CTT0223, CTT1223, CTT2223, CTT3223
600V Random Phase High Power Photo TRIAC
Features
Description
High isolation 5000 VRMS
The random phase power Triac consists of a Triac
Supports 0.3 A, 0.6 A, 0.9 A and 1.2 A
RoHS compliant
REACH compliance
External creepage > 7.5mm
Internal creepage > 6.0mm
Insulation distance > 0.4mm
Regulatory Approvals
Applications
UL - UL1577 (pending approval)
Home appliances
VDE - EN60747-5-5(VDE0884-5)
Industrial equipment
CQC – GB4943.1, GB8898
IEC60065, IEC60950
and a photo-Triac, which is optically coupled to a
gallium arsenide Infrared emitting diode, and house
in a 7-lead DIP package. It also comes with different
lead forming options.
Package Outline
Schematic
Note: Different bending options available. See package
dimension.
CT Micro
Proprietary & Confidential
Page 1
Rev 2
Nov, 2017
CTT0223, CTT1223, CTT2223, CTT3223
600V Random Phase High Power Photo TRIAC
Absolute Maximum Rating at 25oC
Symbol
Parameters
Ratings
Units
Viso
Isolation voltage
5000
Vrms
TOPR
Operating temperature
-40 ~+85
oC
TSTG
Storage temperature
-40 ~+125
oC
Soldering temperature
260
oC
Wave soldering temperature
260
oC
IF
LED forward current
50
mA
VR
LED reverse voltage
6
V
IFP
Peak forward current
1
A
Pin
Power dissipation
75
mW
Repetitive peak OFF-state voltage
600
V
Notes
TSOL
Emitter
Detector
VDRM
IT(RMS)
ITSM
CTT0223
0.3
CTT1223
0.6
CTT2223
0.9
CTT3223
1.2
CTT0223
3
CTT1223
6
CTT2223
9
CTT3223
12
Continuous Current Load
A
Peak Current Load
A
Pout
Power dissipation
800
mW
PT
Total power dissipation
850
mW
CT Micro
Proprietary & Confidential
Page 2
Rev 2
Nov, 2017
CTT0223, CTT1223, CTT2223, CTT3223
600V Random Phase High Power Photo TRIAC
Electrical Characteristics T
A
= 25°C (unless otherwise specified)
Emitter Characteristics
Symbol
Parameters
Test Conditions
Min
Typ
Max
Units
VF
Forward voltage
IF=10mA
-
-
1.3
V
IR
Reverse Current
VR = 6V
-
-
5
µA
Input Capacitance
f= 1MHz
-
45
-
pF
Min
Typ
Max
Units
CIN
Notes
Detector Characteristics
Symbol
Parameters
Test Conditions
IDRM
Peak Blocking Current
IF= 0mA, VDRM= Rated VDRM
-
-
100
uA
VINH
Inhibit Voltage
IF= Rated IFT
-
-
50
V
VTM
Peak On-State Voltage
IF= Rated IFT, ITM= 100mA
-
-
2.5
V
200
-
-
V/µs
Min
Typ
Max
Units
-
-
10
mA
-
-
25
mA
1x1011
-
-
Ω
-
0.25
-
pF
Notes
Critical Rate of Rise off-State
dv/dt
VPEAK= Rated VDRM
Voltage
Transfer Characteristics
Symbol
Parameters
IFT
Input Trigger Current
IH
Holding Current
Test Conditions
Terminal Voltage = 3V
RIO
Isolation Resistance
VIO= 500VDC
CIO
Isolation Capacitance
f= 1MHz
CT Micro
Proprietary & Confidential
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Notes
Rev 2
Nov, 2017
CTT0223, CTT1223, CTT2223, CTT3223
600V Random Phase High Power Photo TRIAC
Typical Characteristic Curves
CT Micro
Proprietary & Confidential
Page 4
Rev 2
Nov, 2017
CTT0223, CTT1223, CTT2223, CTT3223
600V Random Phase High Power Photo TRIAC
CT Micro
Proprietary & Confidential
Page 5
Rev 2
Nov, 2017
CTT0223, CTT1223, CTT2223, CTT3223
600V Random Phase High Power Photo TRIAC
Package Dimension Dimensions in mm unless otherwise stated
Standard DIP – Through Hole
Gullwing (400mil) Lead Forming – Through Hole (M Type)
CT Micro
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Rev 2
Nov, 2017
CTT0223, CTT1223, CTT2223, CTT3223
600V Random Phase High Power Photo TRIAC
Surface Mount Lead Forming (S Type)
Surface Mount (Low Profile) Lead Forming (SL Type)
CT Micro
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Nov, 2017
CTT0223, CTT1223, CTT2223, CTT3223
600V Random Phase High Power Photo TRIAC
Device Marking
CT
T3223
VYWWK
Note:
CT
T3223
: Denotes “CT Micro”
: Product Number
V
Y
WW
K
: VDE Safety Mark (option)
: Fiscal Year
: Work Week
: Production Code
Ordering Information
CTTX223(V)(Y)(Z)
CT
TX223
V
Y
Z
= Denotes “CT Micro”
= Product Number (Current Rating Option X=0, 1, 2, or 3)
= VDE safety mark option (V, or none)
= Lead form option (S, SL, M or none)
= Tape and reel option (T1, T2 or none)
Option
Description
Quantity
None
Standard 8 Pin Dip
40 Units/Tube
M
Gullwing (400mil) Lead Forming
40 Units/Tube
S(T1)
Surface Mount Lead Forming – With Option 1 Taping
1000 Units/Reel
S(T2)
Surface Mount Lead Forming – With Option 2 Taping
1000 Units/Reel
SL(T1)
Surface Mount (Low Profile) Lead Forming– With Option 1 Taping
1000 Units/Reel
SL(T2)
Surface Mount (Low Profile) Lead Forming– With Option 2 Taping
1000 Units/Reel
CT Micro
Proprietary & Confidential
Page 8
Rev 2
Nov, 2017
CTT0223, CTT1223, CTT2223, CTT3223
600V Random Phase High Power Photo TRIAC
Carrier Tape Specifications Dimensions in mm unless otherwise stated
Option S(T1) & SL(T1)
Option S(T2) & SL(T2)
CT Micro
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Rev 2
Nov, 2017
CTT0223, CTT1223, CTT2223, CTT3223
600V Random Phase High Power Photo TRIAC
Wave soldering (JEDEC22A111 compliant)
One time soldering is recommended within the condition of temperature.
Temperature: 260+0/-5˚C.
Time: 10 sec.
Preheat temperature:25 to 140˚C.
Preheat time: 30 to 80 sec.
Hand soldering by soldering iron
Allow single lead soldering in every single process.
One time soldering is recommended. Temperature: 350+0/-5˚C
Time: 3 sec max.
CT Micro
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Rev 2
Nov, 2017
CTT0223, CTT1223, CTT2223, CTT3223
600V Random Phase High Power Photo TRIAC
Reflow Profile
Profile Feature
Pb-Free Assembly Profile
Temperature Min. (Tsmin)
150°C
Temperature Max. (Tsmax)
200°C
Time (ts) from (Tsmin to Tsmax)
60-120 seconds
Ramp-up Rate (tL to tP)
3°C/second max.
Liquidous Temperature (TL)
217°C
Time (tL) Maintained Above (TL)
60 – 150 seconds
Peak Body Package Temperature
260°C +0°C / -5°C
Time (tP) within 5°C of 260°C
30 seconds
Ramp-down Rate (TP to TL)
6°C/second max
Time 25°C to Peak Temperature
8 minutes max.
CT Micro
Proprietary & Confidential
Page 11
Rev 2
Nov, 2017
CTT0223, CTT1223, CTT2223, CTT3223
600V Random Phase High Power Photo TRIAC
DISCLAIMER
CT MICRO RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS
HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. CT MICRO DOES NOT ASSUME ANY LIABILITY
ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
CT MICRO ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR
SYSTEMS WITHOUT EXPRESS WRITTEN APPROVAL OF CT MICRO INTERNATIONAL CORPORATION.
1. Life support devices or systems are devices or
2. A critical component is any component of a life
systems which, (a) are intended for surgical
support device or system whose failure to perform
implant into the body, or (b) support or sustain life,
can be reasonably expected to cause the failure of
or (c) whose failure to perform when properly used
the life support device or system, or to affect its
in accordance with instruction for use provided in
safety or effectiveness.
the labelling, can be reasonably expected to result
in significant injury to the user.
CT Micro
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Page 12
Rev 2
Nov, 2017