LA363B5B

LA363B5 Technical METAL CASE, CASE-MOUNTED SEMICONDUCTORS LA363B5 Natural Conv. (°C/W): 11.1 Forced Air (°C/W): 3.9 Mounting Envelope: 1.63" x 1.29" x 1.25" DESCRIPTION OF CURVES A. B. C. D. E. N.C. Horiz. Device Only Mounted to G-10. N.C Horiz. & Vert. With Dissipator. 200 FPM w/Diss. 500 FPM w/Diss. 1000 FPM w/Diss. • • Thermal Resistance Case to Sink is 1.0-1.4 °C/W w/Joint Compound. Derate 0.7 °C/watt for unplated part in natural convection only. Ordering Information Unplated LA363B5U CTS IERC PART NO. Comm'l. Black Mil. Black Anodize Anodize LA363B5CB LA363B5B Semiconductor Accommodated Any TO-3 can Hole patt. ref. no. 3 Max. Weight (Grams) 12.6 HOLE PATTERNS 3. Hole pattern no. 363 accommodates T0-3s or T0-3 ICs. Available in LA-B series heat dissipators only. CTS IERC, Heat Sinks and Thermal Management Solutions 413 North Moss Street, Burbank, California 91502 Tel: (818) 842-7277 Fax: (818) 848-8872 Rev. 03-04-03