in every single process. One time soldering is recommended. Temperature: 350+±10˚C Time: 5 sec max. CT Micro Proprietary & Confidential Page 15 Rev 4 Oct, 2017 CT817 Series DC Input 4-Pin Phototransistor Optocoupler Reflow Profile Profile Feature Pb-Free Assembly Profile Temperature Min. (Tsmin) 150°C Temperature Max. (Tsmax) 200°C Time (ts) from (Tsmin to Tsmax) 60-120 seconds Ramp-up Rate (tL to tP) 3°C/second max. Liquidous Temperature (TL) 217°C Time (tL) Maintained Above (TL) 60 – 150 seconds Peak Body Package Temperature 260°C +0°C / -5°C Time (tP) within 5°C of 260°C 30 seconds Ramp-down Rate (TP to TL) 6°C/second max Time 25°C to Peak Temperature 8 minutes max. CT Micro Proprietary & Confidential Page 16 Rev 4 Oct, 2017 CT817 Series DC Input 4-Pin Phototransistor Optocoupler DISCLAIMER CT MICRO RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. CT MICRO DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. ______________________________________________________________________________________ DISCOLORATION MIGHT OCCUR ON THE PACKAGE SURFACE AFTER SOLDERING, REFLOW OR LONG TERM USE. THIS DOES NOT IMPACT THE PRODUCT PERFORMANCE NOR THE PRODUCT RELIABILITY. CT MICRO ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT EXPRESS WRITTEN APPROVAL OF CT MICRO INTERNATIONAL CORPORATION. 1. Life support devices or systems are devices or 2. A critical component is any component of a life systems which, (a) are intended for surgical support device or system whose failure to perform implant into the body, or (b) support or sustain life, can be reasonably expected to cause the failure of or (c) whose failure to perform when properly used the life support device or system, or to affect its in accordance with instruction for use provided in safety or effectiveness. the labelling, can be reasonably expected to result in significant injury to the user. CT Micro Proprietary & Confidential Page 17 Rev 4 Oct, 2017