BDN12-3CB/A01

CTS ® ADHESIVE PEEL AND STICK HEAT SINKS W±0.01 With pre-applied adhesive, just peel off the release liner and press onto the component ■ Reduces assembly costs; no more messy adhesives or greases required ■ Excellent mechanical bond ■ Thermally optimized pin fin ■ Omnidirectional ■ Adhesive shear strength at 100°C is 36psi (a one inch square heat sink would require a 36lb. force to remove heat sink) ■ Applicable for BGA, PGA, PLCC, and QFP packages ■ L±0.01 P±0.01 G±0.01 H±0.015 T±0.01 SIZE PIN FIN CONFIGURATION PART NUMBER*** (W) BDN09-3CB/A01 0.91 (L) 0.91 FORCED CONVECTION @ 400 LFPM 7x7 26.9 9.6 .10 .132 .128 4x4 24.5 7.7 .083 .072 7x7 26.4 8.0 .555 .10 .111 .114 5x5 20.8 6.3 .355 .09 .076 .072 8x8 20.9 7.2 .605 .10 .119 .128 5x5 18.5 5.7 .355 .09 .060 .081 9x9 19.6 6.8 1.01 1.01 1.11 1.11 1.21 1.21 BDN12-5CB/A01 .555 .10 .105 .114 6x6 16.5 5.2 BDN13-3CB/A01 .355 .09 .074 .081 9x9 16.1 6.0 .555 .10 .125 .114 6x6 14.9 4.7 .355 .09 .067 .081 10x10 16.2 5.6 .605 .10 .128 .128 6x6 13.1 4.2 .355 .09 .062 .081 11x11 15.1 4.5 .555 .10 .118 .114 7x7 11.9 3.8 .355 .09 .072 .081 11x11 13.5 4.5 .605 .10 .119 .128 7x7 10.6 3.5 .355 .09 .065 .072 13x13 11.5 3.8 .355 .09 .072 .072 13x13 10.8 3.5 .605 .10 .128 .114 8x8 8.1 2.8 BDN14-3CB/A01 6 NATURAL CONVECTION** .09 1.31 1.31 BDN13-5CB/A01 1.41 1.41 BDN14-6CB/A01 *Thermal resistance BDN15-3CB/A01 of adhesive tape is included. BDN15-5CB/A01 listed for standard black anodized heat sinks with CTS adhesive tapes. .072 FIN MATRIX .605 BDN12-3CB/A01 ***Part numbers .069 G .355 BDN11-6CB/A01 values based on power density of 3 watts/in2 .09 P BDN10-3CB/A01 BDN11-3CB/A01 **Thermal resistance .355 T BDN09-6CB/A01 BDN10-5CB/A01 NOTES: (H) THERMAL RESISTANCE CASE TO AMBIENT* °C/WATTS BDN16-3CB/A01 1.51 1.61 1.51 1.61 BDN16-6CB/A01 BDN17-3CB/A01 BDN18-3CB/A01 1.71 1.71 1.81 1.81 BDN18-6CB/A01 BDN19-3CB/A01 1.91 1.91 .355 .09 .069 .072 14x14 9.9 2.9 BDN21-3CB/A01 2.11 2.11 .355 .09 .064 .072 16x16 8.5 2.6 All dimensions are in inches.