LAD66A1U

Series LA-A1 Technical METAL CASE, CASE-MOUNTED SEMICONDUCTORS Part Number Series LA-A1 Natural Conv. (°C/W): 28.9 Forced Air (°C/W): 8.1 Mounting Envelope: 1.31" x .90" x .25" DESCRIPTION OF CURVES A. B. C. D. E. N.C. Horiz. Device Only Mounted to G-10. N.C Horiz. & Vert. With Dissipator. 200 FPM w/Diss. 500 FPM w/Diss. 1000 FPM w/Diss. • • • Thermal Resistance Case to Sink is 0.5-0.7 °C/W w/Joint Compound. Derate 0.3 °C/watt for unplated part in natural convection only. Derate 0.8 °C/watt for Insulubeâ part in natural convection only. Ordering Information Unplated LA000A1U LAD66A1U LAIC66A1U CTS IERC PART NO. Comm'l. Black Mil. Black Anodize Anodize LA000A1CB LA000A1B LAD66A1CB LAD66A1B LAIC66A1CB LAIC66A1B Semiconductor Accommodated Undrilled TO-66 TO-66IC Hole patt. ref. no. Max. Weight (Grams) 3.1 3.1 3.1 -1 (see below) 7 (see below) HOLE PATTERNS 1. Hole Pattern no. 248 accommodates TO-66s. Available in LA- 7. Hole pattern no. 191 accommodates To-66 Ics. Available in A, LA-B and LB series heat dissipators only. LA-A, LA-B, and LB series heat dissipators only. CTS IERC, Heat Sinks and Thermal Management Solutions 413 North Moss Street, Burbank, California 91502 Tel: (818) 842-7277 Fax: (818) 848-8872 Rev. 08-29-03